Patents by Inventor Teppei YAMAGUCHI

Teppei YAMAGUCHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240149389
    Abstract: A polishing pad including a polyurethane sheet as a polishing layer, wherein the polyurethane sheet has a ratio (E?B40/E?T40) of a storage elastic modulus E?B40 at 40° C. in dynamic viscoelasticity measurement performed under a bending mode condition with a frequency of 1.6 Hz to a storage elastic modulus E?T40 at 40° C. in dynamic viscoelasticity measurement performed under a tension mode condition with a frequency of 1.6 Hz of 0.60 to 1.60.
    Type: Application
    Filed: March 22, 2021
    Publication date: May 9, 2024
    Inventors: Teppei TATENO, Ryuma MATSUOKA, Hiroshi KURIHARA, Satsuki YAMAGUCHI, Yamato TAKAMIZAWA
  • Publication number: 20240149390
    Abstract: Provided is a polishing pad comprising a polishing layer made of a polyurethane resin foam containing an isocyanate-terminated prepolymer, and a curing agent, wherein the ratio (NC80/NC40) of a weight proportion (NC80) of an amorphous phase content in the polishing layer measured at 80° C. by a pulsed NMR method to a weight proportion (NC40) of the amorphous phase content in the polishing layer measured at 40° C. by the pulsed NMR method is between 1.5 and 2.5.
    Type: Application
    Filed: March 18, 2022
    Publication date: May 9, 2024
    Applicant: FUJIBO HOLDINGS, INC.
    Inventors: Yoshihide KAWAMURA, Teppei TATENO, Hiroshi KURIHARA, Satsuki YAMAGUCHI, Yamato TAKAMIZAWA, Keisuke OCHI, Tetsuaki KAWASAKI
  • Patent number: 11978682
    Abstract: A first frame is supported by a heat sink plate, surrounds an unmounted region of the heat sink plate, contains a resin, and has a first surface. A second frame contains a resin, and has a second surface opposing the first surface. An external terminal electrode passes between the first surface and the second surface. An adhesive layer contains a resin, and includes a lower portion, an upper portion, and an intermediate portion. The lower portion connects the external terminal electrode and the first surface to each other. The upper portion connects the external terminal electrode and the second surface to each other. The intermediate portion is disposed within a through hole of the external terminal electrode, and connects the lower portion and the upper portion to each other.
    Type: Grant
    Filed: November 19, 2021
    Date of Patent: May 7, 2024
    Assignees: NGK ELECTRONICS DEVICES, INC., NGK INSULATORS, LTD.
    Inventors: Yoshio Tsukiyama, Akiyoshi Osakada, Teppei Yamaguchi
  • Publication number: 20240139903
    Abstract: A polishing pad comprising a polishing layer that has a polishing surface for performing a polishing process on an item to be polished, wherein the polishing layer includes hollow microspheres that form hollow bodies within the polishing layer, a cross-section of the polishing layer has an average pore diameter of 10-14 ?m, and in a histogram of pore diameters in a cross-section of the polishing layer where the bin width is 1 ?m, the sum of pores that are 25 ?m or greater is 5% or less with respect to the total number of pores in the cross-section, and the sum of the areas of the pores in each bin that is 25 ?m or greater is 20% or less with respect to the total area of the pores in the cross-section.
    Type: Application
    Filed: March 23, 2022
    Publication date: May 2, 2024
    Applicant: FUJIBO HOLDINGS, INC.
    Inventors: Teppei TATENO, Hiroshi KURIHARA, Satsuki YAMAGUCHI, Yamato TAKAMIZAWA
  • Publication number: 20240131653
    Abstract: This polishing pad has a polishing layer that comprises a polyurethane resin foam derived from an isocyanate-terminated prepolymer and a curing agent, wherein: the distance between hard segments in the polishing layer as measured by small-angle X-ray scattering is 9.5 nm or less; or the ratio (NC80/CC80) of the content proportion by weight (NC80) of an amorphous phase in the polishing layer as measured by pulse NMR at 80° C. to the content proportion by weight (CC80) of a crystalline phase in the polishing layer as measured by pulse NMR at 80° C. is 2.6-3.1, and the ratio (NC40/CC40) of the content proportion by weight (NC40) of an amorphous phase in the polishing layer as measured by pulse NMR at 40° C. to the content proportion by weight (CC40) of a crystalline phase in the polishing layer as measured by pulse NMR at 40° C. is 0.5-0.9.
    Type: Application
    Filed: March 28, 2022
    Publication date: April 25, 2024
    Applicant: FUJIBO HOLDINGS, INC.
    Inventors: Teppei TATENO, Hiroshi KURIHARA, Satsuki YAMAGUCHI, Yamato TAKAMIZAWA, Keisuke OCHI, Tetsuaki KAWASAKI
  • Patent number: 11958891
    Abstract: The present disclosure provides tissue-specific Wnt signal enhancing molecules, and related methods of using these molecules to increase Wnt signaling in targeted tissues.
    Type: Grant
    Filed: January 26, 2018
    Date of Patent: April 16, 2024
    Assignee: Surrozen Operating, Inc.
    Inventors: Zhengjian Zhang, Jennifer Jean Brady, Aaron Ken Sato, Wen-Chen Yeh, Yang Li, Teppei Yamaguchi
  • Publication number: 20240104462
    Abstract: A supply chain management system is configured to create supply chain network information including information on a directed graph representing a multi-tiered supply chain network including tiers upstream and downstream of the target enterprise, acquire risk information on the multi-tiered supply chain network, detect, in the directed graph, a risk occurrence node influenced by a risk and a node of the target enterprise influenced by a defect of product supply at the risk occurrence node, search for a substituting node candidate for the risk occurrence node in a node group including a node of an enterprise outside the directed graph based on an item of the risk occurrence node, and present information on a change plan of the multi-tiered supply chain network obtained by adding the substituting node candidate to the directed graph.
    Type: Application
    Filed: March 13, 2023
    Publication date: March 28, 2024
    Inventors: Tazu NOMOTO, Teppei INOUE, Keiichi BAMOTO, Ayaka YAMAGUCHI
  • Patent number: 11901268
    Abstract: An external terminal electrode is attached to a frame, and the frame contains a first resin, and has a first adhered surface. A heat sink plate supports the frame, has an unmounted region where a power semiconductor element is to be mounted within the frame in plan view, is made of metal, and has a second adhered surface. An adhesive layer contains a second resin different from the first resin, and adheres the first adhered surface of the frame and the second adhered surface of the heat sink plate to each other. One of the first and second adhered surfaces includes a flat portion and a protruding portion. The protruding portion protrudes from the flat portion and opposes the other one of the first adhered surface and the second adhered surface with the adhesive layer therebetween.
    Type: Grant
    Filed: November 19, 2021
    Date of Patent: February 13, 2024
    Assignees: NGK Electronics Devices, Inc., NGK INSULATORS, LTD.
    Inventors: Yoshio Tsukiyama, Teppei Yamaguchi
  • Publication number: 20220077033
    Abstract: An external terminal electrode is attached to a frame, and the frame contains a first resin, and has a first adhered surface. A heat sink plate supports the frame, has an unmounted region where a power semiconductor element is to be mounted within the frame in plan view, is made of metal, and has a second adhered surface. An adhesive layer contains a second resin different from the first resin, and adheres the first adhered surface of the frame and the second adhered surface of the heat sink plate to each other. One of the first and second adhered surfaces includes a flat portion and a protruding portion. The protruding portion protrudes from the flat portion and opposes the other one of the first adhered surface and the second adhered surface with the adhesive layer therebetween.
    Type: Application
    Filed: November 19, 2021
    Publication date: March 10, 2022
    Applicants: NGK Electronics Devices, Inc., NGK Insulators, Ltd.
    Inventors: Yoshio TSUKIYAMA, Teppei YAMAGUCHI
  • Publication number: 20220077011
    Abstract: A first frame is supported by a heat sink plate, surrounds an unmounted region of the heat sink plate, contains a resin, and has a first surface. A second frame contains a resin, and has a second surface opposing the first surface. An external terminal electrode passes between the first surface and the second surface. An adhesive layer contains a resin, and includes a lower portion, an upper portion, and an intermediate portion. The lower portion connects the external terminal electrode and the first surface to each other. The upper portion connects the external terminal electrode and the second surface to each other. The intermediate portion is disposed within a through hole of the external terminal electrode, and connects the lower portion and the upper portion to each other.
    Type: Application
    Filed: November 19, 2021
    Publication date: March 10, 2022
    Applicants: NGK Electronics Devices, Inc., NGK Insulators, Ltd.
    Inventors: Yoshio TSUKIYAMA, Akiyoshi OSAKADA, Teppei YAMAGUCHI
  • Publication number: 20200048324
    Abstract: The present disclosure provides tissue-specific Wnt signal enhancing molecules, and related methods of using these molecules to increase Wnt signaling in targeted tissues.
    Type: Application
    Filed: January 26, 2018
    Publication date: February 13, 2020
    Inventors: Zhengjian ZHANG, Jennifer Jean BRADY, Aaron Ken SATO, Wen-Chen YEH, Yang LI, Teppei YAMAGUCHI