Patents by Inventor Tay Gek-Teng

Tay Gek-Teng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Buttoned soldering pad for use with fine-pitch hot bar soldering
    Patent number: 9900982
    Abstract: A method of soldering can include: providing a first electronic component having a first buttoned soldering pad including a first soldering pad and one or more first button heads protruding from a first surface of the soldering pad; providing a second electronic component having a soldering pad; and soldering the first buttoned soldering pad to the soldering pad. The method includes introducing solder to spaces around the one or more first buttons of the first buttoned soldering pad. The method includes introducing a first solder to spaces around the one or more first buttons of the first buttoned soldering pad; introducing a second solder to spaces around one or more second buttons of a second buttoned soldering pad of the first electronic component; and forming spaces between the first and second solder that electronically insulate the first solder from the second solder.
    Type: Grant
    Filed: November 12, 2014
    Date of Patent: February 20, 2018
    Assignee: Finisar Corporation
    Inventors: Henry Nguyen, Yuxin Zhou, Tay Gek-Teng
  • BUTTONED SOLDERING PAD FOR USE WITH FINE-PITCH HOT BAR SOLDERING
    Publication number: 20150138742
    Abstract: A method of soldering can include: providing a first electronic component having a first buttoned soldering pad including a first soldering pad and one or more first button heads protruding from a first surface of the soldering pad; providing a second electronic component having a soldering pad; and soldering the first buttoned soldering pad to the soldering pad. The method includes introducing solder to spaces around the one or more first buttons of the first buttoned soldering pad. The method includes introducing a first solder to spaces around the one or more first buttons of the first buttoned soldering pad; introducing a second solder to spaces around one or more second buttons of a second buttoned soldering pad of the first electronic component; and forming spaces between the first and second solder that electronically insulate the first solder from the second solder.
    Type: Application
    Filed: November 12, 2014
    Publication date: May 21, 2015
    Inventors: Henry Nguyen, Yuxin Zhou, Tay Gek-Teng