Abstract: A water quality detection device including a detection tank, a sensor, the cleaner and a processor is provided. The sensor is disposed on the detection tank and is configured to sense a to-be-detected liquid within the detection tank. The cleaner is configured to clean the sensor. The processor is electrically connected to the sensor and the cleaner and is configured to: execute an initialization procedure, which includes driving the sensor to sense the to-be-detected liquid to obtain a number of initial sensing values and calculating a threshold value according to the initial sensing values; drive the sensor to sense the to-be-detected liquid to obtain a sensing value of the to-be-detected liquid, and determine whether the sensing value of the to-be-detected liquid reaches the threshold value; drive the cleaner to operate when the sensing value of the to-be-detected liquid reaches the threshold value.

Abstract: A power supply circuit includes a voltage conversion circuit, a signal path, a connector, and a feedback path. The voltage conversion circuit receives and converts an input voltage into an output voltage. A voltage drop is generated when the output voltage flows through the signal path. The connector is coupled to the voltage conversion circuit through the signal path, wherein the output voltage flows through the signal path then enters the connector as a connector voltage, which supplies power to an external device when the external device is connected to the connector. The feedback path is coupled to the voltage conversion circuit and the connector, wherein the connector voltage is fed back to the voltage conversion circuit as an induced voltage through the feedback path, and the voltage conversion circuit adjusts the output voltage according to the induced voltage.

Abstract: A transistor device includes a first source/drain region and a second source/drain region spaced apart from each other; a channel layer electrically connected to the first and second source/drain regions; a gate insulator layer; a gate electrode isolated from the channel layer by the gate insulator layer; and a UV-attenuating layer disposed on the channel layer to protect the channel layer from characteristic degradation caused by UV light.

Abstract: A backside metallized compound semiconductor device includes a compound semiconductor wafer and a metal layered structure. The compound semiconductor wafer includes a substrate having opposite front and back surfaces, and a ground pad structure formed on the front surface. The substrate is formed with a via extending from the back surface to the front surface to expose a side wall of the substrate and a portion of the ground pad structure. The metal layered structure is disposed on the back surface, and covers the side wall and the portion of the ground pad structure. The metal layered structure includes an adhesion layer, a seed layer, a gold layer, and an electroplated copper layer that are formed on the back surface in such order. The method for manufacturing the backside metallized compound semiconductor device is also disclosed.

Abstract: A thermal image-based temperature measurement calibration method applicable to a thermal image device is provided. The method includes a capturing stage, a processing stage and a calibration stage. During the capturing stage, the thermal image device captures a monitored environment to obtain a measured thermal image. During the processing stage, a processor processes on the measured thermal image to obtain a target information, wherein the target information corresponds to a target in the monitored environment, and the target information includes a target image block and a target measured temperature corresponding to the target image block. During the calibration stage, the processor obtains a distance compensation value according to a pixel number of the target image block, and the processor performs a calibration operation to the target measured temperature at least according to the distance compensation value to obtain a calibrated temperature value corresponding to the target.

Abstract: A locking mechanism is applicable to an intelligent cabinet system having a first object and a second object movable relative to each other. The second object is configured to be located at one of a retracted position, a predetermined extension position and an open position. The locking mechanism includes a locking member and a driving device. The driving device is configured to drive the locking member to move from a first predetermined position to a second predetermined position. When the second object is moved relative to the first object from the retracted position along a direction and when the locking member is located at the second predetermined position, the locking member is configured to block the second object at the predetermined extension position. The predetermined extension position is located between the retracted position and the open position.

Abstract: A lock mechanism is configured to be arranged on one of a first object and a second object movable relative to each other. The lock mechanism includes a driving device and a locking member. The locking member is configured to be driven by the driving device to move between a first position and a second position in a non-rotatable manner. When the locking member is located at the first position, the locking member is configured to lock the other one of the first object and the second object. When the locking member is located at the second position, the locking member is does not lock the other one of the first object and the second object.

Abstract: A wafer structure and a trimming method thereof are provided. The wafer structure includes a first wafer which includes a front surface, a back surface, and a sidewall connected to the front surface and the back surface. The sidewall of the first wafer includes a plurality of first regions at an edge of the sidewall and the back surface and laterally separated from one another by a pitch. Each of the first regions extends from the back surface toward the front surface and has etching streaks thereon.

Abstract: A locking mechanism is applicable to an intelligent cabinet system having a first object and a second object movable relative to each other. The second object is configured to be located at one of a retracted position, a predetermined extension position and an open position. The locking mechanism includes a locking member and a driving device. The driving device is configured to drive the locking member to move from a first predetermined position to a second predetermined position. When the second object is moved relative to the first object from the retracted position along a direction and when the locking member is located at the second predetermined position, the locking member is configured to block the second object at the predetermined extension position. The predetermined extension position is located between the retracted position and the open position.

Abstract: A dynamic displacement error compensation system by which detection error information obtained based on calibration detection of first and second axes, is respectively made into first and second compensation tables for compensating displacement on the axes by using positional information of the axes as variables, the first compensation table is stored in a first driver of a first motor device for driving a first moving element to move linearly on the first axis, the second compensation table is stored in a second driver of a second motor device for driving a second moving element to move linearly on the second axis, the drivers simultaneously or successively obtain a first dynamic positional information of the first moving element on the first axis and a second dynamic positional information of the second moving element on the second axis, and the moving elements are respectively displaceably compensated according to the compensation tables.

Abstract: A wafer structure and a trimming method thereof are provided. The wafer structure includes a first wafer which includes a front surface, a back surface, and a sidewall connected to the front surface and the back surface. The sidewall of the first wafer includes a plurality of first regions at an edge of the sidewall and the back surface and laterally separated from one another by a pitch. Each of the first regions extends from the back surface toward the front surface and has etching streaks thereon.

Abstract: A dynamic displacement error compensation system by which detection error information obtained based on calibration detection of first and second axes, is respectively made into first and second compensation tables for compensating displacement on the axes by using positional information of the axes as variables, the first compensation table is stored in a first driver of a first motor device for driving a first moving element to move linearly on the first axis, the second compensation table is stored in a second driver of a second motor device for driving a second moving element to move linearly on the second axis, the drivers simultaneously or successively obtain a first dynamic positional information of the first moving element on the first axis and a second dynamic positional information of the second moving element on the second axis, and the moving elements are respectively displaceably compensated according to the compensation tables.

Abstract: A wafer structure and a trimming method thereof are provided. The trimming method includes the following steps. A first wafer having a first surface and a second surface opposite to the first surface is provided. A first pre-trimming mark is formed on the first surface of the first wafer, where forming the first pre-trimming mark includes forming a plurality of recesses arranged as a path along a periphery of the first wafer. The first wafer is trimmed on the first pre-trimming mark and along the path of the first pre-trimming mark to remove a portion of the first wafer and form a trimmed edge having first regions thereon.

Abstract: A thermal image-based temperature measurement calibration method applicable to a thermal image device is provided. The method includes a capturing stage, a processing stage and a calibration stage. During the capturing stage, the thermal image device captures a monitored environment to obtain a measured thermal image. During the processing stage, a processor processes on the measured thermal image to obtain a target information, wherein the target information corresponds to a target in the monitored environment, and the target information includes a target image block and a target measured temperature corresponding to the target image block. During the calibration stage, the processor obtains a distance compensation value according to a pixel number of the target image block, and the processor performs a calibration operation to the target measured temperature at least according to the distance compensation value to obtain a calibrated temperature value corresponding to the target.

Abstract: A detecting apparatus and a detecting method for physiological information are provided. The detecting apparatus includes a first optical signal provider configured to provide an organism with a first optical signal, a signal receiver configured to receive the first physiological signal, and a processor. The first optical signal, after interacting with the organism, turns into a first physiological signal. The processor is configured to calculate a plurality of physiological information values of the organism according to the first physiological signal; determine whether or not any of the physiological information values is abnormal; and replace the abnormal physiological information value with a physiological information reliable value when there is the abnormal physiological information value.

Abstract: A projector includes a light source, a color wheel, a housing, a motor, a lens module, an optical detection module, and a feedback module. The light source is used for providing a light beam. The color wheel includes a plurality of optical filtering segments for generating light with a plurality of colors. The housing is connected to the color wheel. The housing has a timing mark. The motor is connected to the housing for rotating the color wheel through the housing. The lens module is used for outputting the light with the plurality of colors. When the housing is rotated, the optical detection module generates a pulse width modulation signal according variations of gray levels of the housing. The feedback module is coupled to the optical detection module for conditionally outputting an adjusted voltage to the optical detection module according to the pulse width modulation signal.

Abstract: A wafer structure and a trimming method thereof are provided. The trimming method includes the following steps. A first wafer having a first surface and a second surface opposite to the first surface is provided. A first pre-trimming mark is formed on the first surface of the first wafer, where forming the first pre-trimming mark includes forming a plurality of recesses arranged as a path along a periphery of the first wafer. The first wafer is trimmed on the first pre-trimming mark and along the path of the first pre-trimming mark to remove a portion of the first wafer and form a trimmed edge having first regions thereon.

Abstract: A wafer structure and a trimming method thereof are provided. The trimming method includes the following steps. A first wafer having a first surface and a second surface opposite to the first surface is provided. A first pre-trimming mark is formed on the first surface of the first wafer, wherein forming the first pre-trimming mark includes forming a plurality of recesses arranged as a path along a periphery of the first wafer. The first wafer is trimmed on the first pre-trimming mark and along the path of the first pre-trimming mark to remove a portion of the first wafer and form a trimmed edge having first regions thereon.

Abstract: A projector includes a light source, a color wheel, a housing, a motor, a lens module, an optical detection module, and a feedback module. The light source is used for providing a light beam. The color wheel includes a plurality of optical filtering segments for generating light with a plurality of colors. The housing is connected to the color wheel. The housing has a timing mark. The motor is connected to the housing for rotating the color wheel through the housing. The lens module is used for outputting the light with the plurality of colors. When the housing is rotated, the optical detection module generates a pulse width modulation signal according variations of gray levels of the housing. The feedback module is coupled to the optical detection module for conditionally outputting an adjusted voltage to the optical detection module according to the pulse width modulation signal.

Abstract: A lock mechanism is configured to be arranged on one of a first object and a second object movable relative to each other. The lock mechanism includes a driving device and a locking member. The locking member is configured to be driven by the driving device to move between a first position and a second position in a non-rotatable manner. When the locking member is located at the first position, the locking member is configured to lock the other one of the first object and the second object. When the locking member is located at the second position, the locking member is does not lock the other one of the first object and the second object.