Patents by Inventor Teng-Ming Hoong

Teng-Ming Hoong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • NITRIDATION PROCESS
    Publication number: 20080200039
    Abstract: The invention is directed to a nitridation process for a wafer. The nitridation process comprises steps of disposing the wafer on a top surface of a chuck in a nitridation process tool, wherein a plurality of concentric pipe coils is disposed close to the bottom surface of the chuck. Then, the chuck is heated and the chuck is regionally cooling down by applying a coolant into the concentric pipe coils, wherein the flow rates of the coolant in the concentric pipe coils are different from each other. Furthermore, a plasma nitridation process is performed on the wafer.
    Type: Application
    Filed: February 16, 2007
    Publication date: August 21, 2008
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Wenshen Li, Chien-Kee Pang, Ching-Yang Wen, Teng-Ming Hoong