Patents by Inventor Terance Blake

Terance Blake has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Corrosion-resistant copper bond pad and integrated device
    Patent number: 7078796
    Abstract: The invention provides an integrated device with corrosion-resistant capped copper bond pads. The capped copper bond pads include at least one copper bond pad on a semiconductor substrate. An activation layer comprising one of immersion palladium, electroless cobalt, or immersion ruthernium is disposed on the copper bond pad. A first intermediate layer of electroless nickel-boron alloy is disposed on the activation layer. A second intermediate layer comprising one of electroless nickel or electroless palladium is disposed on the first intermediate layer, and an immersion gold layer is disposed on the second intermediate layer. A capped copper bond pad and a method of forming the capped copper bond pads are also disclosed.
    Type: Grant
    Filed: July 1, 2003
    Date of Patent: July 18, 2006
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Gregory J. Dunn, Owen R. Fay, Timothy B. Dean, Terance Blake, Remy J. Chelini, William H. Lytle, George A. Strumberger
  • Corrosion-resistant bond pad and integrated device
    Publication number: 20050104207
    Abstract: The invention provides an integrated device with corrosion-resistant capped bond pads. The capped bond pads include at least one aluminum bond pad on a semiconductor substrate. A layer of electroless nickel is disposed on the aluminum bond pad. A layer of electroless palladium is disposed on the electroless nickel, and a layer of immersion gold is disposed on the electroless palladium. A capped bond pad and a method of forming the capped bond pads are also disclosed.
    Type: Application
    Filed: November 5, 2004
    Publication date: May 19, 2005
    Inventors: Timothy Dean, Terance Blake, Gregory Dunn, Remy Chelini, William Lytle, Owen Fay, George Strumberger
  • Corrosion-resistant copper bond pad and integrated device
    Publication number: 20050001324
    Abstract: The invention provides an integrated device with corrosion-resistant capped copper bond pads. The capped copper bond pads include at least one copper bond pad on a semiconductor substrate. An activation layer comprising one of immersion palladium, electroless cobalt, or immersion ruthernium is disposed on the copper bond pad. A first intermediate layer of electroless nickel-boron alloy is disposed on the activation layer. A second intermediate layer comprising one of electroless nickel or electroless palladium is disposed on the first intermediate layer, and an immersion gold layer is disposed on the second intermediate layer. A capped copper bond pad and a method of forming the capped copper bond pads are also disclosed.
    Type: Application
    Filed: July 1, 2003
    Publication date: January 6, 2005
    Inventors: Gregory Dunn, Owen Fay, Timothy Dean, Terance Blake, Remy Chelini, William Lytle, George Strumberger
  • Corrosion-resistant bond pad and integrated device
    Publication number: 20050001316
    Abstract: The invention provides an integrated device with corrosion-resistant capped bond pads. The capped bond pads include at least one aluminum bond pad on a semiconductor substrate. A layer of electroless nickel is disposed on the aluminum bond pad. A layer of electroless palladium is disposed on the electroless nickel, and a layer of immersion gold is disposed on the electroless palladium. A capped bond pad and a method of forming the capped bond pads are also disclosed.
    Type: Application
    Filed: July 1, 2003
    Publication date: January 6, 2005
    Inventors: Timothy Dean, Terance Blake, Gregory Dunn, Remy Chelini, William Lytle, Owen Fay, George Strumberger