Abstract: An solder ball mounter includes a stage configured to support a substrate, a ball placer head configured to provide solder balls, and a solder ball mask configured to align the solder balls with the substrate. The solder ball mask includes an upper mask layer including an upper opening having a first diameter, a middle mask layer including a middle opening having a second diameter that is larger than the first diameter, and a lower mask layer.

Abstract: An aligning guide, a semiconductor package comprising an aligning guide, and a method of manufacturing a semiconductor package comprising an aligning guide are provided. The semiconductor package may comprise a circuit board and an aligning guide mounted on the circuit board. The aligning guide may have a plurality of stepped portions. A plurality of semiconductor chips may be stacked on the circuit board and engage with the stepped portions of the aligning guide. According to the disclosed semiconductor package, a large number of semiconductor chips may be stacked with high accuracy and sufficient margin. Therefore, the rate of failure and defects in the chip stacking process may be reduced and the reliability and stability of the semiconductor package may be enhanced.

Abstract: An aligning guide, a semiconductor package comprising an aligning guide, and a method of manufacturing a semiconductor package comprising an aligning guide are provided. The semiconductor package may comprise a circuit board and an aligning guide mounted on the circuit board. The aligning guide may have a plurality of stepped portions. A plurality of semiconductor chips may be stacked on the circuit board and engage with the stepped portions of the aligning guide. According to the disclosed semiconductor package, a large number of semiconductor chips may be stacked with high accuracy and sufficient margin. Therefore, the rate of failure and defects in the chip stacking process may be reduced and the reliability and stability of the semiconductor package may be enhanced.

Abstract: A method of testing objects and an apparatus for performing the same, the method including loading the objects into a testing unit through a loading unit; testing the objects in the testing unit and determining whether the objects are normal objects or abnormal objects; unloading the tested objects from the testing unit to an unloading unit; directly reversely loading the abnormal objects from the unloading unit into the testing unit when the objects are determined to be abnormal objects; and re-testing the abnormal objects in the testing unit.

Abstract: An solder ball mounter includes a stage configured to support a substrate, a ball placer head configured to provide solder balls, and a solder ball mask configured to align the solder balls with the substrate. The solder ball mask includes an upper mask layer including an upper opening having a first diameter, a middle mask layer including a middle opening having a second diameter that is larger than the first diameter, and a lower mask layer.

Abstract: A method of testing objects and an apparatus for performing the same, the method including loading the objects into a testing unit through a loading unit; testing the objects in the testing unit and determining whether the objects are normal objects or abnormal objects; unloading the tested objects from the testing unit to an unloading unit; directly reversely loading the abnormal objects from the unloading unit into the testing unit when the objects are determined to be abnormal objects; and re-testing the abnormal objects in the testing unit.

Abstract: A nozzle for holding a substrate may include a nozzle head and a nozzle body. The nozzle head may provide the substrate with compressed air. The nozzle body may be connected to the nozzle head. The nozzle body may be arranged facing the semiconductor substrate. The nozzle body may have a substantially flat supporting surface which provides a uniform gap between the substrate and the nozzle body. The nozzle body may have a first passageway which allows the compressed air to pass through toward the substrate to form a vacuum between the substantially flat supporting surface and the substrate.

Abstract: A plating method and apparatus including at least one plating bath including a plating solution used for plating at least one workpiece and a source providing a first current, wherein the first current is supplied to the plating solution when plating the at least one workpiece, and providing a second current, lower than the first current, wherein the second current is supplied to the plating solution during an interruption. The plating method and apparatus may include at least one main bath, at least one main anode, at least one auxiliary bath, at least one auxiliary anode, and/or a conveying unit. A portion of the conveying unit or the at least one workpiece may act as a cathode or anode. The plating method and apparatus may continuously expose a workpiece to a plating solution.