Abstract: An information display board with improved display performance by light-extending light sources is revealed. The information display board includes a display board and a plurality of light-extending light sources each of which consists of a light emitting diode (LED) and a reflective panel. The LED has a light emitting side and a backside while the reflective panel is disposed on the light emitting side of the LED for reflecting a part of light emitted from the light emitting side to the display board on the backside to form an expanded area. Thus illuminance and illuminated area of information shown on the display board are increased. By continuous lighting generated, messages/information shown on the information display board such as traffic sign can be read more clearly and comfortably.

Abstract: An information display board with improved display performance by light-extending light sources is revealed. The information display board includes a display board and a plurality of light-extending light sources each of which consists of a light emitting diode (LED) and a reflective panel. The LED has a light emitting side and a backside while the reflective panel is disposed on the light emitting side of the LED for reflecting a part of light emitted from the light emitting side to the display board on the backside to form an expanded area. Thus illuminance and illuminated area of information shown on the display board are increased. By continuous lighting generated, messages/information shown on the information display board such as traffic sign can be read more clearly and comfortably.

Abstract: A light-emitting diode lighting structure for improving back-illumination efficiency is revealed. The light-emitting diode lighting structure is disposed on a substrate and composed of a light emitting diode (LED) and a reflective panel. The LED provided with a packaging lens has a light emitting side and a backside. The reflective panel is arranged at the light emitting side of the LED and located adjacent to the packaging lens. A part of light emitted from the light emitting side is reflected to the substrate by the reflective panel. Thereby the illumination on the substrate at the backside can be increased. Moreover, continuous lighting is generated so that messages shown on signboards can be read more clearly and comfortably when a plurality of LEDs is disposed on and applied to the signboards.

Abstract: A method to passivate a freshly etched metal structure comprises providing a metal surface on a substrate that has been etched by a first particle beam, exposing the metal surface to a passivation gas, and exposing the freshly etched metal structures to a second particle beam in the presence of the passivation gas. The second particle beam may comprise an ion beam or a laser beam. The passivation gas may comprise water vapor, oxygen gas, or hydrocarbon gas.

Abstract: Methods to repair an APSM mask having undercut etch are described. An absorbing layer over a defect on the plate and a first portion of a defect on the plate are removed using a tip of an atomic force microscope. A second portion of the defect is removed using an e-beam induced etching, which includes introducing a first gas over a second portion of the defect to form a first chemistry to etch the defect, and dwelling the e-beam. The absorbing layer having an overhung structure is reconstructed on the plate using an e-beam induced deposition. A second gas is introduced over the plate to form a second chemistry to form an opaque material on the plate. The e-beam is dwelled for a predetermined time to induce forming the opaque material on the plate. For an embodiment, a profile of the defect is measured to control etching.

Abstract: A method to passivate a freshly etched metal structure comprises providing a metal surface on a substrate that has been etched by a first particle beam, exposing the metal surface to a passivation gas, and exposing the freshly etched metal structures to a second particle beam in the presence of the passivation gas. The second particle beam may comprise an electron beam, an ion beam, or a laser beam. The passivation gas may comprise water vapor, oxygen gas, or hydrocarbon gas.

Abstract: A method of forming thin films of materials on an extreme ultraviolet multilayer surface is described. Specifically, an electron beam and a precursor gas are used to locally deposit a capping filling in a pinhole of a multilayer surface. The growth rate, purity, and spatial resolution of the capping filling may be modulated.

Abstract: The present invention discloses a method of fabricating and repairing a mask without damage and an apparatus including a holder to mount a substrate; a stage to position the holder in a chamber; a pumping system to evacuate the chamber; an imaging system to locate an opaque defect in the substrate; a gas delivery system to dispense a reactant gas towards the defect; and an electron delivery system to direct electrons towards the opaque defect.

Abstract: Inspecting a patterned surface using photoemission of electrons includes selecting materials of the patterned surface, selecting a light source to produce a difference in yield of photoelectrons from the materials, applying the light from the light source to the patterned surface, detecting the emission of photoelectrons from the patterned surface, and inspecting the patterned surface based on the detected photoelectron emissions.

Abstract: The present invention discloses a method of increasing the contrast of an EUV mask at inspection by forming a multilayer mirror over a substrate; forming an absorber layer over the multilayer mirror; forming a top layer over the absorber layer; patterning the mask into a first region and a second region; and removing the top layer and the absorber layer in the first region.

Abstract: The present invention discloses a method of fabricating and repairing a mask without damage and an apparatus including a holder to mount a substrate; a stage to position the holder in a chamber; a pumping system to evacuate the chamber; an imaging system to locate an opaque defect in the substrate; a gas delivery system to dispense a reactant gas towards the defect; and an electron delivery system to direct electrons towards the opaque defect.

Abstract: Inspecting a patterned surface using photoemission of electrons includes selecting materials of the patterned surface, selecting a light source to produce a difference in yield of photoelectrons from the materials, applying the light from the light source to the patterned surface, detecting the emission of photoelectrons from the patterned surface, and inspecting the patterned surface based on the detected photoelectron emissions.

Abstract: The present invention discloses a method of increasing the contrast of an EUV mask at inspection by forming a multilayer mirror over a substrate; forming an absorber layer over the multilayer mirror; forming a top layer over the absorber layer; patterning the mask into a first region and a second region; and removing the top layer and the absorber layer in the first region.

Abstract: The present invention discloses a method of increasing the contrast of an EUV mask at inspection by forming a multilayer mirror over a substrate; forming an absorber layer over the multilayer mirror; forming a top layer over the absorber layer; patterning the mask into a first region and a second region; and removing the top layer and the absorber layer in the first region.

Abstract: The present invention discloses a method of fabricating and repairing a mask without damage and an apparatus including a holder to mount a substrate; a stage to position the holder in a chamber; a pumping system to evacuate the chamber; an imaging system to locate an opaque defect in the substrate; a gas delivery system to dispense a reactant gas towards the defect; and an electron delivery system to direct electrons towards the opaque defect.

Abstract: The present invention discloses a method of increasing the contrast of an EUV mask at inspection by forming a multilayer mirror over a substrate; forming an absorber layer over the multilayer mirror; forming a top layer over the absorber layer; patterning the mask into a first region and a second region; and removing the top layer and the absorber layer in the first region.