Abstract: A method for automatically inserting connectors and coupling test probes to circuit boards, such as computer system boards and the like. The method is implemented via an apparatus that enables connectors to be automatically inserted into mating connectors on a circuit board device under test (DUT). Connectors may be automatically inserted along 1-4 axes. The apparatus includes replaceable probe/connector plates that are DUT-type specific, as well as DUT-type specific side access units. The apparatus may also be used for inserting memory devices and microprocessors, and further enables peripheral devices to be operatively coupled to expansion bus connectors on the DUT. In one embodiment, a single actuator is employed to actuate up to four insertion axes simultaneously.

Abstract: An apparatus for automatically inserting connectors and coupling test probes to circuit boards, such as computer system boards and the like. The apparatus enables connectors to be automatically inserted into mating connectors on a circuit board device under test (DUT). Connectors may be automatically inserted along 1-4 axes. The apparatus includes replaceable probe/connector plates that are DUT-type specific, as well as DUT-type specific side access units. The apparatus may also be used for inserting memory devices and microprocessors, and further enables peripheral devices to be operatively coupled to expansion bus connectors on the DUT. In one embodiment, a single actuator is employed to actuate up to four insertion axes simultaneously.

Abstract: In some embodiments, apparatuses and methods for improving ball-grid-array solder joint reliability in printed circuit boards. Such apparatuses may comprise, in an exemplary embodiment, a stiffened printed circuit board defining one or more cavities therein and including one or more stiffening members positioned, respectively, in the one or more cavities. The cavities and embedded stiffening members may be located proximate a ball-grid-array device footprint so as to resist deflection caused by the application of forces to the board by test probe pins during testing. Such methods may include, in an exemplary embodiment, creating one or more cavities in a middle sub-layer of a core layer of a stiffened printed circuit board and inserting one or more stiffening members, respectively, therein. Top and bottom sub-layers may then be secured to top and bottom surfaces of the middle sub-layer to complete the core layer. Other embodiments are also described and claimed.

Abstract: Test modules, systems, and methods employing capacitors for the testing of the solder joint connections between a printed circuit board (PCB) and a socket of a device are presented in embodiments of the current invention. A test module having capacitors in parallel, and in particular embedded capacitors, can be used to test tied traces and their solder joint connections by measuring the total capacitance of the capacitors. Embodiments of the current invention present no-power tests that can be used with a variety of testing platforms and test fixtures, such as in-circuit testing (ICT) and manufacturing defect analysis (MDA.) Additionally, the test module can be used with a variety of sockets, such as a ball grid array, a pinned grid array, and a land grid array.

Abstract: An apparatus and method for automatically testing circuit boards, such as computer system boards and the like. The circuit board device under test (DUT) is loaded into an automated test apparatus (tester), which includes a mechanism for automatically connecting test electronics to various DUT circuitry and I/O ports via corresponding connectors on the DUT. A type of DUT is identified, and a corresponding set of tests are performed to verify the operation of the DUT. Appropriate power signals and sequencing are also applied to the DUT, as defined by it type. Data logging is performed to log the results of the testing. The apparatus includes replaceable probe/connector plates that are DUT-type specific and corresponding universal electronics and cabling to enable a variety of different board types to be tested with the same apparatus.

Abstract: Test modules, systems, and methods employing capacitors for the testing of the solder joint connections between a printed circuit board (PCB) and a socket of a device are presented in embodiments of the current invention. A test module having capacitors in parallel, and in particular embedded capacitors, can be used to test tied traces and their solder joint connections by measuring the total capacitance of the capacitors. Embodiments of the current invention present no-power tests that can be used with a variety of testing platforms and test fixtures, such as in-circuit testing (ICT) and manufacturing defect analysis (MDA.) Additionally, the test module can be used with a variety of sockets, such as a ball grid array, a pinned grid array, and a land grid array.

Abstract: An apparatus and method for automatically testing circuit boards, such as computer system boards and the like. The circuit board device under test (DUT) is loaded into an automated test apparatus (tester), which includes a mechanism for automatically connecting test electronics to various DUT circuitry and I/O ports via corresponding connectors on the DUT. A type of DUT is identified, and a corresponding set of tests are performed to verify the operation of the DUT. Appropriate power signals and sequencing are also applied to the DUT, as defined by it type. Data logging is performed to log the results of the testing. The apparatus includes replaceable probe/connector plates that are DUT-type specific and corresponding universal electronics and cabling to enable a variety of different board types to be tested with the same apparatus.

Abstract: An apparatus and method for automatically inserting connectors and coupling test probes to circuit boards, such as computer system boards and the like. The apparatus enables connectors to be automatically inserted into mating connectors on a circuit board device under test (DUT). Connectors may be automatically inserted along 1–4 axes. The apparatus includes replaceable probe/connector plates that are DUT-type specific, as well as DUT-type specific side access units. The apparatus may also be used for inserting memory devices and microprocessors, and further enables peripheral devices to be operatively coupled to expansion bus connectors on the DUT. In one embodiment, a single actuator is employed to actuate up to four insertion axes simultaneously.

Abstract: Test modules, systems, and methods employing capacitors for the testing of the solder joint connections between a printed circuit board (PCB) and a socket of a device are presented in embodiments of the current invention. A test module having capacitors in parallel, and in particular embedded capacitors, can be used to test tied traces and their solder joint connections by measuring the total capacitance of the capacitors. Embodiments of the current invention present no-power tests that can be used with a variety of testing platforms and test fixtures, such as in-circuit testing (ICT) and manufacturing defect analysis (MDA.) Additionally, the test module can be used with a variety of sockets, such as a ball grid array, a pinned grid array, and a land grid array.

Abstract: An apparatus and method for automatically testing circuit boards, such as computer system boards and the like. The circuit board device under test (DUT) is loaded into an automated test apparatus (tester), which includes a mechanism for automatically connecting test electronics to various DUT circuitry and I/O ports via corresponding connectors on the DUT. A type of DUT is identified, and a corresponding set of tests are performed to verify the operation of the DUT. Appropriate power signals and sequencing are also applied to the DUT, as defined by it type. Data logging is performed to log the results of the testing. The apparatus includes replaceable probe/connector plates that are DUT-type specific and corresponding universal electronics and cabling to enable a variety of different board types to be tested with the same apparatus.

Abstract: An apparatus and method for automatically inserting connectors and coupling test probes to circuit boards, such as computer system boards and the like. The apparatus enables connectors to be automatically inserted into mating connectors on a circuit board device under test (DUT). Connectors may be automatically inserted along 1-4 axes. The apparatus includes replaceable probe/connector plates that are DUT-type specific, as well as DUT-type specific side access units. The apparatus may also be used for inserting memory devices and microprocessors, and further enables peripheral devices to be operatively coupled to expansion bus connectors on the DUT. In one embodiment, a single actuator is employed to actuate up to four insertion axes simultaneously.

Abstract: An apparatus and method for automatically testing circuit boards, such as computer system boards and the like. The circuit board device under test (DUT) is loaded into an automated test apparatus (tester), which includes a mechanism for automatically connecting test electronics to various DUT circuitry and I/O ports via corresponding connectors on the DUT. A type of DUT is identified, and a corresponding set of tests are performed to verify the operation of the DUT. Appropriate power signals and sequencing are also applied to the DUT, as defined by it type. Data logging is performed to log the results of the testing. The apparatus includes replaceable probe/connector plates that are DUT-type specific and corresponding universal electronics and cabling to enable a variety of different board types to be tested with the same apparatus.