Patents by Inventor Teddie P. Magbitang
Teddie P. Magbitang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9214335Abstract: The present invention describes a process to modify a top portion of a porous ultra low-k (ULK) material in order to maximize porosity filling with a filling material that initially displayed low compatibility with the ULK material. Surface modification is achieved by a plasma treatment, enhancing the compatibility between the ULK surface and the filling material. The invention obtains high filling levels with minimum modification to the ULK material, as only a thin top portion is modified without significant pore sealing.Type: GrantFiled: April 24, 2014Date of Patent: December 15, 2015Assignee: International Business Machines CorporationInventors: Robert L. Bruce, Geraud J. Dubois, Theo J. Frot, Krystelle Lionti, Teddie P. Magbitang, Willi Volksen
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Publication number: 20150311066Abstract: The present invention describes a process to modify a top portion of a porous ultra low-k (ULK) material in order to maximize porosity filling with a filling material that initially displayed low compatibility with the ULK material. Surface modification is achieved by a plasma treatment, enhancing the compatibility between the ULK surface and the filling material. The invention obtains high filling levels with minimum modification to the ULK material, as only a thin top portion is modified without significant pore sealing.Type: ApplicationFiled: April 24, 2014Publication date: October 29, 2015Applicant: International Business Machines CorporationInventors: Robert L. Bruce, Geraud J. Dubois, Theo J. Frot, Krystelle Lionti, Teddie P. Magbitang, Willi Volksen
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Patent number: 9058983Abstract: In some examples, a process to generate an in-situ hardmask layer on porous dielectric materials using the densifying action of a plasma in conjunction with a sacrificial polymeric filler, the latter which enables control of the hardmask thickness as well as a well-defined interface with the underlying ILD.Type: GrantFiled: June 17, 2013Date of Patent: June 16, 2015Assignee: International Business Machines CorporationInventors: Geraud Jean-Michel Dubois, Theo J. Frot, Teddie P. Magbitang, Willi Volksen
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Publication number: 20140367356Abstract: In some examples, a process to generate an in-situ hardmask layer on porous dielectric materials using the densifying action of a plasma in conjunction with a sacrificial polymeric filler, the latter which enables control of the hardmask thickness as well as a well-defined interface with the underlying ILD.Type: ApplicationFiled: June 17, 2013Publication date: December 18, 2014Inventors: Geraud Jean-Michel Dubois, Theo J. Frot, Teddie P. Magbitang, Willi Volksen
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Patent number: 8871632Abstract: In one embodiment, a program storage device readable by a machine, tangibly embodying a program of instructions executable by the machine for performing operations, includes operations comprising: providing a structure comprising a first layer overlying a substrate, where the first layer comprises a dielectric material having a plurality of pores; applying a filling material to a surface of the first layer, where the filling material comprises a polymer and at least one additive, where the at least one additive comprises at least one of a surfactant, a high molecular weight polymer and a solvent (e.g., a high boiling point solvent); and after applying the filling material, heating the structure to enable the filling material to at least partially fill the plurality of pores uniformly across an area of the first layer, where heating the structure results in residual filling material being uniformly left on the surface of the first layer.Type: GrantFiled: October 19, 2012Date of Patent: October 28, 2014Assignee: International Business Machines CorporationInventors: Geraud Jean-Michel Dubois, Theo J. Frot, Teddie P. Magbitang, Willi Volksen
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Patent number: 8623741Abstract: In one exemplary embodiment, a method includes: providing a structure having a first layer overlying a substrate, where the first layer includes a dielectric material having a plurality of pores; applying a filling material to an exposed surface of the first layer; heating the structure to a first temperature to enable the filling material to homogeneously fill the plurality of pores; after filling the plurality of pores, performing at least one process on the structure; and after performing the at least one process, removing the filling material from the plurality of pores by heating the structure to a second temperature to decompose the filling material.Type: GrantFiled: July 19, 2012Date of Patent: January 7, 2014Assignee: International Business Machines CorporationInventors: Sampath Purushothaman, Geraud Jean-Michel Dubois, Teddie P. Magbitang, Willi Volksen, Theo J. Frot
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Patent number: 8541301Abstract: In one exemplary embodiment, a method includes: providing a structure having a first layer overlying a substrate, where the first layer includes a dielectric material having a plurality of pores; applying a filling material to a surface of the first layer, where the filling material includes a polymer and at least one additive, where the at least one additive includes at least one of a surfactant, a high molecular weight polymer and a solvent; and after applying the filling material, heating the structure to enable the filling material to at least partially fill the plurality of pores uniformly across an area of the first layer, where heating the structure results in residual filling material being uniformly left on the surface of the first layer.Type: GrantFiled: July 12, 2011Date of Patent: September 24, 2013Assignee: International Business Machines CorporationInventors: Geraud Jean-Michel Dubois, Theo J. Frot, Teddie P. Magbitang, Willi Volksen
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Patent number: 8492239Abstract: In one exemplary embodiment, a method includes: providing a structure having a first layer overlying a substrate, where the first layer includes a dielectric material having a plurality of pores; applying a filling material to an exposed surface of the first layer; heating the structure to a first temperature to enable the filling material to homogeneously fill the plurality of pores; after filling the plurality of pores, performing at least one first process on the structure; after performing the at least one first process, removing the filling material from the plurality of pores by heating the structure to a second temperature to decompose the filling material; and after removing the filling material from the plurality of pores, performing at least one second process on the structure, where the at least one second process is performed at a third temperature that is greater than the second temperature.Type: GrantFiled: September 4, 2012Date of Patent: July 23, 2013Assignee: International Business Machines CorporationInventors: Robert L. Bruce, Geraud Jean-Michel Dubois, Theo J. Frot, Teddie P. Magbitang, Sampath Purushothaman, David L. Rath, Willi Volksen
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Publication number: 20130056874Abstract: A semiconductor device is accepted at a stage of its fabrication, at which stage the device includes a diffusion-barrier cap-material (DBCM) layer and an intermetal dielectric layer covering the DBCM layer. The DBCM layer is exposed and it is suitable for removal by an etching procedure in a portion of a pattern contained in the intermetal dielectric layer. A silylation treatment is performed on the semiconductor device prior to the etching procedure for removing the DBCM layer. The intermetal dielectric layer of the completed device has surfaces in contact with metal interconnects and metal vias, and it may have an excess of carbon content near at least a portion of the these surfaces.Type: ApplicationFiled: September 6, 2011Publication date: March 7, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Maxime Darnon, Geraud J.-M. Dubois, Sebastian U. Engelmann, Teddie P. Magbitang, Sampath Purushothaman, Muthumanickam Sankarapandian, Willi Volksen
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Publication number: 20130017688Abstract: In one exemplary embodiment, a method includes: providing a structure having a first layer overlying a substrate, where the first layer includes a dielectric material having a plurality of pores; applying a filling material to a surface of the first layer, where the filling material includes a polymer and at least one additive, where the at least one additive includes at least one of a surfactant, a high molecular weight polymer and a solvent; and after applying the filling material, heating the structure to enable the filling material to at least partially fill the plurality of pores uniformly across an area of the first layer, where heating the structure results in residual filling material being uniformly left on the surface of the first layer.Type: ApplicationFiled: July 12, 2011Publication date: January 17, 2013Applicant: International Business Machines CorporationInventors: Geraud Jean-Michel Dubois, Theo J. Frot, Teddie P. Magbitang, Willi Volksen
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Publication number: 20120329273Abstract: In one exemplary embodiment, a method includes: providing a structure having a first layer overlying a substrate, where the first layer includes a dielectric material having a plurality of pores; applying a filling material to an exposed surface of the first layer; heating the structure to a first temperature to enable the filling material to homogeneously fill the plurality of pores; after filling the plurality of pores, performing at least one first process on the structure; after performing the at least one first process, removing the filling material from the plurality of pores by heating the structure to a second temperature to decompose the filling material; and after removing the filling material from the plurality of pores, performing at least one second process on the structure, where the at least one second process is performed at a third temperature that is greater than the second temperature.Type: ApplicationFiled: September 4, 2012Publication date: December 27, 2012Applicant: International Business Machines CorporationInventors: Robert L. Bruce, Geraud Jean-Michel Dubois, Theo J. Frot, Teddie P. Magbitang, Sampath Purushothaman, David L. Rath, Willi Volksen
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Patent number: 8314005Abstract: In one exemplary embodiment, a method includes: providing a structure having a first layer overlying a substrate, where the first layer includes a dielectric material having a plurality of pores; applying a filling material to an exposed surface of the first layer; heating the structure to a first temperature to enable the filling material to homogeneously fill the plurality of pores; after filling the plurality of pores, performing at least one process on the structure; and after performing the at least one process, removing the filling material from the plurality of pores by heating the structure to a second temperature to decompose the filling material.Type: GrantFiled: January 20, 2011Date of Patent: November 20, 2012Assignee: International Business Machines CorporationInventors: Sampath Purushothaman, Geraud Jean-Michel Dubois, Teddie P. Magbitang, Willi Volksen, Theo J. Frot
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Publication number: 20120282784Abstract: In one exemplary embodiment, a method includes: providing a structure having a first layer overlying a substrate, where the first layer includes a dielectric material having a plurality of pores; applying a filling material to an exposed surface of the first layer; heating the structure to a first temperature to enable the filling material to homogeneously fill the plurality of pores; after filling the plurality of pores, performing at least one process on the structure; and after performing the at least one process, removing the filling material from the plurality of pores by heating the structure to a second temperature to decompose the filling material.Type: ApplicationFiled: July 19, 2012Publication date: November 8, 2012Applicant: International Business Machines CorporationInventors: Sampath Purushothaman, Geraud Jean-Michel Dubois, Teddie P. Magbitang, Willi Volksen, Theo J. Frot
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Publication number: 20110183525Abstract: In one exemplary embodiment, a method includes: providing a structure having a first layer overlying a substrate, where the first layer includes a dielectric material having a plurality of pores; applying a filling material to an exposed surface of the first layer; heating the structure to a first temperature to enable the filling material to homogeneously fill the plurality of pores; after filling the plurality of pores, performing at least one process on the structure; and after performing the at least one process, removing the filling material from the plurality of pores by heating the structure to a second temperature to decompose the filling material.Type: ApplicationFiled: January 20, 2011Publication date: July 28, 2011Applicant: International Business Machines CorporationInventors: Sampath Purushothaman, Geraud Jean-Michel Dubois, Teddie P. Magbitang, Willi Volksen, Theo J. Frot
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Publication number: 20080142930Abstract: A low-k organic dielectric material having stable nano-sized porous is provided as well as a method of fabricating the same. The porous low-k organic dielectric material is made from a composition of matter having a vitrification temperature (Tv-comp) which includes a b-staged thermosetting resin having a vitrification temperate (Tv-resin), a pore generating material, and a reactive additive. The reactive additive lowers Tv-comp below Tv-resin.Type: ApplicationFiled: February 21, 2008Publication date: June 19, 2008Applicants: INTERNATIONAL BUSINESS MACHINES CORPORATION, DOW GLOBAL TECHNOLOGIES, INC.Inventors: Eric Connor, James P. Godschalx, Craig J. Hawker, James L. Hedrick, Victor Yee-Way Lee, Teddie P. Magbitang, Robert D. Miller, Q. Jason Niu, Willi Volksen
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Patent number: 7368483Abstract: A low-k organic dielectric material having stable nano-sized porous is provided as well as a method of fabricating the same. The porous low-k organic dielectric material is made from a composition of matter having a vitrification temperature (Tv-comp) which includes a b-staged thermosetting resin having a vitrification temperate (Tv-resin), a pore generating material, and a reactive additive. The reactive additive lowers Tv-comp below Tv-resin.Type: GrantFiled: April 19, 2004Date of Patent: May 6, 2008Assignees: International Business Machines Corporation, Dow Global Technologies, Inc.Inventors: Eric Connor, James P. Godschalx, Craig J. Hawker, James L. Hedrick, Victor Yee-Way Lee, Teddie P. Magbitang, Robert D. Miller, Q. Jason Niu, Willi Volksen
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Patent number: 7309754Abstract: An encapsulant fluid is provided comprising a mixture of a diene-containing compound and a dienophilic compound. At least one of the diene-containing and the dienophilic compounds is protected so that the compounds do not substantially react with each other at room temperature. The diene-containing and the dienophilic compounds undergo a reversible Diels-Alder polymerization reaction at a polymerization temperature above room temperature to form a solid debondable polymeric encapsulant. Also provided are methods for forming slider assemblies and methods for patterning a slider surface using the encapsulant.Type: GrantFiled: September 26, 2003Date of Patent: December 18, 2007Assignee: Hitachi Global Storage Technologies Netherlands B.V.Inventors: Phillip Joe Brock, Michael W. Chaw, Dan Dawson, Craig Hawker, James L. Hedrick, Teddie P. Magbitang, Dennis McKean, Robert D. Miller, Richard I. Palmisano, Willi Volksen
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Patent number: 7209324Abstract: The invention relates generally to the bonding of one or more sliders in styrene and butadiene polymers. More particularly, the invention relates to planarized slider assemblies formed by using debondable solid encapsulants comprised of styrene and butadiene polymers. The invention also relates to methods that use such encapsulants in conjunction with resists to produce magnetic head sliders having patterned air-bearing surfaces.Type: GrantFiled: June 30, 2003Date of Patent: April 24, 2007Assignee: Hitachi Global Storage Netherlands, B.V.Inventors: Phillip J. Brock, Michael W. Chaw, Dan J. Dawson, Craig J. Hawker, James L. Hedrick, Teddie P. Magbitang, Dennis R. McKean, Robert D. Miller, Richard I. Palmisano, Willi Volksen
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Patent number: 7196872Abstract: A slider assembly is provided comprising a plurality of sliders bonded by a debondable solid encapsulant comprised of different first and second polymers The solid encapsulant is comprised of a polymer prepared by polymerizing an encapsulant fluid comprising a homogeneous mixture of first and second constituents. The first constituent is comprised of a first monomer suitable for in situ polymerization to form the first polymer. The second constituent is comprised of the second polymer or a second monomer suitable for in situ polymerization to form the second polymer. The first constituent does not substantially react with the second constituent. Each slider has a surface that is free from the encapsulant. The encapsulant-free surfaces are coplanar to each other. Also provided are methods for forming the assembly and methods for patterning a slider surface using the encapsulant.Type: GrantFiled: April 29, 2004Date of Patent: March 27, 2007Assignee: Hitachi Global Storage Netherlands, B.V.Inventors: Michael W. Chaw, Dan J. Dawson, Craig J. Hawker, James L. Hedrick, Wesley L. Hillman, Teddie P. Magbitang, Dennis R. McKean, Robert D. Miller, Willi Volksen
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Patent number: 7125467Abstract: A process for fabricating sliders where the sliders are held in place during processing by a solid matrix material is described. A thin coating of a release-layer material is applied on the sliders before encapsulation in the matrix material. The release-layer material is polyvinyl alcohol and more preferably high molecular weight polyvinyl alcohol which is highly hydrolyzed. Use of the release-layer of the invention maintains the process resistance while providing the advantage of allowing easier removal of the matrix material after it is no longer needed. The release-layer can be applied to encapsulant materials including epoxies, acrylates, polyimides, silsesquioxanes and others. After the selected fabrication process such as the formation of air-bearing features an appropriate solvent is applied to soften the polyvinyl alcohol film and allow clean debonding of the sliders.Type: GrantFiled: June 30, 2003Date of Patent: October 24, 2006Assignee: Hitachi Global Storage Technologies Netherlands B.V.Inventors: Phillip Joe Brock, Michael William Chaw, Dan J. Dawson, Craig J. Hawker, James L. Hedrick, Wesley L. Hillman, Teddie P. Magbitang, Dennis R. McKean, Robert D. Miller, Richard I. Palmisano, Jila Tabib, Mark C. Thurber, Willi Volksen