Patents by Inventor Teo Boon Hock

Teo Boon Hock has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110134070
    Abstract: A capacitive touch panel including a transparent substrate, a plurality of first metal wires, an insulation layer, a plurality of first sensing units, a plurality of second sensing units and a plurality of second metal wires are provided. The transparent substrate has a substrate surface on which the first metal wires, the first sensing units and the second sensing units are formed. The insulation layer can cover a portion of each first metal wire, which is connected to two of the first sensing units, wherein each second metal wire is connected to two of the second sensing units.
    Type: Application
    Filed: April 13, 2010
    Publication date: June 9, 2011
    Applicant: Transtouch Technology Inc.
    Inventors: Wei-Wen Wang, Ting-Chieh Chen, Teo Boon Hock, Sheng-Hsien Lin, Yuh-Rur Kuo, Shih-Hsien Ma
  • Publication number: 20110102364
    Abstract: A capacitive touch panel is provided. The capacitive touch panel includes a transparent substrate, a plurality of first sensing wires, a plurality of second sensing units, an insulation layer, a plurality of second sensing wires and a plurality of fourth sensing units. The transparent substrate has a substrate surface on which the insulation layer is disposed. The insulation layer covers the first sensing wires and the second sensing wires. A plurality of third sensing units of the second sensing wires is disposed on the insulation layer along a second axial direction. The fourth sensing units are disposed on the insulation layer along a first axial direction. The third sensing units and the fourth sensing units are adjacently arranged.
    Type: Application
    Filed: April 13, 2010
    Publication date: May 5, 2011
    Applicant: Transtouch Technology, Inc.
    Inventors: Sheng-Hsien Lin, Wei-Wen Wang, Ting-Chieh Chen, Teo Boon Hock, Yuh-Rur Kuo, Shih-Hsien Ma