Patents by Inventor Teng-Feng Lin

Teng-Feng Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11943525
    Abstract: An electronic camera assembly includes a camera chip cube bonded to camera bondpads of an interposer; at least one light-emitting diode (LED) bonded to LED bondpads of the interposer at the same height as the camera bondpads; and a housing extending from the interposer and LEDs to the height of the camera chip cube, with light guides extending from the LEDs through the housing to a top of the housing. In embodiments, the electronic camera assembly includes a cable coupled to the interposer. In typical embodiments the camera chip cube has footprint dimensions of less than three and a half millimeters square.
    Type: Grant
    Filed: February 17, 2022
    Date of Patent: March 26, 2024
    Assignee: OmniVision Technologies, Inc.
    Inventors: Teng-Sheng Chen, Wei-Ping Chen, Jau-Jan Deng, Wei-Feng Lin
  • Publication number: 20240097038
    Abstract: A semiconductor device, including a substrate, a first source/drain region, a second source/drain region, and a gate structure, is provided. The substrate has an extra body portion and a fin protruding from a top surface of the substrate, wherein the fin spans the extra body portion. The first source/drain region and the second source/drain region are in the fin. The gate structure spans the fin, is located above the extra body portion, and is located between the first source/drain region and the second source/drain region.
    Type: Application
    Filed: October 13, 2022
    Publication date: March 21, 2024
    Applicant: United Microelectronics Corp.
    Inventors: Yi Chuen Eng, Tzu-Feng Chang, Teng-Chuan Hu, Yi-Wen Chen, Yu-Hsiang Lin
  • Publication number: 20090048840
    Abstract: The conversion device is connected, by a wired or wireless means, to an input/output port of a computing device installed with an instant messaging software. As instant messages are exchanged, the conversion device is activated by the instant messaging software to produce audio and/or visual responses in accordance with specific texts, symbols, and graphical images contained in the messages received. The conversion device could have an appealing appearance such as a doll, a puppet, or a toy figure. The conversion device can further contain at least an actuation mechanism such that, when activated, the conversion device sends a specific signal to the instant messaging software which encodes and packages the signal into a message and delivers the message to a remote computing device.
    Type: Application
    Filed: August 13, 2007
    Publication date: February 19, 2009
    Inventor: Teng-Feng LIN
  • Patent number: 7417854
    Abstract: A computing device whose components are separately housed in a main enclosure and at least a secondary enclosure is provided herein. The motherboard, power supply, adaptor card, hard disk drive, etc., are housed in the main enclosure while the peripheral storage devices of the computing device such as optical disk drives and hard disk drives are placed in at least a secondary enclosure. An appropriate signal link is maintained between the main enclosure and the secondary enclosure so that the components in the main enclosure could access the peripheral storage device in the secondary enclosure. Additionally, the secondary enclosure could be connected to another device such as a second computer or a TV so as to share the peripheral storage device in the secondary enclosure.
    Type: Grant
    Filed: December 12, 2005
    Date of Patent: August 26, 2008
    Assignee: East Best Co., Ltd.
    Inventor: Teng-Feng Lin
  • Patent number: 7239510
    Abstract: An enclosure for housing various components of a computing device is provided herein, which contains at least three L-shaped corner members, at least three elongated wall members, a top cover member, and a bottom cover member. The corner members and the wall members are interleaved and joined to form a polygonal circumference for the enclosure. The top and bottom cover members are fixed to the top and bottom of the circumference respectively into a closed, polygonal-shaped enclosure so that a component of the computing device such as the motherboard, optical disk drive, hard disk drive, etc., could be housed therewithin.
    Type: Grant
    Filed: December 12, 2005
    Date of Patent: July 3, 2007
    Assignee: East Best Co., Ltd.
    Inventor: Teng-Feng Lin
  • Publication number: 20070133163
    Abstract: A computing device whose components are separately housed in a main enclosure and at least a secondary enclosure is provided herein. The motherboard, power supply, adaptor card, hard disk drive, etc., are housed in the main enclosure while the peripheral storage devices of the computing device such as optical disk drives and hard disk drives are placed in at least a secondary enclosure. An appropriate signal link is maintained between the main enclosure and the secondary enclosure so that the components in the main enclosure could access the peripheral storage device in the secondary enclosure. Additionally, the secondary enclosure could be connected to another device such as a second computer or a TV so as to share the peripheral storage device in the secondary enclosure.
    Type: Application
    Filed: December 12, 2005
    Publication date: June 14, 2007
    Inventor: Teng-Feng Lin
  • Publication number: 20070133161
    Abstract: An enclosure for housing various components of a computing device is provided herein, which contains at least three L-shaped corner members, at least three elongated wall members, a top cover member, and a bottom cover member. The corner members and the wall members are interleaved and joined to form a polygonal circumference for the enclosure. The top and bottom cover members are fixed to the top and bottom of the circumference respectively into a closed, polygonal-shaped enclosure so that a component of the computing device such as the motherboard, optical disk drive, hard disk drive, etc., could be housed therewithin.
    Type: Application
    Filed: December 12, 2005
    Publication date: June 14, 2007
    Inventor: Teng-Feng Lin