Patents by Inventor Te-Chuan Wang

Te-Chuan Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240155185
    Abstract: A channel hiatus correction method for an HDMI device is provided. A recovery code from scrambled data of the stream is obtained. A liner feedback shift register (LFSR) value of channels of the HDMI port is obtained based on the recovery code and the scrambled data of the stream. The stream is de-scrambled according to the LFSR value of the channels of the HDMI port. Video data is displayed according to the de-scrambled stream.
    Type: Application
    Filed: November 9, 2022
    Publication date: May 9, 2024
    Inventors: Chia-Hao CHANG, You-Tsai JENG, Kai-Wen YEH, Yi-Cheng CHEN, Te-Chuan WANG, Kai-Wen CHENG, Chin-Lung LIN, Tai-Lai TUNG, Ko-Yin LAI
  • Patent number: 11962847
    Abstract: A channel hiatus correction method for an HDMI device is provided. A recovery code from scrambled data of the stream is obtained. A liner feedback shift register (LFSR) value of channels of the HDMI port is obtained based on the recovery code and the scrambled data of the stream. The stream is de-scrambled according to the LFSR value of the channels of the HDMI port. Video data is displayed according to the de-scrambled stream.
    Type: Grant
    Filed: November 9, 2022
    Date of Patent: April 16, 2024
    Assignee: MEDIATEK INC.
    Inventors: Chia-Hao Chang, You-Tsai Jeng, Kai-Wen Yeh, Yi-Cheng Chen, Te-Chuan Wang, Kai-Wen Cheng, Chin-Lung Lin, Tai-Lai Tung, Ko-Yin Lai
  • Patent number: 11864341
    Abstract: A sunshield to protect an equipment housing from solar heat and allow cooling from external air flow is disclosed. The sunshield includes a main plate configured to be positioned to cover a side of the equipment housing. A vent in the main plate allows air flow through the main plate to the equipment housing. A shutter is rotatable between an open position allowing air flow through the vent, and a closed position blocking air flow through the vent. A biasing mechanism provides force to bias the shutter in the closed position. The force is overcome by a predetermined level of external air flow on the shutter to rotate the shutter to the open position.
    Type: Grant
    Filed: June 22, 2022
    Date of Patent: January 2, 2024
    Assignee: QUANTA COMPUTER INC.
    Inventors: Yi-Chieh Chen, Yueh-Chang Wu, Te-Chuan Wang, Wei-Ju Chen
  • Publication number: 20230422426
    Abstract: A sunshield to protect an equipment housing from solar heat and allow cooling from external air flow is disclosed. The sunshield includes a main plate configured to be positioned to cover a side of the equipment housing. A vent in the main plate allows air flow through the main plate to the equipment housing. A shutter is rotatable between an open position allowing air flow through the vent, and a closed position blocking air flow through the vent. A biasing mechanism provides force to bias the shutter in the closed position. The force is overcome by a predetermined level of external air flow on the shutter to rotate the shutter to the open position.
    Type: Application
    Filed: June 22, 2022
    Publication date: December 28, 2023
    Inventors: Yi-Chieh CHEN, Yueh-Chang WU, Te-Chuan WANG, Wei-Ju CHEN
  • Publication number: 20230345669
    Abstract: A heat transmissive chassis for a fan-less equipment component such as a 5G component is disclosed. The chassis includes a heat sink section having an interior surface and an exterior surface. The interior surface is configured for contact with a heat-generating electronic device. A lateral hollow compartment is located near the interior surface. A coolant is contained in the hollow compartment.
    Type: Application
    Filed: April 20, 2022
    Publication date: October 26, 2023
    Inventors: Yi-Chieh CHEN, Yueh-Chang WU, Te-Chuan WANG, Po-Kai TSENG
  • Patent number: 11770583
    Abstract: A power-saving method for an HDMI device is provided. The method includes detecting color depth information of video data from an HDMI source which is connected to the HDMI port, deriving a horizontal length for each line by fragment of a picture frame according to the color depth information, generating a plurality of synchronization signals according to the horizontal length for each line by fragment, and powering on the HDMI port, according to the synchronization signals, for a predetermined time period to obtain encrypted information from the HDMI source, and powering off the HDMI port after the predetermined time period.
    Type: Grant
    Filed: July 21, 2022
    Date of Patent: September 26, 2023
    Assignee: MEDIATEK INC.
    Inventors: You-Tsai Jeng, Chia-Hao Chang, Yi-Cheng Chen, Kai-Wen Yeh, Kuo-Chang Cheng, Chi-Chih Chen, Szu-Hsiang Lai, Chin-Lung Lin, Kai-Wen Cheng, Te-Chuan Wang, Ko-Yin Lai, Keng-Lon Lei, Tai-Lai Tung
  • Patent number: 11755084
    Abstract: A cooling system for a rack of servers includes a plurality of cooling circuits, where each cooling circuit is coupled to a server of the rack. Each cooling circuit includes a plurality of cooling modules arranged in parallel. Each cooling module includes a cold plate having a cooling conduit passing therethrough, and a pump fluidly coupled to the cooling conduit. The cooling circuit further includes one or more valves fluidly interconnecting the plurality of cooling modules. Each of the one or more valves, when turned on, fluidly connects the cooling conduits of any two adjacent cooling modules. The cooling system further includes a first cooling distribution manifold fluidly connected to the cooling circuit of each of the plurality of servers through an inlet pipe, and a second cooling distribution manifold fluidly connected to the cooling circuit of each of the plurality of servers through an outlet pipe.
    Type: Grant
    Filed: July 20, 2021
    Date of Patent: September 12, 2023
    Assignee: QUANTA COMPUTER INC.
    Inventors: Yi-Chieh Chen, Yueh-Chang Wu, Te-Chuan Wang, Tzu-Hsuan Hsu
  • Patent number: 11622471
    Abstract: A cooling device for a computing system is disclosed. The cooling device includes an inlet conduit, a first cold plate, a connecting conduit, a second cold plate, an outlet conduit, and a heat conductor. Coolant flows through the inlet conduit. The first cold plate has a first inlet surface and a first outlet surface. The inlet conduit is coupled to the first inlet surface. The inlet conduit transfers the coolant into the first cold plate. The connecting conduit is coupled at one end to the first outlet surface. The coolant flows from the first cold plate through the connecting conduit. The second cold plate has a second inlet surface and a second outlet surface, the connecting conduit being coupled at another end to the second inlet surface. The outlet conduit is coupled to the second outlet surface. The coolant flows from the second cold plate through the outlet conduit.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: April 4, 2023
    Assignee: QUANTA COMPUTER INC.
    Inventors: Yi-Chieh Chen, Yueh-Chang Wu, Te-Chuan Wang, Tzu-Hsuan Hsu
  • Publication number: 20230025554
    Abstract: A cooling system for a rack of servers includes a plurality of cooling circuits, where each cooling circuit is coupled to a server of the rack. Each cooling circuit includes a plurality of cooling modules arranged in parallel. Each cooling module includes a cold plate having a cooling conduit passing therethrough, and a pump fluidly coupled to the cooling conduit. The cooling circuit further includes one or more valves fluidly interconnecting the plurality of cooling modules. Each of the one or more valves, when turned on, fluidly connects the cooling conduits of any two adjacent cooling modules. The cooling system further includes a first cooling distribution manifold fluidly connected to the cooling circuit of each of the plurality of servers through an inlet pipe, and a second cooling distribution manifold fluidly connected to the cooling circuit of each of the plurality of servers through an outlet pipe.
    Type: Application
    Filed: July 20, 2021
    Publication date: January 26, 2023
    Inventors: Yi-Chieh CHEN, Yueh-Chang WU, Te-Chuan WANG, Tzu-Hsuan HSU
  • Publication number: 20220418154
    Abstract: A cooling device for a computing system is disclosed. The cooling device includes an inlet conduit, a first cold plate, a connecting conduit, a second cold plate, an outlet conduit, and a heat conductor. Coolant flows through the inlet conduit. The first cold plate has a first inlet surface and a first outlet surface. The inlet conduit is coupled to the first inlet surface. The inlet conduit transfers the coolant into the first cold plate. The connecting conduit is coupled at one end to the first outlet surface. The coolant flows from the first cold plate through the connecting conduit. The second cold plate has a second inlet surface and a second outlet surface, the connecting conduit being coupled at another end to the second inlet surface. The outlet conduit is coupled to the second outlet surface. The coolant flows from the second cold plate through the outlet conduit.
    Type: Application
    Filed: June 24, 2021
    Publication date: December 29, 2022
    Inventors: Yi-Chieh CHEN, Yueh-Chang WU, Te-Chuan WANG, Tzu-Hsuan HSU
  • Publication number: 20220346273
    Abstract: A computing device comprises a heat sink including a base and a multi-dimensional thermal dissipation device disposed adjacent to the base. A thermally-conductive grease layer is disposed between and in direct contact with the multi-dimensional thermal dissipation device and the base. A gasket contains the thermally-conductive grease layer between the multi-dimensional thermal dissipation device and the base.
    Type: Application
    Filed: April 27, 2021
    Publication date: October 27, 2022
    Inventors: Yi-Chieh CHEN, Yueh-Chang WU, Te-Chuan WANG
  • Patent number: 11477915
    Abstract: A computing device includes a sealed computer chassis housing, a heat source, a heat spreader, and a thermal pad. The sealed computer chassis housing, defines an interior space and an exterior surface with a heat sink for the interior space. The heat source is disposed within the interior space. The heat spreader includes a plurality of thermally-conductive protrusions coupled to one or more components of the heat source by an intermediate thermally conductive layer. The thermal pad is positioned above and in thermal contact with the heat spreader. The thermal pad is positioned to contact an interior wall of the sealed computer chassis housing opposite to the heat sink.
    Type: Grant
    Filed: January 14, 2021
    Date of Patent: October 18, 2022
    Assignee: QUANTA COMPUTER INC.
    Inventors: Yi-Chieh Chen, Yueh-Chang Wu, Te-Chuan Wang, Tzu-Hsuan Hsu
  • Patent number: 11431415
    Abstract: An electronic component such as a fan-less component for a 5G system having an expansion card and optical transceivers is disclosed. The electronic component has a chassis heat sink having a contact surface and a printed circuit board. A transceiver cage is located on the printed circuit board. The cage receives the optical transceiver. The transceiver cage is in thermal contact with the optical transceiver. The system includes a bracket having a heat sink support with a flat surface in thermal contact with the contact surface of the chassis heat sink. The bracket has a transceiver support having a flat surface in thermal contact with the optical transceiver and supporting the expansion card. A connector support is coupled to the heat sink support and the transceiver support. Heat from the optical transceiver is transmitted through the transceiver, connector, and the heat sink supports to the chassis heat sink.
    Type: Grant
    Filed: December 11, 2020
    Date of Patent: August 30, 2022
    Assignee: QUANTA COMPUTER INC.
    Inventors: Yi-Chieh Chen, Yueh-Chang Wu, Te-Chuan Wang
  • Patent number: 11412638
    Abstract: A cooling system for an electronic device includes a central processing unit (CPU), a remote heat sink, and a heat-pipe module. The CPU is mounted on a base of the electronic device, and the remote heat sink receives heat generated by the CPU. The heat-pipe module has a plurality of heat pipes for transferring the heat generated by the CPU to the remote heat sink. Each heat pipe has a circular section extending between a first end and a second end. The first end has a flattened, non-circular shape, and is coupled to the base near the CPU. The second end is coupled to the remote heat sink. The first end of each heat pipe is in direct contact with at least another first end of an adjacent heat pipe.
    Type: Grant
    Filed: December 1, 2020
    Date of Patent: August 9, 2022
    Assignee: QUANTA COMPUTER INC.
    Inventors: Yi-Chieh Chen, Yueh-Chang Wu, Yan-Kuei Chen, Te-Chuan Wang
  • Publication number: 20220225541
    Abstract: A computing device includes a sealed computer chassis housing, a heat source, a heat spreader, and a thermal pad. The sealed computer chassis housing, defines an interior space and an exterior surface with a heat sink for the interior space. The heat source is disposed within the interior space. The heat spreader includes a plurality of thermally-conductive protrusions coupled to one or more components of the heat source by an intermediate thermally conductive layer. The thermal pad is positioned above and in thermal contact with the heat spreader. The thermal pad is positioned to contact an interior wall of the sealed computer chassis housing opposite to the heat sink.
    Type: Application
    Filed: January 14, 2021
    Publication date: July 14, 2022
    Inventors: Yi-Chieh CHEN, Yueh-Chang WU, Te-Chuan WANG, Tzu-Hsuan HSU
  • Publication number: 20220190921
    Abstract: An electronic component such as a fan-less component for a 5G system having an expansion card and optical transceivers is disclosed. The electronic component has a chassis heat sink having a contact surface and a printed circuit board. A transceiver cage is located on the printed circuit board. The cage receives the optical transceiver. The transceiver cage is in thermal contact with the optical transceiver. The system includes a bracket having a heat sink support with a flat surface in thermal contact with the contact surface of the chassis heat sink. The bracket has a transceiver support having a flat surface in thermal contact with the optical transceiver and supporting the expansion card. A connector support is coupled to the heat sink support and the transceiver support. Heat from the optical transceiver is transmitted through the transceiver, connector, and the heat sink supports to the chassis heat sink.
    Type: Application
    Filed: December 11, 2020
    Publication date: June 16, 2022
    Inventors: Yi-Chieh CHEN, Yueh-Chang WU, Te-Chuan WANG
  • Publication number: 20220174845
    Abstract: A cooling system for an electronic device includes a central processing unit (CPU), a remote heat sink, and a heat-pipe module. The CPU is mounted on a base of the electronic device, and the remote heat sink receives heat generated by the CPU. The heat-pipe module has a plurality of heat pipes for transferring the heat generated by the CPU to the remote heat sink. Each heat pipe has a circular section extending between a first end and a second end. The first end has a flattened, non-circular shape, and is coupled to the base near the CPU. The second end is coupled to the remote heat sink. The first end of each heat pipe is in direct contact with at least another first end of an adjacent heat pipe.
    Type: Application
    Filed: December 1, 2020
    Publication date: June 2, 2022
    Inventors: Yi-Chieh CHEN, Yueh-Chang WU, Yan-Kuei CHEN, Te-Chuan WANG
  • Patent number: 11205401
    Abstract: A power-saving method for switching High Definition Multimedia Interface (HDMI) ports on a sink device is provided. The sink device has a first HDMI port initially being enabled for displaying and a second HDMI port being disabled for displaying. The power-saving method includes the steps of using the reference signals to locate the VSYNC active edge in each frame generated by a source device connected to the second HDMI port; turning on the power to the second HDMI port during a power-on region corresponding to the VSYNC active edge in each frame and turning off power otherwise; obtaining information related to a high bandwidth digital content protection (HDCP) in the power-on region; and displaying video data from the source device based on the HDCP information when enabling the second HDMI port connected to the source device.
    Type: Grant
    Filed: April 28, 2021
    Date of Patent: December 21, 2021
    Assignee: MEDIATEK INC.
    Inventors: You-Tsai Jeng, Kai-Wen Cheng, Chin-Lung Lin, Yi-Cheng Chen, Te-Chuan Wang, Chi-Chih Chen, Szu-Hsiang Lai, Tai-Lai Tung, Keng-Lon Lei
  • Patent number: 10142678
    Abstract: A video processing device capable of automatically determining an operation mode is provided. The video processing device includes a control signal processing circuit and a controller. The control signal processing circuit receives a control signal from a transmitter, and, according to at least one data access address indicated by the control signal, performs at least steps of determining whether the data access address satisfies a predetermined access address, and outputting a notification signal when the data access address satisfies the predetermined access address. The controller causes the video processing device to operate in a first mode according to the notification signal, and causes the video processing device to operate in a second mode when the notification signal is not received within a predetermined time interval.
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: November 27, 2018
    Assignee: MSTAR SEMICONDUCTOR, INC.
    Inventors: Chin-Lung Lin, Te-Chuan Wang, Chi-En Peng
  • Patent number: 9912843
    Abstract: A High-Definition Multimedia Interface (HDMI) receiving circuit receives an image signal and an input clock transmitted via HDMI and generates output data. The HDMI receiving circuit includes: a sampling circuit, sampling the image signal according to a transmission mode and the input clock to generate the output data; a data comparison circuit, coupled to the sampling circuit, determining whether the output data includes predetermined data to generate a determination result; and a control circuit, coupled to the sampling circuit and the data comparison circuit, determining the transmission mode according to the determination result.
    Type: Grant
    Filed: February 3, 2017
    Date of Patent: March 6, 2018
    Assignee: MStar Semiconductor, Inc.
    Inventors: Chun Wen Yeh, Shuo-Ting Kao, Te-Chuan Wang