Patents by Inventor Telesphor Kamgaing

Telesphor Kamgaing has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • 3D ARRAYED GLASS-BASED MMWAVE AND THZ STRUCTURES
    Publication number: 20230208010
    Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a core, where the core comprises glass. In an embodiment, an electromagnetic wave launcher is embedded in the core. In an embodiment, the electromagnetic wave launcher comprises a fin, where the fin is a conductive material, and where the fin comprises a stepped profile.
    Type: Application
    Filed: December 24, 2021
    Publication date: June 29, 2023
    Inventors: Georgios C. DOGIAMIS, Aleksandar ALEKSOV, Veronica STRONG, Telesphor KAMGAING, Neelam PRABHU GAUNKAR, Brandon RAWLINGS
  • WIDEBAND ANTENNAS IN GLASS THROUGH DIRECT VIA FEEDING AND GLASS STACKING
    Publication number: 20230208009
    Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a core, where the core comprises glass. In an embodiment, a buildup layer is over the core. In an embodiment, a patch antenna with a first patch is under the core, and a second patch is over a surface of the core opposite from the first patch. In an embodiment, the electronic package further comprises a via through the core and coupled to the patch antenna.
    Type: Application
    Filed: December 23, 2021
    Publication date: June 29, 2023
    Inventors: Neelam PRABHU GAUNKAR, Georgios C. DOGIAMIS, Telesphor KAMGAING, Aleksandar ALEKSOV, Brandon RAWLINGS, Veronica STRONG
  • SUSPENDED STRUCTURES IN GLASS USING MODIFIED GLASS PATTERNING PROCESSES
    Publication number: 20230207408
    Abstract: Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, an electronic package comprises a core. In an embodiment, the core comprises glass. In an embodiment, a blind via is provided into the core. In an embodiment, a plate spans across the blind via.
    Type: Application
    Filed: December 24, 2021
    Publication date: June 29, 2023
    Inventors: Georgios C. DOGIAMIS, Aleksandar ALEKSOV, Telesphor KAMGAING, Neelam PRABHU GAUNKAR, Brandon RAWLINGS, Veronica STRONG
  • ULTRA LOW LOSS AND HIGH-DENSITY ROUTING BETWEEN CORES
    Publication number: 20230207406
    Abstract: Embodiments disclosed herein include a package core. In an embodiment, the package core includes a first layer, where the first layer comprises glass. In an embodiment, a second layer is over the first layer, where the second layer comprises glass. In an embodiment, a third layer is over the second layer, where the third layer comprises glass. In an embodiment, a first trace is between the first layer and the second layer. In an embodiment, a second trace is between the second layer and the third layer.
    Type: Application
    Filed: December 24, 2021
    Publication date: June 29, 2023
    Inventors: Arghya SAIN, Andrew P. COLLINS, Sivaseetharaman PANDI, Jianyong XIE, Telesphor KAMGAING
  • PLATE-UP HYBRID STRUCTURES USING MODIFIED GLASS PATTERNING PROCESSES
    Publication number: 20230207407
    Abstract: Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, an electronic package comprises a core, where the core comprises glass. In an embodiment, a via opening is formed through the core. In an embodiment, the via opening has an aspect ratio (depth:width) that is approximately 5:1 or greater. In an embodiment, the electronic package further comprises a via in the via opening, where the via opening is fully filled.
    Type: Application
    Filed: December 24, 2021
    Publication date: June 29, 2023
    Inventors: Georgios C. DOGIAMIS, Telesphor KAMGAING, Brandon RAWLINGS, Neelam PRABHU GAUNKAR, Veronica STRONG, Aleksandar ALEKSOV
  • ULTRA LOW LOSS ROUTING BETWEEN GLASS CORES
    Publication number: 20230207405
    Abstract: Embodiments disclosed herein include electronic devices. In an embodiment, an electronic device comprises a core, where the core comprises a first layer comprising glass, and a second layer comprising glass over the first layer. In an embodiment, a trace is between the first layer and the second layer. In an embodiment, routing layers are on the core.
    Type: Application
    Filed: December 24, 2021
    Publication date: June 29, 2023
    Inventors: Arghya SAIN, Andrew P. COLLINS, Sivaseetharaman PANDI, Telesphor KAMGAING, Tolga ACIKALIN, Shuhei YAMADA
  • SINGLE LAYER AND MULTILAYER MAGNETIC INDUCTORS BETWEEN SUBSTRATE CORES
    Publication number: 20230207494
    Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a first layer that comprises glass. In an embodiment, a second layer comprising glass is over the first layer. In an embodiment, the electronic package further comprises an inductor between the first layer and the second layer.
    Type: Application
    Filed: December 24, 2021
    Publication date: June 29, 2023
    Inventors: Jianyong XIE, Andrew P. COLLINS, Arghya SAIN, Sivaseetharaman PANDI, Telesphor KAMGAING
  • COAXIAL INDUCTORS FABRICATED THROUGH A DRILL-LESS VIA PROCESS
    Publication number: 20230207404
    Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a substrate, where the substrate comprises glass. In an embodiment, a via opening is formed through the substrate, where the via opening has an hourglass shaped profile. In an embodiment, a magnetic layer fills the via opening, and a via is through the magnetic layer. In an embodiment, sidewalls of the via are substantially vertical.
    Type: Application
    Filed: December 23, 2021
    Publication date: June 29, 2023
    Inventors: Telesphor KAMGAING, Georgios C. DOGIAMIS, Veronica STRONG, Aleksandar ALEKSOV, Brandon RAWLINGS, Neelam PRABHU GAUNKAR
  • INDUCTOR WITH INTEGRATED MAGNETICS
    Publication number: 20230207493
    Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a substrate, where the substrate comprises glass. In an embodiment, a magnetic ring is embedded in the substrate. In an embodiment, a loop is around the magnetic ring. In an embodiment, the loop is conductive and comprises a first via through the substrate, a second via through the substrate, and a trace over a surface of the substrate, where the trace electrically couples the first via to the second via.
    Type: Application
    Filed: December 23, 2021
    Publication date: June 29, 2023
    Inventors: Telesphor KAMGAING, Aleksandar ALEKSOV, Veronica STRONG, Neelam PRABHU GAUNKAR, Brandon RAWLINGS, Gerogios C. DOGIAMIS
  • VIA MICRO-MODULES FOR THROUGH MOLD VIA REPLACEMENT
    Publication number: 20230207436
    Abstract: Embodiments disclosed herein include die modules, electronic packages, and systems. In an embodiment, a die module comprises a first substrate and a first die over the first substrate. In an embodiment, the die module further comprises a second die over the first substrate adjacent to the first die. In an embodiment, the die module further comprises a via module through the first substrate. In an embodiment, the via module comprises a second substrate, where the second substrate comprises glass, and a via through the second substrate.
    Type: Application
    Filed: December 23, 2021
    Publication date: June 29, 2023
    Inventors: Adel A. ELSHERBINI, Telesphor KAMGAING
  • COAXIAL INDUCTOR WITH PLATED HIGH RESISTIVITY AND HIGH PERMEABILITY MAGNETIC MATERIAL
    Publication number: 20230207492
    Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a substrate, where the substrate comprises glass. In an embodiment, a via opening is formed through a thickness of the substrate, and a first layer is over sidewalls of the via opening. In an embodiment, the first layer comprises a magnetic material. In an embodiment, a second layer is over the first layer, where the second layer is an insulator. In an embodiment, a third layer fills the via opening, where the third layer is a conductor.
    Type: Application
    Filed: December 23, 2021
    Publication date: June 29, 2023
    Inventors: Aleksandar ALEKSOV, Georgios C. DOGIAMIS, Neelam PRABHU GAUNKAR, Telesphor KAMGAING, Veronica STRONG, Brandon RAWLINGS, Robert MONGRAIN, Beomseok CHOI
  • Bridge for radio frequency (RF) multi-chip modules
    Patent number: 11688660
    Abstract: Embodiments may relate to a radio frequency (RF) multi-chip module that includes a first RF die and a second RF die. The first and second RF dies may be coupled with a package substrate at an inactive side of the respective dies. A bridge may be coupled with an active side of the first and second RF dies die such that the first and second RF dies are communicatively coupled through the bridge, and such that the first and second RF dies are at least partially between the package substrate and the bridge. Other embodiments may be described or claimed.
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: June 27, 2023
    Assignee: Intel Corporation
    Inventors: Aleksandar Aleksov, Feras Eid, Georgios Dogiamis, Telesphor Kamgaing, Johanna M. Swan
  • EMBEDDED BATTERIES WITHIN GLASS CORES OF PACKAGE SUBSTRATES
    Publication number: 20230198058
    Abstract: Embedded batteries within glass cores are disclosed. Example apparatus include a glass core layer having opposing first and second surfaces, the glass core layer including a cavity extending from the first surface toward the second surface, and a battery including a first conductive material positioned in the cavity, a second conductive material positioned in the cavity, and an electrolyte to separate the first conductive material from the second conductive material.
    Type: Application
    Filed: December 20, 2021
    Publication date: June 22, 2023
    Inventors: Veronica Strong, Telesphor Kamgaing, Neelam Prabhu Gaunkar, Georgios Dogiamis, Aleksandar Aleksov, Brandon Rawlings
  • POWER DELIVERY TECHNIQUES FOR GLASS SUBSTRATE WITH HIGH DENSITY SIGNAL VIAS
    Publication number: 20230197592
    Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a core with a first surface and a second surface, where the core comprises glass. In an embodiment, a first buildup layer is over the first surface of the core, and a second buildup layer is under the second surface of the core. In an embodiment, the electronic package further comprises a via through the core between the first surface of the core and the second surface of the core, and a plane into the first surface of the core, where a width of the plane is greater than a width of the via.
    Type: Application
    Filed: December 16, 2021
    Publication date: June 22, 2023
    Inventors: Telesphor KAMGAING, Brandon RAWLINGS, Aleksandar ALEKSOV, Andrew P. COLLINS, Georgios C. DOGIAMIS, Veronica STRONG, Neelam PRABHU GAUNKAR
  • GLASS VIAS AND PLANES WITH REDUCED TAPERING
    Publication number: 20230197541
    Abstract: Embodiments disclosed herein include an electronic package that comprises a substrate with a first surface and a second surface opposite from the first surface. In an embodiment, the substrate comprises glass. In an embodiment, the electronic package further comprises an opening through the substrate from the first surface to the second surface, where the opening comprises a first end proximate to the first surface of the substrate, a second end proximate to the second surface of the substrate, and a middle region between the first end and the second end. In an embodiment, the middle region has a discontinuous slope at junctions with the first end and the second end.
    Type: Application
    Filed: December 21, 2021
    Publication date: June 22, 2023
    Inventors: Veronica STRONG, Telesphor KAMGAING, Aleksandar ALEKSOV, Georgios C. DOGIAMIS, Brandon RAWLINGS, Neelam PRABHU GAUNKAR
  • MULTILAYER GLASS SUBSTRATE
    Publication number: 20230197618
    Abstract: Embodiments herein relate to systems, apparatuses, techniques, or processes for packages that include multiple glass layers within the package. In embodiments, a core of the package may include multiple glass layers that may be bonded together, or may be separated by a dielectric layer between glass layers. In embodiments, the glass layers may include one or more electrically conductive features, such as conductive vias, conductive planes, electrical pads, electrical traces, redistribution layer, capacitors, inductors, active dies and/or passive dies. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: December 21, 2021
    Publication date: June 22, 2023
    Inventor: Telesphor KAMGAING
  • METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE FOR INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH HIGH ASPECT RATIO THROUGH GLASS VIAS
    Publication number: 20230197620
    Abstract: Methods, systems, apparatus, and articles of manufacture are disclosed for integrated circuit package substrates with high aspect ratio through glass vias. An example microelectronic package including a glass substrate including a via, the via including a high aspect ratio. The example microelectronic package further including a seed layer extending substantially evenly along an inner wall of the via.
    Type: Application
    Filed: December 21, 2021
    Publication date: June 22, 2023
    Inventors: Veronica Strong, Aleksandar Aleksov, Georgios Dogiamis, Telesphor Kamgaing, Neelam Prabhu Gaunkar, Brandon Rawlings
  • LOW LOSS MICROSTRIP AND STRIPLINE ROUTING WITH BLIND TRENCH VIAS FOR HIGH SPEED SIGNALING ON A GLASS CORE
    Publication number: 20230197646
    Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a substrate with a first surface and a second surface opposite from the first surface, where the substrate comprises glass. In an embodiment, the electronic package further comprises a trace embedded in the substrate, where a width of the trace is less than a height of the trace. In an embodiment, the electronic package further comprises a first layer on the first surface of the substrate, where the first layer is a dielectric buildup film, and a second layer on the second surface of the substrate, where the second layer is the dielectric buildup film.
    Type: Application
    Filed: December 21, 2021
    Publication date: June 22, 2023
    Inventors: Aleksandar ALEKSOV, Telesphor KAMGAING, Georgios C. DOGIAMIS, Neelam PRABHU GAUNKAR, Veronica STRONG, Brandon RAWLINGS, Andrew P. COLLINS, Arghya SAIN, Sivaseetharaman PANDI
  • COUPLED FINS WITH BLIND TRENCH STRUCTURES
    Publication number: 20230197593
    Abstract: Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a core, where the core comprises glass, and a first via through the core. In an embodiment, a first fin extends out laterally from the first via. In an embodiment, the electronic package further comprises a second via through the core, and a second fin extending out laterally from the second via. In an embodiment, a face of the first fin overlaps a face of the second fin.
    Type: Application
    Filed: December 16, 2021
    Publication date: June 22, 2023
    Inventors: Sivaseetharaman PANDI, Andrew P. COLLINS, Arghya SAIN, Telesphor KAMGAING
  • Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems
    Patent number: 11658418
    Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.
    Type: Grant
    Filed: May 11, 2021
    Date of Patent: May 23, 2023
    Assignee: Intel Corporation
    Inventors: Feras Eid, Sasha N. Oster, Telesphor Kamgaing, Georgios C. Dogiamis, Aleksandar Aleksov