Patents by Inventor Teng-Huei Huang

Teng-Huei Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LED PACKAGE
    Publication number: 20030234431
    Abstract: A LED package is comprised of a flat panel base and three LED dies. The flat panel base is composed of a first golden film area, a second golden film area, a third golden film area, a fourth golden film area, a first connection area, and a second connection area, wherein the first connection area and the second connection area are connected to the first golden film area. The first LED die is attached on the flat panel base by flip-chip mounting, wherein an anode of the first LED die is connected to the first golden film area, and a cathode of the first LED die is connected to the second golden film area. The second LED die is attached on the flat panel base by flip-chip mounting, wherein the second LED die is composed of an anode connected to the first golden film area, and a cathode connected to the fourth golden film area.
    Type: Application
    Filed: October 17, 2002
    Publication date: December 25, 2003
    Applicant: Advanced Optoelectronic Technology Inc.
    Inventors: Teng-Huei Huang, Chuan-Ming Chang, Tse-Min Mao, Min-Huang Huang
  • LED package
    Patent number: 6667497
    Abstract: A LED package is comprised of a flat panel base and three LED dies. The flat panel base is composed of a first golden film area, a second golden film area, a third golden film area, a fourth golden film area, a first connection area, and a second connection area, wherein the first connection area and the second connection area are connected to the first golden film area. The first LED die is attached on the flat panel base by flip-chip mounting, wherein an anode of the first LED die is connected to the first golden film area, and a cathode of the first LED die is connected to the second golden film area. The second LED die is attached on the flat panel base by flip-chip mounting, wherein the second LED die is composed of an anode connected to the first golden film area, and a cathode connected to the fourth golden film area.
    Type: Grant
    Filed: October 17, 2002
    Date of Patent: December 23, 2003
    Assignee: Advanced Optoelectronic Technology
    Inventors: Teng-Huei Huang, Chuan-Ming Chang, Tse-Min Mao, Min-Huang Huang