Patents by Inventor Tatyana F. Grigoriva

Tatyana F. Grigoriva has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods of bonding targets to backing plate members using gallium based solder pastes and target/backing plate assemblies bonded thereby
    Patent number: 5653856
    Abstract: Methods of solder bonding sputter targets to backing plate members and solder bonded target/backing plate assemblies are disclosed wherein a gallium containing solder paste is used to bond adjoining target and backing plate surfaces. This paste comprises a gallium or gallium alloy liquid component and a finely divided solid solution component comprising at least one metal from groups IB, VIII, and IVB of the periodic chart and at least one metal from groups IVA, IIIA and VA of the periodic chart. The solder paste is applied to the surfaces to be soldered and is allowed to solidify. A durable solder bond is formed that is capable of withstanding high temperatures on the order of about 500.degree. C. without failure.
    Type: Grant
    Filed: July 19, 1996
    Date of Patent: August 5, 1997
    Assignee: Tosoh SMD, Inc.
    Inventors: Eugene Y. Ivanov, Tatyana F. Grigoriva, Vladimir V. Boldyrev
  • Methods of bonding targets to backing plate members using solder pastes and target/backing plate assemblies bonded thereby
    Patent number: 5593082
    Abstract: Methods of solder bonding sputter targets to backing plate members and solder bonded target/backing plate assemblies are available wherein a solder paste is used to bond adjoining target and backing plate surfaces. This paste comprises a low melting point metal component having a melting point of about 70.degree. C. or less and a finely divided solid solution component comprising at least one metal from groups IB, VIII, and IVB of the periodic chart and at least one metal from groups IVA, IIIA and VA of the periodic chart. The solder paste is applied to the surfaces to be soldered and is allowed to solidify. A durable solder bond is formed that is capable of withstanding high temperatures on the order of about 500.degree. C. without failure.
    Type: Grant
    Filed: November 15, 1994
    Date of Patent: January 14, 1997
    Assignee: Tosoh SMD, Inc.
    Inventors: Eugene Y. Ivanov, Tatyana F. Grigoriva, Vladimir V. Boldyrev
  • Methods and structural combinations providing for backing plate reuse in sputter target/backing plate assemblies
    Patent number: 5522535
    Abstract: Methods for facilitating recycling of backing plates in bonded target/backing plate assemblies and structural assemblies for use in these methods are disclosed. The target and backing plate are joined by a solder paste material that may be applied to adjoining surfaces of the target and backing plate at low temperature. The paste solidifies to have a high decomposition temperature on the order of greater than 400.degree. C. Provision of a solder layer having a liquidus temperature of about 100.degree.-250.degree. C. between the backing plate and solder paste allows for easy target and backing plate separation and subsequent backing plate reusage.
    Type: Grant
    Filed: November 15, 1994
    Date of Patent: June 4, 1996
    Assignee: Tosoh SMD, Inc.
    Inventors: Eugene Y. Ivanov, Tatyana F. Grigoriva, Vladimir V. Boldyrev