Abstract: A device includes an encapsulation material and a first lead and a second lead protruding out of a surface of the encapsulation material. A recess extends into the surface of the encapsulation material. An elevation is arranged on the surface of the encapsulation material. The first lead protrudes out of the elevation.

Abstract: A semiconductor chip package includes a semiconductor chip, an encapsulation body encapsulating the semiconductor chip, a chip pad, and electrical contact elements connected with the semiconductor chip and extending outwardly. The encapsulation body has six side faces and the electrical contact elements extend exclusively through two opposing side faces which have the smallest surface areas from all the side faces. The semiconductor chip is disposed on the chip pad, and a main face of the chip pad remote from the semiconductor chip is at least partially exposed to the outside.

Abstract: In an embodiment an electronic component includes a semiconductor die having a first surface, the first surface including a first current electrode and a control electrode. The electronic component further includes a die pad having a first surface, a plurality of leads and a gull-wing shaped conductive element coupled to a first lead of the plurality of leads. The first current electrode is mounted on the die pad and the gull-wing shaped conductive element is coupled between the control electrode and the first lead.

Abstract: A lead frame strip includes a plurality of connected unit lead frames, each unit lead frame having a die paddle and a plurality of leads connected to a periphery of the unit lead frame. A semiconductor die is attached to the die paddles. A molding compound covers the unit lead frames, including the semiconductor dies. Prior to testing or other processing of the lead frame strip, a gap is etched into a region of the leads which are shared by adjacent ones of the unit lead frames. The gap extends at least mostly through the shared leads. A partial cut is made in the molding compound around the periphery of the unit lead frames prior to the subsequent processing, including below the gap in the shared leads, to electrically isolate the leads of the unit lead frames.

Abstract: A hybrid leadframe is provided comprising a thin leadframe layer comprising a diepad and a structured region; and a metal layer being thicker than the thin leadframe layer and arranged on the diepad.

Abstract: In an embodiment, a semiconductor device package includes a bidirectional switch circuit. The bidirectional switch circuit includes a first semiconductor transistor mounted on a first die pad, a second semiconductor transistor mounted on a second die pad, the second die pad being separate from the first die pad, and a conductive connector extending between a source electrode of the first transistor and a source electrode of the second transistor.

Abstract: An electronic device includes a semiconductor chip including an electrode, a substrate element and a contact element connecting the electrode to the substrate element. The electronic device further includes an encapsulant configured to leave the contact element at least partially exposed such that a heatsink may be connected to the contact element.

Abstract: A power semiconductor device is provided. The power semiconductor device includes a leadframe, which includes a first chip carrier part and at least one second chip carrier part, which are fitted at a distance from one another and are in each case electrically conductive, at least one first power semiconductor component applied on the first chip carrier part, at least one second power semiconductor component applied on the second chip carrier part, external contacts in the form of external leads, and a capacitor. The capacitor is mounted on two adjacent external leads.

Abstract: In an embodiment an electronic component includes a semiconductor die having a first surface, the first surface including a first current electrode and a control electrode. The electronic component further includes a die pad having a first surface, a plurality of leads and a gull-wing shaped conductive element coupled to a first lead of the plurality of leads. The first current electrode is mounted on the die pad and the gull-wing shaped conductive element is coupled between the control electrode and the first lead.

Abstract: An electronic device includes a semiconductor chip including an electrode, a substrate element and a contact element connecting the electrode to the substrate element. The electronic device further includes an encapsulant configured to leave the contact element at least partially exposed such that a heatsink may be connected to the contact element.

Abstract: Packaged chips comprising non-integer lead pitches, systems and methods for manufacturing packaged chips are disclosed. In one embodiment a packaged device includes a first chip, a package encapsulating the first chip and a plurality of leads protruding from the package, wherein the plurality of leads comprises differing non-integer multiple lead pitches.

Abstract: A lead frame strip includes a plurality of connected unit lead frames, each unit lead frame having a die paddle and a plurality of leads connected to a periphery of the unit lead frame. A semiconductor die is attached to the die paddles. A molding compound covers the unit lead frames, including the semiconductor dies. Prior to testing or other processing of the lead frame strip, a gap is etched into a region of the leads which are shared by adjacent ones of the unit lead frames. The gap extends at least mostly through the shared leads. A partial cut is made in the molding compound around the periphery of the unit lead frames prior to the subsequent processing, including below the gap in the shared leads, to electrically isolate the leads of the unit lead frames.

Abstract: In an embodiment, a semiconductor device package includes a bidirectional switch circuit. The bidirectional switch circuit includes a first semiconductor transistor mounted on a first die pad, a second semiconductor transistor mounted on a second die pad, the second die pad being separate from the first die pad, and a conductive connector extending between a source electrode of the first transistor and a source electrode of the second transistor.

Abstract: Packaged chips comprising non-integer lead pitches, systems and methods for manufacturing packaged chips are disclosed. In one embodiment a packaged device includes a first chip, a package encapsulating the first chip and a plurality of leads protruding from the package, wherein the plurality of leads comprises differing non-integer multiple lead pitches.

Abstract: Semiconductor packages and method of fabricating them are described. In one embodiment, the semiconductor package includes a substrate having a first and a second die attach pad. A first die is disposed over the first die attach pad. A second die is disposed over the second die attach pad. A third die is disposed between the first and the second die. The third die having a first, a second, and a third portion such that the first portion is disposed above a portion of the first die, the second portion is disposed above a portion of the second die, and the third portion is disposed above an area between the first die and the second die.

Abstract: Various embodiments provide a chip arrangement. The chip arrangement may include a first chip including a first contact and a second contact; a second chip; a leadframe including a first leadframe portion and a second leadframe portion electrically insulated from the first leadframe portion; and a plurality of pins coupled to the leadframe. At least one first pin is coupled to the first leadframe portion and at least one second pin is coupled to the second leadframe portion. The first contact of the first chip is electrically coupled to the first leadframe portion and the second contact of the first chip is coupled to the second leadframe portion. A contact of the second chip is electrically coupled to the second leadframe portion.

Abstract: A semiconductor package device having a protruding component portion and a method of packaging the semiconductor device is disclosed. The semiconductor device has a component, such as a leadframe, and a packaging mold body. The packaging mold body is formed around a portion of the component and a recess is formed in the packaging mold body adjacent the protruding portion of the component to prevent the protruding portion of the component from damaging other adjacent and abutting semiconductor devices.

Abstract: In various embodiments, a semiconductor device may include: a carrier; a semiconductor chip disposed over a first side of the carrier; a layer stack disposed between the carrier and the semiconductor chip or over a second side of the carrier opposite the semiconductor chip, or both, the layer stack including at least a first electrically insulating layer, the first electrically insulating layer having a laminate having a first electrically insulating matrix material and a first mechanically stabilizing material embedded in the first electrically insulating matrix material.

Abstract: A method of fabricating a semiconductor package. In one embodiment the method includes forming a mold cavity about a portion of a first major surface of a leadframe, including about a mold lock opening extending through the leadframe between the first major surface and a second major surface. A spacer is inserted to fill at least a portion of the mold lock opening. The mold cavity is filled with an encapsulating material including filling a portion of the mold lock opening not occupied by the spacer.

Abstract: Semiconductor packages and method of fabricating them are described. In one embodiment, the semiconductor package includes a substrate having a first and a second die attach pad. A first die is disposed over the first die attach pad. A second die is disposed over the second die attach pad. A third die is disposed between the first and the second die. The third die having a first, a second, and a third portion such that the first portion is disposed above a portion of the first die, the second portion is disposed above a portion of the second die, and the third portion is disposed above an area between the first die and the second die.