Patents by Inventor Teng-Kai CHEN

Teng-Kai CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11831105
    Abstract: A connector assembly includes an insulative housing, first and second conductive ground wafers (see e.g., 661 and 663) and a plurality of grounding links. The insulative housing has a plurality of conductive signal terminals disposed therein (see e.g., 662). The insulative housing has opposite side surfaces and a plurality of openings therein extending between the side surfaces. The second ground wafer is spaced from and parallel to the first ground wafer. The grounding links are electrically connected to one of the ground wafers and extend towards another of the ground wafers and extend through the openings in the housing.
    Type: Grant
    Filed: November 10, 2022
    Date of Patent: November 28, 2023
    Assignee: Molex, LLC
    Inventors: Teng-Kai Chen, John C. Laurx, Li Zhuang
  • Publication number: 20230076987
    Abstract: A connector assembly includes an insulative housing, first and second conductive ground wafers (see e.g., 661 and 663) and a plurality of grounding links. The insulative housing has a plurality of conductive signal terminals disposed therein (see e.g., 662). The insulative housing has opposite side surfaces and a plurality of openings therein extending between the side surfaces. The second ground wafer is spaced from and parallel to the first ground wafer. The grounding links are electrically connected to one of the ground wafers and extend towards another of the ground wafers and extend through the openings in the housing.
    Type: Application
    Filed: November 10, 2022
    Publication date: March 9, 2023
    Inventors: Teng-Kai CHEN, John C. LAURX, Li ZHUANG
  • Patent number: 11509100
    Abstract: A connector assembly includes an insulative housing, first and second conductive ground wafers (see e.g., 661 and 663) and a plurality of grounding links. The insulative housing has a plurality of conductive signal terminals disposed therein (see e.g., 662). The insulative housing has opposite side surfaces and a plurality of openings therein extending between the side surfaces. The second ground wafer is spaced from and parallel to the first ground wafer. The grounding links are electrically connected to one of the ground wafers and extend towards another of the ground wafers and extend through the openings in the housing.
    Type: Grant
    Filed: January 8, 2019
    Date of Patent: November 22, 2022
    Assignee: Molex, LLC
    Inventors: Teng-Kai Chen, John C. Laurx, Li Zhuang
  • Publication number: 20220039250
    Abstract: Connector (1300) and printed circuit board combinations include opposing electrical ground structures that increase electrical coupling. The combinations also reduce unwanted crosstalk between signals in a printed circuit board.
    Type: Application
    Filed: September 25, 2019
    Publication date: February 3, 2022
    Applicant: Molex, LLC
    Inventors: Peerouz AMLESHI, Pu XIE, David L. BRUNKER, Timothy R. MCCLELLAND, Teng-Kai CHEN
  • Publication number: 20210066862
    Abstract: A connector assembly includes an insulative housing, first and second conductive ground wafers (see e.g., 661 and 663) and a plurality of grounding links. The insulative housing has a plurality of conductive signal terminals disposed therein (see e.g., 662). The insulative housing has opposite side surfaces and a plurality of openings therein extending between the side surfaces. The second ground wafer is spaced from and parallel to the first ground wafer. The grounding links are electrically connected to one of the ground wafers and extend towards another of the ground wafers and extend through the openings in the housing.
    Type: Application
    Filed: January 8, 2019
    Publication date: March 4, 2021
    Applicant: Molex, LLC
    Inventors: Teng-Kai CHEN, John C. LAURX, Li ZHUANG
  • Patent number: 9691525
    Abstract: A coaxial cable is disclosed that may include an inner conductor and an outer conductor surrounding the inner conductor in a coaxial relationship. The coaxial cable may also include an insulative material located between the inner conductor and the outer conductor. A thickness of the insulative material between the inner conductor and the outer conductor may be increased in every direction at a bent portion of the coaxial cable as compared to the thickness of the insulative material between the inner conductor and the outer conductor at a non-bent portion of the coaxial cable.
    Type: Grant
    Filed: March 24, 2015
    Date of Patent: June 27, 2017
    Assignee: FUJITSU LIMITED
    Inventor: Teng-Kai Chen
  • Publication number: 20160284443
    Abstract: A coaxial cable is disclosed that may include an inner conductor and an outer conductor surrounding the inner conductor in a coaxial relationship. The coaxial cable may also include an insulative material located between the inner conductor and the outer conductor. A thickness of the insulative material between the inner conductor and the outer conductor may be increased in every direction at a bent portion of the coaxial cable as compared to the thickness of the insulative material between the inner conductor and the outer conductor at a non-bent portion of the coaxial cable.
    Type: Application
    Filed: March 24, 2015
    Publication date: September 29, 2016
    Inventor: Teng-Kai CHEN
  • Publication number: 20160284442
    Abstract: A coaxial cable as disclosed may include an inner conductor and an outer conductor surrounding the inner conductor in a coaxial relationship. The coaxial cable may also include a first insulative material located between the inner conductor and the outer conductor at a non-bent portion of the coaxial cable and a bent portion of the coaxial cable. The first insulative material may have a first dielectric constant. The coaxial cable may also include a second insulative material located between the inner conductor and the outer conductor at the bent portion of the coaxial cable. The second insulative material may have a second dielectric constant that may be less than the first dielectric constant.
    Type: Application
    Filed: March 24, 2015
    Publication date: September 29, 2016
    Inventor: Teng-Kai CHEN