Patents by Inventor Tea-Geon KIM
Tea-Geon KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11776946Abstract: A method of manufacturing a package-on-package device includes a bonding step carried out by a bonding apparatus including a pressing member and a light source that produces a laser beam. A bottom package including a lower substrate, lower solder balls alongside an edge of the lower substrate, and a lower chip on a center of the lower substrate is provided, the bottom package is bonded to an interposer substrate having upper solder balls aligned with the lower solder balls, and a top package having an upper substrate and an upper chip on the upper substrate is bonded to the interposer substrate. While the interposer substrate is disposed on the bottom package, the pressing member presses the interposer substrate against the bottom package, and the laser beam adheres the lower solder balls to the upper solder balls.Type: GrantFiled: April 7, 2021Date of Patent: October 3, 2023Inventors: Junho Cho, Ohchul Kwon, Seungjin Cheon, Tea-Geon Kim, Bubryong Lee, Junglae Jung
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Publication number: 20210225829Abstract: A method of manufacturing a package-on-package device includes a bonding step carried out by a bonding apparatus including a pressing member and a light source that produces a laser beam. A bottom package including a lower substrate, lower solder balls alongside an edge of the lower substrate, and a lower chip on a center of the lower substrate is provided, the bottom package is bonded to an interposer substrate having upper solder balls aligned with the lower solder balls, and a top package having an upper substrate and an upper chip on the upper substrate is bonded to the interposer substrate. While the interposer substrate is disposed on the bottom package, the pressing member presses the interposer substrate against the bottom package, and the laser beam adheres the lower solder balls to the upper solder balls.Type: ApplicationFiled: April 7, 2021Publication date: July 22, 2021Inventors: JUNHO CHO, OHCHUL KWON, SEUNGJIN CHEON, TEA-GEON KIM, BUBRYONG LEE, JUNGLAE JUNG
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Patent number: 10998303Abstract: A method of manufacturing a package-on-package device includes a bonding step carried out by a bonding apparatus including a pressing member and a light source that produces a laser beam. A bottom package including a lower substrate, lower solder balls alongside an edge of the lower substrate, and a lower chip on a center of the lower substrate is provided, the bottom package is bonded to an interposer substrate having upper solder balls aligned with the lower solder balls, and a top package having an upper substrate and an upper chip on the upper substrate is bonded to the interposer substrate. While the interposer substrate is disposed on the bottom package, the pressing member presses the interposer substrate against the bottom package, and the laser beam adheres the lower solder balls to the upper solder balls.Type: GrantFiled: October 22, 2018Date of Patent: May 4, 2021Assignee: Samsung Electronics Co., Ltd.Inventors: Junho Cho, Ohchul Kwon, Seungjin Cheon, Tea-Geon Kim, Bubryong Lee, Junglae Jung
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Patent number: 10900883Abstract: A mold test apparatus includes a mold support plate having a top surface on which a mold is mounted, wherein the mold support plate includes a plurality of test suction pipes communicating with paths in the mold, vacuum pipes each having one end connected to one of the plurality of test suction pipes, a pump connected to the other end of the pipe, and at least one pressure sensor configured to measure a pressure of the vacuum pipe, wherein the paths communicate with adsorption holes provided in a top surface of the mold, and wherein the at least one pressure sensor includes a determining unit configured to determine whether the adsorption holes are clogged by using the measured pressure.Type: GrantFiled: July 30, 2018Date of Patent: January 26, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jung Lae Jung, Tea Geon Kim
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Patent number: 10833046Abstract: A stack tool comprises a lower jig having a plurality of package seating regions configured to seat a semiconductor package, an intermediate jig configured to be seated on top of the lower jig, and having a package support hole into which the semiconductor package is configured to be inserted, the intermediate jig having a shape corresponding to the plurality of package seating regions, and an upper dumbbell. The upper dumbbell includes a dumbbell main body on top of the intermediate jig, an upper recess stepped downward from an upper surface of the dumbbell main body on only a region corresponding to an upper surface of the semiconductor package, and a protruding support configured to protrude downward from a lower surface of the upper recess and configured to be brought into contact with an upper surface of the semiconductor package.Type: GrantFiled: August 8, 2018Date of Patent: November 10, 2020Assignee: Samsung Electronics Co., Ltd.Inventors: Tea Geon Kim, Jung Lae Jung, Bub Ryong Lee
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Patent number: 10748855Abstract: A method of fabricating a semiconductor package using a laminating device is provided. The method includes placing a substrate on a substrate stand; providing a pressurizing unit which is expandable and includes a convex surface facing an upper surface of the substrate stand, on the substrate stand; injecting air into the pressurizing unit using a plate which is connected to the pressurizing unit; and supplying a film by a film supply unit which supplies the film between the substrate stand and the pressurizing unit, wherein the pressurizing unit attaches the film onto the substrate, while expanding.Type: GrantFiled: February 20, 2018Date of Patent: August 18, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Tea-Geon Kim, Jung Lae Jung
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Patent number: 10741430Abstract: A stack boat tool includes a boat including a stack hole configured to accommodate first and second semiconductor packages; and a weight bar configured to be placed on the second semiconductor package during a reflow process for combining the first and second semiconductor packages, wherein the weight bar includes: a base configured to contact an upper surface of the second semiconductor package; a sidewall on the base; and a balance weight arranged on the base configured to lower a weight center of the weight bar.Type: GrantFiled: February 22, 2018Date of Patent: August 11, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Tea-geon Kim, Jung-lae Jung
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Patent number: 10665477Abstract: A substrate cleaning apparatus includes a porous suction part having a polygonal pillar shape with a plurality of cleaning surfaces, a transfer unit to transfer a substrate with a plurality of semiconductor devices toward the porous suction part, and to contact the semiconductor devices with one of the plurality of cleaning surfaces, and a rotation driving part to rotate the porous suction part.Type: GrantFiled: December 28, 2016Date of Patent: May 26, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventor: Tea-Geon Kim
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Publication number: 20190273074Abstract: A method of manufacturing a package-on-package device includes a bonding step carried out by a bonding apparatus including a pressing member and a light source that produces a laser beam. A bottom package including a lower substrate, lower solder balls alongside an edge of the lower substrate, and a lower chip on a center of the lower substrate is provided, the bottom package is bonded to an interposer substrate having upper solder balls aligned with the lower solder balls, and a top package having an upper substrate and an upper chip on the upper substrate is bonded to the interposer substrate. While the interposer substrate is disposed on the bottom package, the pressing member presses the interposer substrate against the bottom package, and the laser beam adheres the lower solder balls to the upper solder balls.Type: ApplicationFiled: October 22, 2018Publication date: September 5, 2019Inventors: JUNHO CHO, OHCHUL KWON, SEUNGJIN CHEON, TEA-GEON KIM, BUBRYONG LEE, JUNGLAE JUNG
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Publication number: 20190257734Abstract: A mold test apparatus includes a mold support plate having a top surface on which a mold is mounted, wherein the mold support plate includes a plurality of test suction pipes communicating with paths in the mold, vacuum pipes each having one end connected to one of the plurality of test suction pipes, a pump connected to the other end of the pipe, and at least one pressure sensor configured to measure a pressure of the vacuum pipe, wherein the paths communicate with adsorption holes provided in a top surface of the mold, and wherein the at least one pressure sensor includes a determining unit configured to determine whether the adsorption holes are clogged by using the measured pressure.Type: ApplicationFiled: July 30, 2018Publication date: August 22, 2019Inventors: Jung Lae Jung, Tea Geon Kim
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Publication number: 20190252343Abstract: A stack tool comprises a lower jig having a plurality of package seating regions configured to seat a semiconductor package, an intermediate jig configured to be seated on top of the lower jig, and having a package support hole into which the semiconductor package is configured to be inserted, the intermediate jig having a shape corresponding to the plurality of package seating regions, and an upper dumbbell. The upper dumbbell includes a dumbbell main body on top of the intermediate jig, an upper recess stepped downward from an upper surface of the dumbbell main body on only a region corresponding to an upper surface of the semiconductor package, and a protruding support configured to protrude downward from a lower surface of the upper recess and configured to be brought into contact with an upper surface of the semiconductor package.Type: ApplicationFiled: August 8, 2018Publication date: August 15, 2019Applicant: Samsung Electronics Co., Ltd.Inventors: Tea Geon KIM, Jung Lae JUNG, Bub Ryong LEE
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Patent number: 10373330Abstract: A method for predicting the location of mark is performed for a substrate which includes a plurality of electronic device regions each electronic region includes a mark and a reference indication on a first surface and a sawing indication on a second surface opposite to the first surface. The method includes obtaining first and second image information for the first and second surfaces, extracting a sawing line based on the sawing indication in the second image information, calculating a first spaced distance between the sawing line and the reference indication in the first information, calculating a second spaced distance between the sawing line and the reference indication, and predicting the location of the mark based on whether the first and second spaced distances correspond to a predetermined reference distance. The mark is on each of the electronic device regions separated from each other along the sawing line.Type: GrantFiled: January 13, 2017Date of Patent: August 6, 2019Assignee: Samsung Electronics Co., Ltd.Inventor: Tea-Geon Kim
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Publication number: 20190074202Abstract: A stack boat tool includes a boat including a stack hole configured to accommodate first and second semiconductor packages; and a weight bar configured to be placed on the second semiconductor package during a reflow process for combining the first and second semiconductor packages, wherein the weight bar includes: a base configured to contact an upper surface of the second semiconductor package; a sidewall on the base; and a balance weight arranged on the base configured to lower a weight center of the weight bar.Type: ApplicationFiled: February 22, 2018Publication date: March 7, 2019Inventors: Tea-geon Kim, Jung-lae Jung
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Publication number: 20190051618Abstract: A method of fabricating a semiconductor package using a laminating device is provided. The method includes placing a substrate on a substrate stand; providing a pressurizing unit which is expandable and includes a convex surface facing an upper surface of the substrate stand, on the substrate stand; injecting air into the pressurizing unit using a plate which is connected to the pressurizing unit; and supplying a film by a film supply unit which supplies the film between the substrate stand and the pressurizing unit, wherein the pressurizing unit attaches the film onto the substrate, while expanding.Type: ApplicationFiled: February 20, 2018Publication date: February 14, 2019Inventors: Tea-Geon KIM, Jung Lae JUNG
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Publication number: 20170250095Abstract: A substrate cleaning apparatus includes a porous suction part having a polygonal pillar shape with a plurality of cleaning surfaces, a transfer unit to transfer a substrate with a plurality of semiconductor devices toward the porous suction part, and to contact the semiconductor devices with one of the plurality of cleaning surfaces, and a rotation driving part to rotate the porous suction part.Type: ApplicationFiled: December 28, 2016Publication date: August 31, 2017Inventor: Tea-Geon KIM
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Publication number: 20170236297Abstract: A method for predicting the location of mark is performed for a substrate which includes a plurality of electronic device regions each electronic region includes a mark and a reference indication on a first surface and a sawing indication on a second surface opposite to the first surface. The method includes obtaining first and second image information for the first and second surfaces, extracting a sawing line based on the sawing indication in the second image information, calculating a first spaced distance between the sawing line and the reference indication in the first information, calculating a second spaced distance between the sawing line and the reference indication, and predicting the location of the mark based on whether the first and second spaced distances correspond to a predetermined reference distance. The mark is on each of the electronic device regions separated from each other along the sawing line.Type: ApplicationFiled: January 13, 2017Publication date: August 17, 2017Inventor: Tea-Geon KIM
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Publication number: 20150352608Abstract: A substrate treating apparatus includes a chamber defining an inside space, a supply passage connected to the inside space to supply a cleaning gas for cleaning, a discharge passage connected to the inside space to discharge the cleaning gas from the inside space, and an exhaust member connected to the discharge passage for forcedly exhausting the cleaning gas from the inside space through the discharge passage.Type: ApplicationFiled: May 8, 2015Publication date: December 10, 2015Inventor: Tea-Geon KIM