Patents by Inventor Te-Chuan Wang
Te-Chuan Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240155185Abstract: A channel hiatus correction method for an HDMI device is provided. A recovery code from scrambled data of the stream is obtained. A liner feedback shift register (LFSR) value of channels of the HDMI port is obtained based on the recovery code and the scrambled data of the stream. The stream is de-scrambled according to the LFSR value of the channels of the HDMI port. Video data is displayed according to the de-scrambled stream.Type: ApplicationFiled: November 9, 2022Publication date: May 9, 2024Inventors: Chia-Hao CHANG, You-Tsai JENG, Kai-Wen YEH, Yi-Cheng CHEN, Te-Chuan WANG, Kai-Wen CHENG, Chin-Lung LIN, Tai-Lai TUNG, Ko-Yin LAI
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Patent number: 11962847Abstract: A channel hiatus correction method for an HDMI device is provided. A recovery code from scrambled data of the stream is obtained. A liner feedback shift register (LFSR) value of channels of the HDMI port is obtained based on the recovery code and the scrambled data of the stream. The stream is de-scrambled according to the LFSR value of the channels of the HDMI port. Video data is displayed according to the de-scrambled stream.Type: GrantFiled: November 9, 2022Date of Patent: April 16, 2024Assignee: MEDIATEK INC.Inventors: Chia-Hao Chang, You-Tsai Jeng, Kai-Wen Yeh, Yi-Cheng Chen, Te-Chuan Wang, Kai-Wen Cheng, Chin-Lung Lin, Tai-Lai Tung, Ko-Yin Lai
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Patent number: 11864341Abstract: A sunshield to protect an equipment housing from solar heat and allow cooling from external air flow is disclosed. The sunshield includes a main plate configured to be positioned to cover a side of the equipment housing. A vent in the main plate allows air flow through the main plate to the equipment housing. A shutter is rotatable between an open position allowing air flow through the vent, and a closed position blocking air flow through the vent. A biasing mechanism provides force to bias the shutter in the closed position. The force is overcome by a predetermined level of external air flow on the shutter to rotate the shutter to the open position.Type: GrantFiled: June 22, 2022Date of Patent: January 2, 2024Assignee: QUANTA COMPUTER INC.Inventors: Yi-Chieh Chen, Yueh-Chang Wu, Te-Chuan Wang, Wei-Ju Chen
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Publication number: 20230422426Abstract: A sunshield to protect an equipment housing from solar heat and allow cooling from external air flow is disclosed. The sunshield includes a main plate configured to be positioned to cover a side of the equipment housing. A vent in the main plate allows air flow through the main plate to the equipment housing. A shutter is rotatable between an open position allowing air flow through the vent, and a closed position blocking air flow through the vent. A biasing mechanism provides force to bias the shutter in the closed position. The force is overcome by a predetermined level of external air flow on the shutter to rotate the shutter to the open position.Type: ApplicationFiled: June 22, 2022Publication date: December 28, 2023Inventors: Yi-Chieh CHEN, Yueh-Chang WU, Te-Chuan WANG, Wei-Ju CHEN
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Publication number: 20230345669Abstract: A heat transmissive chassis for a fan-less equipment component such as a 5G component is disclosed. The chassis includes a heat sink section having an interior surface and an exterior surface. The interior surface is configured for contact with a heat-generating electronic device. A lateral hollow compartment is located near the interior surface. A coolant is contained in the hollow compartment.Type: ApplicationFiled: April 20, 2022Publication date: October 26, 2023Inventors: Yi-Chieh CHEN, Yueh-Chang WU, Te-Chuan WANG, Po-Kai TSENG
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Patent number: 11770583Abstract: A power-saving method for an HDMI device is provided. The method includes detecting color depth information of video data from an HDMI source which is connected to the HDMI port, deriving a horizontal length for each line by fragment of a picture frame according to the color depth information, generating a plurality of synchronization signals according to the horizontal length for each line by fragment, and powering on the HDMI port, according to the synchronization signals, for a predetermined time period to obtain encrypted information from the HDMI source, and powering off the HDMI port after the predetermined time period.Type: GrantFiled: July 21, 2022Date of Patent: September 26, 2023Assignee: MEDIATEK INC.Inventors: You-Tsai Jeng, Chia-Hao Chang, Yi-Cheng Chen, Kai-Wen Yeh, Kuo-Chang Cheng, Chi-Chih Chen, Szu-Hsiang Lai, Chin-Lung Lin, Kai-Wen Cheng, Te-Chuan Wang, Ko-Yin Lai, Keng-Lon Lei, Tai-Lai Tung
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Patent number: 11755084Abstract: A cooling system for a rack of servers includes a plurality of cooling circuits, where each cooling circuit is coupled to a server of the rack. Each cooling circuit includes a plurality of cooling modules arranged in parallel. Each cooling module includes a cold plate having a cooling conduit passing therethrough, and a pump fluidly coupled to the cooling conduit. The cooling circuit further includes one or more valves fluidly interconnecting the plurality of cooling modules. Each of the one or more valves, when turned on, fluidly connects the cooling conduits of any two adjacent cooling modules. The cooling system further includes a first cooling distribution manifold fluidly connected to the cooling circuit of each of the plurality of servers through an inlet pipe, and a second cooling distribution manifold fluidly connected to the cooling circuit of each of the plurality of servers through an outlet pipe.Type: GrantFiled: July 20, 2021Date of Patent: September 12, 2023Assignee: QUANTA COMPUTER INC.Inventors: Yi-Chieh Chen, Yueh-Chang Wu, Te-Chuan Wang, Tzu-Hsuan Hsu
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Patent number: 11622471Abstract: A cooling device for a computing system is disclosed. The cooling device includes an inlet conduit, a first cold plate, a connecting conduit, a second cold plate, an outlet conduit, and a heat conductor. Coolant flows through the inlet conduit. The first cold plate has a first inlet surface and a first outlet surface. The inlet conduit is coupled to the first inlet surface. The inlet conduit transfers the coolant into the first cold plate. The connecting conduit is coupled at one end to the first outlet surface. The coolant flows from the first cold plate through the connecting conduit. The second cold plate has a second inlet surface and a second outlet surface, the connecting conduit being coupled at another end to the second inlet surface. The outlet conduit is coupled to the second outlet surface. The coolant flows from the second cold plate through the outlet conduit.Type: GrantFiled: June 24, 2021Date of Patent: April 4, 2023Assignee: QUANTA COMPUTER INC.Inventors: Yi-Chieh Chen, Yueh-Chang Wu, Te-Chuan Wang, Tzu-Hsuan Hsu
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Publication number: 20230025554Abstract: A cooling system for a rack of servers includes a plurality of cooling circuits, where each cooling circuit is coupled to a server of the rack. Each cooling circuit includes a plurality of cooling modules arranged in parallel. Each cooling module includes a cold plate having a cooling conduit passing therethrough, and a pump fluidly coupled to the cooling conduit. The cooling circuit further includes one or more valves fluidly interconnecting the plurality of cooling modules. Each of the one or more valves, when turned on, fluidly connects the cooling conduits of any two adjacent cooling modules. The cooling system further includes a first cooling distribution manifold fluidly connected to the cooling circuit of each of the plurality of servers through an inlet pipe, and a second cooling distribution manifold fluidly connected to the cooling circuit of each of the plurality of servers through an outlet pipe.Type: ApplicationFiled: July 20, 2021Publication date: January 26, 2023Inventors: Yi-Chieh CHEN, Yueh-Chang WU, Te-Chuan WANG, Tzu-Hsuan HSU
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Publication number: 20220418154Abstract: A cooling device for a computing system is disclosed. The cooling device includes an inlet conduit, a first cold plate, a connecting conduit, a second cold plate, an outlet conduit, and a heat conductor. Coolant flows through the inlet conduit. The first cold plate has a first inlet surface and a first outlet surface. The inlet conduit is coupled to the first inlet surface. The inlet conduit transfers the coolant into the first cold plate. The connecting conduit is coupled at one end to the first outlet surface. The coolant flows from the first cold plate through the connecting conduit. The second cold plate has a second inlet surface and a second outlet surface, the connecting conduit being coupled at another end to the second inlet surface. The outlet conduit is coupled to the second outlet surface. The coolant flows from the second cold plate through the outlet conduit.Type: ApplicationFiled: June 24, 2021Publication date: December 29, 2022Inventors: Yi-Chieh CHEN, Yueh-Chang WU, Te-Chuan WANG, Tzu-Hsuan HSU
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Publication number: 20220346273Abstract: A computing device comprises a heat sink including a base and a multi-dimensional thermal dissipation device disposed adjacent to the base. A thermally-conductive grease layer is disposed between and in direct contact with the multi-dimensional thermal dissipation device and the base. A gasket contains the thermally-conductive grease layer between the multi-dimensional thermal dissipation device and the base.Type: ApplicationFiled: April 27, 2021Publication date: October 27, 2022Inventors: Yi-Chieh CHEN, Yueh-Chang WU, Te-Chuan WANG
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Patent number: 11477915Abstract: A computing device includes a sealed computer chassis housing, a heat source, a heat spreader, and a thermal pad. The sealed computer chassis housing, defines an interior space and an exterior surface with a heat sink for the interior space. The heat source is disposed within the interior space. The heat spreader includes a plurality of thermally-conductive protrusions coupled to one or more components of the heat source by an intermediate thermally conductive layer. The thermal pad is positioned above and in thermal contact with the heat spreader. The thermal pad is positioned to contact an interior wall of the sealed computer chassis housing opposite to the heat sink.Type: GrantFiled: January 14, 2021Date of Patent: October 18, 2022Assignee: QUANTA COMPUTER INC.Inventors: Yi-Chieh Chen, Yueh-Chang Wu, Te-Chuan Wang, Tzu-Hsuan Hsu
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Patent number: 11431415Abstract: An electronic component such as a fan-less component for a 5G system having an expansion card and optical transceivers is disclosed. The electronic component has a chassis heat sink having a contact surface and a printed circuit board. A transceiver cage is located on the printed circuit board. The cage receives the optical transceiver. The transceiver cage is in thermal contact with the optical transceiver. The system includes a bracket having a heat sink support with a flat surface in thermal contact with the contact surface of the chassis heat sink. The bracket has a transceiver support having a flat surface in thermal contact with the optical transceiver and supporting the expansion card. A connector support is coupled to the heat sink support and the transceiver support. Heat from the optical transceiver is transmitted through the transceiver, connector, and the heat sink supports to the chassis heat sink.Type: GrantFiled: December 11, 2020Date of Patent: August 30, 2022Assignee: QUANTA COMPUTER INC.Inventors: Yi-Chieh Chen, Yueh-Chang Wu, Te-Chuan Wang
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Patent number: 11412638Abstract: A cooling system for an electronic device includes a central processing unit (CPU), a remote heat sink, and a heat-pipe module. The CPU is mounted on a base of the electronic device, and the remote heat sink receives heat generated by the CPU. The heat-pipe module has a plurality of heat pipes for transferring the heat generated by the CPU to the remote heat sink. Each heat pipe has a circular section extending between a first end and a second end. The first end has a flattened, non-circular shape, and is coupled to the base near the CPU. The second end is coupled to the remote heat sink. The first end of each heat pipe is in direct contact with at least another first end of an adjacent heat pipe.Type: GrantFiled: December 1, 2020Date of Patent: August 9, 2022Assignee: QUANTA COMPUTER INC.Inventors: Yi-Chieh Chen, Yueh-Chang Wu, Yan-Kuei Chen, Te-Chuan Wang
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Publication number: 20220225541Abstract: A computing device includes a sealed computer chassis housing, a heat source, a heat spreader, and a thermal pad. The sealed computer chassis housing, defines an interior space and an exterior surface with a heat sink for the interior space. The heat source is disposed within the interior space. The heat spreader includes a plurality of thermally-conductive protrusions coupled to one or more components of the heat source by an intermediate thermally conductive layer. The thermal pad is positioned above and in thermal contact with the heat spreader. The thermal pad is positioned to contact an interior wall of the sealed computer chassis housing opposite to the heat sink.Type: ApplicationFiled: January 14, 2021Publication date: July 14, 2022Inventors: Yi-Chieh CHEN, Yueh-Chang WU, Te-Chuan WANG, Tzu-Hsuan HSU
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Publication number: 20220190921Abstract: An electronic component such as a fan-less component for a 5G system having an expansion card and optical transceivers is disclosed. The electronic component has a chassis heat sink having a contact surface and a printed circuit board. A transceiver cage is located on the printed circuit board. The cage receives the optical transceiver. The transceiver cage is in thermal contact with the optical transceiver. The system includes a bracket having a heat sink support with a flat surface in thermal contact with the contact surface of the chassis heat sink. The bracket has a transceiver support having a flat surface in thermal contact with the optical transceiver and supporting the expansion card. A connector support is coupled to the heat sink support and the transceiver support. Heat from the optical transceiver is transmitted through the transceiver, connector, and the heat sink supports to the chassis heat sink.Type: ApplicationFiled: December 11, 2020Publication date: June 16, 2022Inventors: Yi-Chieh CHEN, Yueh-Chang WU, Te-Chuan WANG
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Publication number: 20220174845Abstract: A cooling system for an electronic device includes a central processing unit (CPU), a remote heat sink, and a heat-pipe module. The CPU is mounted on a base of the electronic device, and the remote heat sink receives heat generated by the CPU. The heat-pipe module has a plurality of heat pipes for transferring the heat generated by the CPU to the remote heat sink. Each heat pipe has a circular section extending between a first end and a second end. The first end has a flattened, non-circular shape, and is coupled to the base near the CPU. The second end is coupled to the remote heat sink. The first end of each heat pipe is in direct contact with at least another first end of an adjacent heat pipe.Type: ApplicationFiled: December 1, 2020Publication date: June 2, 2022Inventors: Yi-Chieh CHEN, Yueh-Chang WU, Yan-Kuei CHEN, Te-Chuan WANG
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Patent number: 11205401Abstract: A power-saving method for switching High Definition Multimedia Interface (HDMI) ports on a sink device is provided. The sink device has a first HDMI port initially being enabled for displaying and a second HDMI port being disabled for displaying. The power-saving method includes the steps of using the reference signals to locate the VSYNC active edge in each frame generated by a source device connected to the second HDMI port; turning on the power to the second HDMI port during a power-on region corresponding to the VSYNC active edge in each frame and turning off power otherwise; obtaining information related to a high bandwidth digital content protection (HDCP) in the power-on region; and displaying video data from the source device based on the HDCP information when enabling the second HDMI port connected to the source device.Type: GrantFiled: April 28, 2021Date of Patent: December 21, 2021Assignee: MEDIATEK INC.Inventors: You-Tsai Jeng, Kai-Wen Cheng, Chin-Lung Lin, Yi-Cheng Chen, Te-Chuan Wang, Chi-Chih Chen, Szu-Hsiang Lai, Tai-Lai Tung, Keng-Lon Lei
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Patent number: 10142678Abstract: A video processing device capable of automatically determining an operation mode is provided. The video processing device includes a control signal processing circuit and a controller. The control signal processing circuit receives a control signal from a transmitter, and, according to at least one data access address indicated by the control signal, performs at least steps of determining whether the data access address satisfies a predetermined access address, and outputting a notification signal when the data access address satisfies the predetermined access address. The controller causes the video processing device to operate in a first mode according to the notification signal, and causes the video processing device to operate in a second mode when the notification signal is not received within a predetermined time interval.Type: GrantFiled: May 24, 2017Date of Patent: November 27, 2018Assignee: MSTAR SEMICONDUCTOR, INC.Inventors: Chin-Lung Lin, Te-Chuan Wang, Chi-En Peng
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Patent number: 9912843Abstract: A High-Definition Multimedia Interface (HDMI) receiving circuit receives an image signal and an input clock transmitted via HDMI and generates output data. The HDMI receiving circuit includes: a sampling circuit, sampling the image signal according to a transmission mode and the input clock to generate the output data; a data comparison circuit, coupled to the sampling circuit, determining whether the output data includes predetermined data to generate a determination result; and a control circuit, coupled to the sampling circuit and the data comparison circuit, determining the transmission mode according to the determination result.Type: GrantFiled: February 3, 2017Date of Patent: March 6, 2018Assignee: MStar Semiconductor, Inc.Inventors: Chun Wen Yeh, Shuo-Ting Kao, Te-Chuan Wang