Patents by Inventor Tatsuya Yoshizawa
Tatsuya Yoshizawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240087433Abstract: A lighting system includes a plurality of lighting devices and a control device. The plurality of lighting devices are installed in a facility. The control device controls the plurality of lighting devices. The control device controls lighting light projected by at least one lighting device, belonging to the plurality of lighting devices, into colored lighting light, of which a color is different from a color white, to give, upon acquiring information about an event in question, a sign depending on the event in question.Type: ApplicationFiled: January 22, 2022Publication date: March 14, 2024Inventors: Takanori AKETA, Kenichiro TANAKA, Jin YOSHIZAWA, Shingo NAGATOMO, Kazuki KITAMURA, Tatsuya TAKAHASHI, Tatsuo KOGA, Tomonori YAMADA, Kazuto URA
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Patent number: 9972473Abstract: In an envelope rotation type X-ray tube apparatus, a cathode releases electrons, and the electrons released from the cathode are deflected by deflection coils. A target generates X-rays by being bombarded with the electrons deflected by the deflection coils. Here, a shield ring, while allowing passage through a ring interior of those of the electrons deflected by the deflection coils that head for an area of the target set beforehand, blocks electrons heading outward of the area. Consequently, the electrons are inhibited from bombarding on areas of the target outward of the area and an envelope. This can prevent damage to the envelope.Type: GrantFiled: December 3, 2013Date of Patent: May 15, 2018Assignee: SHIMADZU CORPORATIONInventor: Tatsuya Yoshizawa
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Publication number: 20150380201Abstract: In an envelope rotation type X-ray tube apparatus, a cathode releases electrons, and the electrons released from the cathode are deflected by deflection coils. A target generates X-rays by being bombarded with the electrons deflected by the deflection coils. Here, a shield ring, while allowing passage through a ring interior of those of the electrons deflected by the deflection coils that head for an area of the target set beforehand, blocks electrons heading outward of the area. Consequently, the electrons are inhibited from bombarding on areas of the target outward of the area-F and an envelope. This can prevent damage to the envelope.Type: ApplicationFiled: December 3, 2013Publication date: December 31, 2015Inventor: Tatsuya YOSHIZAWA
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Patent number: 9202663Abstract: A flat filament includes a first electron emission surface, a first current supply leg, a second current supply leg, a second electron emission surface disposed laterally of the first electron emission surface and connected to a first end region of the first electron emission surface, a third current supply leg, a third electron emission surface disposed laterally of the first electron emission surface, opposite from the second electron emission surface, and connected to a second end region of the first electron emission surface, and a fourth current supply leg.Type: GrantFiled: December 5, 2012Date of Patent: December 1, 2015Assignee: SHIMADZU CORPORATIONInventor: Tatsuya Yoshizawa
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Publication number: 20140153698Abstract: A flat filament includes a first electron emission surface, a first current supply leg, a second current supply leg, a second electron emission surface disposed laterally of the first electron emission surface and connected to a first end region of the first electron emission surface, a third current supply leg, a third electron emission surface disposed laterally of the first electron emission surface, opposite from the second electron emission surface, and connected to a second end region of the first electron emission surface, and a fourth current supply leg.Type: ApplicationFiled: December 5, 2012Publication date: June 5, 2014Applicant: SHIMADZU CORPORATIONInventor: Tatsuya YOSHIZAWA
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Patent number: 8114685Abstract: A method is provided, of manufacturing a material to be etched that can more preferably prevent a region to be etched from remaining as an un-etched region and reduce deviation of etched/un-etched regions. Patterning (a method of manufacturing a material to be etched) of a substrate 100, which is manufactured by performing etching through an opened region 10 by an etching mask M1, is performed by a first etching process and a second etching process that is performed after the first etching process. The second etching process is a process for etching a region including a region that is not etched by the first etching process. An un-etched region, which is the same as etched using a virtual etching mask M1?, is formed on the surface of an object to be etched by the first and second etching processes.Type: GrantFiled: August 25, 2006Date of Patent: February 14, 2012Assignee: Pioneer CorporationInventors: Tatsuya Yoshizawa, Kenichi Nagayama, Takuya Hatakeyama
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Publication number: 20110095677Abstract: To attain not only reforming of a film moistureproof substrate but also inhibiting of penetration of moisture or water transportation from edge portions thereof. [MEANS FOR SOLVING PROBLEMS] Film moistureproof substrate (7) is fixed to base plane (3a) of frame body (3) with adhesion. The film moistureproof substrate (7) at its edge portions is covered with a moistureproof fixing member, so that when the film moistureproof substrate (7) is fixed to the frame body (3), the thin-film organic electroluminescence element built in the film moistureproof substrate (7) can be freed from influences of moisture and water.Type: ApplicationFiled: August 10, 2007Publication date: April 28, 2011Applicant: PIONEER CORPORATIONInventors: Tatsuya Yoshizawa, Isamu Ohshita
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Patent number: 7776645Abstract: An organic semiconductor device in which an organic semiconductor layer is easily formed into a pattern, and a method of manufacturing same. On a substrate, a first structural portion including a first electrode, an organic semiconductor layer made of an organic compound having a semiconductor property, and a second structural portion having a second electrode are provided in order. The second structural portion is formed in a prescribed pattern. The second structural portion includes a mask portion having an etching-resistant property, and etching of the organic semiconductor layer is performed while using the mask portion as a mask. The mask portion may be the second electrode.Type: GrantFiled: June 2, 2004Date of Patent: August 17, 2010Assignee: Pioneer CorporationInventors: Kenichi Nagayama, Tatsuya Yoshizawa, Masahiro Shiratori
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Publication number: 20100187516Abstract: An organic semiconductor device of preventing invasion of hydrogen or hydrogen ion into the device and having a long-term reliability, and a method of manufacturing thereof are provided by giving a hydrogen absorbing layer which absorbs hydrogen or hydrogen ion, and which does not release the absorbed hydrogen or hydrogen ion. The organic semiconductor device comprises at least a substrate 10, a first electrodell, an organic functional component 12, a second layer 13, and a hydrogen absorbing layer 14 which absorbs hydrogen or hydrogen ion, and which does not release the absorbed hydrogen or hydrogen ion.Type: ApplicationFiled: June 29, 2007Publication date: July 29, 2010Applicant: PIONEER CORPORATIONInventors: Tatsuya Yoshizawa, Takuya Hatakeyama, Yohei Tanaka
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Publication number: 20100087032Abstract: A main subject is to provide a novel method for patterning of organic film which is suitable for manufacturing various organic devices. In a method for patterning of an organic film formed at a prescribed region, an organic covering layer forming step where an organic covering layer which includes a metal complex is formed on the organic film at a portion which corresponds to a portion where the organic film should be remained after patterning, and a plasma etching step where the organic film which is located at the portion of being not covered with the organic covering layer is etched out by irradiating the organic film with a plasma from above the organic covering layer after the organic covering layer forming step, are included.Type: ApplicationFiled: March 13, 2007Publication date: April 8, 2010Applicant: PIONEER CORPORATIONInventors: Tatsuya Yoshizawa, Takuya Hatakeyama, Kenichi Nagayama
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Publication number: 20090252863Abstract: There is provided is a method of manufacturing a protection film or a method of manufacturing an inorganic film, wherein density of the inorganic film is sufficient. In the method of manufacturing a barrier film 12 and a sealing film 20 as protection films for protecting an organic EL element 100 and an organic TFT 50, a pre-oxidized inorganic film 120, being not completely oxidized, is formed and the oxidized inorganic film 120 thus formed is oxidized to thereby form a part of the protection film.Type: ApplicationFiled: July 3, 2006Publication date: October 8, 2009Applicant: PIONEER CORPORATIONInventor: Tatsuya Yoshizawa
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Publication number: 20090197353Abstract: A method is provided, of manufacturing a material to be etched that can more preferably prevent a region to be etched from remaining as an un-etched region and reduce deviation of etched/un-etched regions. Patterning (a method of manufacturing a material to be etched) of a substrate 100, which is manufactured by performing etching through an opened region 10 by an etching mask M1, is performed by a first etching process and a second etching process that is performed after the first etching process. The second etching process is a process for etching a region including a region that is not etched by the first etching process. An un-etched region, which is the same as etched using a virtual etching mask M1?, is formed on the surface of an object to be etched by the first and second etching processes.Type: ApplicationFiled: August 25, 2006Publication date: August 6, 2009Applicant: PIONEER CORPORATIONInventors: Tatsuya Yoshizawa, Kenichi Nagayama, Takuya Hatakeyama
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Patent number: 7355341Abstract: An organic electroluminescence display panel includes an organic electroluminescence element and a resin substrate that supports the organic electroluminescence element. A gas barrier laminate is formed between the resin substrate and the organic electroluminescence element. The gas barrier laminate includes two or more inorganic barrier layers and one or more polymer compound layers each provided between the inorganic barrier layers. The exposed parts of the polymer compound layer that are not covered by the inorganic barrier layers are subjected to plasma processing. The exposed parts may be covered by a cover layer or a sealing layer that affords gas barrier properties.Type: GrantFiled: October 14, 2004Date of Patent: April 8, 2008Assignee: Pioneer CorporationInventor: Tatsuya Yoshizawa
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Publication number: 20060246620Abstract: An organic semiconductor device in which an organic semiconductor layer is easily formed into a pattern, and a method of manufacturing same. On a substrate, a first structural portion including a first electrode, an organic semiconductor layer made of an organic compound having a semiconductor property, and a second structural portion having a second electrode are provided in order. The second structural portion is formed in a prescribed pattern. The second structural portion includes a mask portion having an etching-resistant property, and etching of the organic semiconductor layer is performed while using the mask portion as a mask. The mask portion may be the second electrode.Type: ApplicationFiled: June 2, 2004Publication date: November 2, 2006Inventors: Kenichi Nagayama, Tatsuya Yoshizawa, Masahiro Shiratori
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Publication number: 20050238818Abstract: A plasma processing method and a plasma processing apparatus. The plasma processing method includes: a placing process for placing the electrode material layer between a pair of electrodes formed in a vacuum chamber; a gas supply process for supplying a plasma processing gas into the vacuum chamber; and a electric field setting process for applying a main AC voltage superimposed on a reference voltage to one of the pair of electrodes via a capacitor and for keeping the other electrode at the reference potential. The placing process includes a process for locating the electrode material layer to be closer to the other electrode than to the one electrode. Moreover, the electric field setting process may include a process for applying an additional AC voltage having a lower frequency than a frequency of the main AC voltage between the other electrode and the reference potential.Type: ApplicationFiled: January 12, 2005Publication date: October 27, 2005Inventor: Tatsuya Yoshizawa
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Publication number: 20050156519Abstract: An organic electroluminescent display panel includes one or more organic electroluminescent devices comprising a first display electrode, one or more organic functional layers, which comprise a light-emitting layer comprising an organic compound, and a second display electrode, which are each layered in sequence. The display panel includes a support substrate, which carries the organic electroluminescent devices, and which comprises a resin material on the surface of the side facing the organic electroluminescent devices. The display panel includes an inorganic barrier film for covering the surface of the support substrate at least between the organic electroluminescent devices and the support substrate. The display panel includes a resin-contained film and a sealing region which covers an end face of the resin-contained film.Type: ApplicationFiled: March 19, 2003Publication date: July 21, 2005Inventors: Tatsuya Yoshizawa, Toshiyuki Miyadera
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Publication number: 20050116637Abstract: An organic electroluminescence display panel includes an organic electroluminescence element and a resin substrate that supports the organic electroluminescence element. A gas barrier laminate is formed between the resin substrate and the organic electroluminescence element. The gas barrier laminate includes two or more inorganic barrier layers and one or more polymer compound layers each provided between the inorganic barrier layers. The exposed parts of the polymer compound layer that are not covered by the inorganic barrier layers are subjected to plasma processing. The exposed parts may be covered by a cover layer or a sealing layer that affords gas barrier properties.Type: ApplicationFiled: October 14, 2004Publication date: June 2, 2005Applicant: Pioneer CorporationInventor: Tatsuya Yoshizawa
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Publication number: 20050109732Abstract: A method for manufacturing an organic electroluminescent element whose emission property is stable for a long time and a manufacturing apparatus using the method. The organic EL element manufacturing method includes an anode layer formation process for forming an anode layer on a substrate, an organic functional layer formation process for forming an organic functional layer having at least a light emission layer on the anode layer, a cathode layer formation process for forming a cathode layer on the organic functional layer, and a sealing process for sealing an organic electroluminescence element formed of the anode layer, the organic functional layer, and the cathode layer with a sealing member.Type: ApplicationFiled: November 23, 2004Publication date: May 26, 2005Inventor: Tatsuya Yoshizawa
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Publication number: 20050000933Abstract: An etching mask includes a pass-through aperture for exposing only a surface to be etched, a protruding periphery portion that protrudes at the periphery of the pass-through aperture, and a recessed portion enclosed by the protruding periphery portion.Type: ApplicationFiled: February 13, 2004Publication date: January 6, 2005Inventors: Masahiro Shiratori, Kenichi Nagayama, Tatsuya Yoshizawa
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Publication number: 20030211233Abstract: An electrode-equipped substrate includes a substrate portion of synthetic resin and a transparent electrode. The electrode-equipped substrate is subjected to heat treatment at a temperature of 200° C. or less as well as plasma treatment before organic layers are deposited. The plasma treatment is carried out within atmosphere of (A) a mixed gas of oxygen and any one of nitrogen, argon, helium, neon and xenon, with an oxygen density of 5% or less; (B) a mixed gas of oxygen and any one of carbon tetrafluoride, hexafluoroethane, octafluoropropane and octafluorocyclobutane; or (C) a sole gas of nitrogen, argon, helium, neon, xenon, carbon monoxide, carbon dioxide, nitrogen monoxide or nitrous oxide.Type: ApplicationFiled: March 6, 2003Publication date: November 13, 2003Applicant: PIONEER CORPORATIONInventors: Hirofumi Kubota, Tatsuya Yoshizawa, Takako Miyake