Abstract: Techniques to enable voltage regulators to adjust for coming load changes are presented herein. In some embodiments, a functional block such as a microprocessor core having an associated clock signal is powered by at least one switching-type voltage regulator. When the functional block is about to require an increased level of power, the associated clock is provided to drive the at least one regulator switches overriding their normal drive signal, which has a lower frequency. Thus, the switches are driven at a higher frequency sufficiently prior to (e.g., just ahead of) the load change to reduce the amount of droop that would otherwise occur.

Abstract: Techniques to enable voltage regulators to adjust for coming load changes are presented herein. In some embodiments, a functional block such as a microprocessor core having an associated clock signal is powered by at least one switching-type voltage regulator. When the functional block is about to require an increased level of power, the associated clock is provided to drive the at least one regulator switches overriding their normal drive signal, which has a lower frequency. Thus, the switches are driven at a higher frequency sufficiently prior to (e.g., just ahead of) the load change to reduce the amount of droop that would otherwise occur.

Abstract: A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance interconnect.

Abstract: A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance interconnect.

Abstract: A “digital data stream,” “binary sequence” or word can be generated by a logic circuit such as a processor and the sequence can be converted to a series of pulses such that the content of the sequence can be utilized to accurately control/drive a plurality of power transistors. Accordingly, a regulated voltage can be provided through such a data type output of a processor. Thus, a standard processor that executes data processing operations can provide a low level logic signal as a serial digital transmission, possibly a four bit word, and control a power supply without significant modification. To achieve such a conversion the processor can be capacitively coupled to a voltage level shifter and a delay module to provide a plurality of power transistor drive signals. The converter can be wholly integrated onto a processor or motherboard to eliminate devices and stand alone assemblies that are commonly required in data processing systems.

Abstract: Techniques to enable voltage regulators to adjust for coming load changes are presented herein. In some embodiments, a functional block such as a microprocessor core having an associated clock signal is powered by at least one switching-type voltage regulator. When the functional block is about to require an increased level of power, the associated clock is provided to drive the at least one regulator switches overriding their normal drive signal, which has a lower frequency. Thus, the switches are driven at a higher frequency sufficiently prior to (e.g., just ahead of) the load change to reduce the amount of droop that would otherwise occur.

Abstract: A “digital data stream,” “binary sequence” or word can be generated by a logic circuit such as a processor and the sequence can be converted to a series of pulses such that the content of the sequence can be utilized to accurately control/drive a plurality of power transistors. Accordingly, a regulated voltage can be provided through such a data type output of a processor. Thus, a standard processor that executes data processing operations can provide a low level logic signal as a serial digital transmission, possibly a four bit word, and control a power supply without significant modification. To achieve such a conversion the processor can be capacitively coupled to a voltage level shifter and a delay module to provide a plurality of power transistor drive signals. The converter can be wholly integrated onto a processor or motherboard to eliminate devices and stand alone assemblies that are commonly required in data processing systems.

Abstract: A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.

Abstract: A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance interconnect.

Abstract: The assembly includes a mother board having a processor carrier having a processor attached thereto. A heat sink is thermally coupled to the processor carrier and is located on top of the carrier. A voltage regulating module board is electrically coupled to the processor carrier and is configured to be positioned adjacent to the heat sink and at substantially a right angle to the mother board.

Abstract: A method and apparatus for electrically interconnecting a first circuit board having a power conditioning circuit and a second circuit board having a power dissipating component disposed therebelow along a z (vertical) axis is disclosed. In an illustrative embodiment, the apparatus comprises a first flexible circuit having a first set of raised conductive contacts, the first flexible circuit disposed on a first side of the second circuit board; and a second flexible circuit having a second set of raised conductive contacts, the second flexible circuit disposed on a second side of the second circuit board opposing the first side of the second circuit board.

Abstract: A method, apparatus, and article of manufacture for distributing power to electronic circuits. The apparatus can include one or more power arrays and one or more ground arrays. The power arrays and the ground arrays are located within a single housing. Some embodiments further distribute signals to the electronic circuits. The arrays can be arranged in a linear or coaxial configuration.

Abstract: A method, apparatus, and article of manufacture for improving the thermal efficiency for heat transfer from an electronic device using a vortex heatsink arrangement. The apparatus comprises a fin array having a plurality of fins and having a variable fin density, the fin array including a first fin array region proximate to and in thermal contact with the heat dissipating device; a second fin array region distant from the heat dissipating device. The first fin region includes a first fin density and the second fin region includes a second fin density less than the first fin density.

Abstract: A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance. interconnect.

Abstract: The assembly includes a mother board having a processor carrier having a processor attached thereto. A heat sink is thermally coupled to the processor carrier and is located on top of the carrier. A voltage regulating module board is electrically coupled to the processor carrier and is configured to be positioned adjacent to the heat sink and at substantially a right angle to the mother board.

Abstract: A connector for providing power from a first circuit board to a second circuit board. The apparatus comprises a first conductive member, including a first conductive member first end and a first conductive member second end distal from the first end; a second conductive member disposed within the first conductive member, the second conductive member including a second conductor member first end and a second conductor member second end distal from the second conductor member first end; and one or more first circuit board permanent attachment features for electrical coupling with the first circuit board and second circuit board, and one or more disconnectable conduction features for electrically coupling the connector with the second circuit board.

Abstract: A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.

Abstract: The present invention is described as an integrated electronic assembly. The electronic assembly comprises a heat dissipating device, a power conditioning circuit board, a power dissipating device mounted on a substrate, and a power interconnect assembly. The power conditioning circuit board includes a first side thermally coupled to the heat dissipating device, a power conditioning circuit for producing a conditioned power signal, and an aperture. The power dissipating device has a top surface thermally coupled to the heat dissipation device through an aperture. The substrate includes at least one power conductor disposed proximate at least one of the edges of the substrate. The power interconnection assembly, which electrically couples the conditioned power signal to the substrate and provides substantially all power to the substrate, includes an edge connector assembly removably coupled to the at least one edge of the substrate.

Abstract: A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance. interconnect.

Abstract: A method, apparatus, and article of manufacture for improving the thermal efficiency for heat transfer from an electronic device using a vortex heatsink arrangement. The apparatus comprises a fin array having a plurality of fins and having a variable fin density, the fin array including a first fin array region proximate to and in thermal contact with the heat dissipating device; a second fin array region distant from the heat dissipating device. The first fin region includes a first fin density and the second fin region includes a second fin density less than the first fin density.