Patents by Inventor Terence Huang
Terence Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10644118Abstract: Embodiments of the present disclosure provide a self-aligned contact for a trench power MOSFET device. The device has a layer of nitride provided over the conductive material in the gate trenches and over portions of mesas between every two adjacent contact structures. Alternatively, the device has an oxide layer over the conductive material in the gate trenches and over portions of mesas between every two adjacent contact structures. It is emphasized that this abstract is provided to comply with rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.Type: GrantFiled: June 14, 2017Date of Patent: May 5, 2020Assignee: Alpha and Omega Semiconductor IncorporatedInventors: Hongyong Xue, Sik Lui, Terence Huang, Ching-Kai Lin, Wenjun Li, Yi Chang Yang, Jowei Dun
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Patent number: 9865694Abstract: A plurality of gate trenches is formed into a semiconductor substrate in an active cell region. One or more other trenches are formed in a different region. Each gate trench has a first conductive material in lower portions and a second conductive material in upper portions. In the gate trenches, a first insulating layer separates the first conductive material from the substrate, a second insulating layer separates the second conductive material from the substrate and a third insulating material separates the first and second conductive materials. The other trenches contain part of the first conductive material in a half-U shape in lower portions and part of the second conductive material in upper portions. In the other trenches, the third insulating layer separates the first and second conductive materials. The first insulating layer is thicker than the third insulating layer, and the third insulating layer is thicker than the second.Type: GrantFiled: January 23, 2017Date of Patent: January 9, 2018Assignee: ALPHA AND OMEGA SEMICONDUCTOR INCORPORATEDInventors: Yeeheng Lee, Lingpeng Guan, Hongyong Xue, Yiming Gu, Yang Xiang, Terence Huang, Sekar Ramamoorthy, Wenjun Li, Hong Chang, Madhur Bobde, Paul Thorup, Hamza Yilmaz
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Publication number: 20170288028Abstract: Embodiments of the present disclosure provide a self-aligned contact for a trench power MOSFET device. The device has a layer of nitride provided over the conductive material in the gate trenches and over portions of mesas between every two adjacent contact structures. Alternatively, the device has an oxide layer over the conductive material in the gate trenches and over portions of mesas between every two adjacent contact structures. It is emphasized that this abstract is provided to comply with rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.Type: ApplicationFiled: June 14, 2017Publication date: October 5, 2017Inventors: Hongyong Xue, Sik Lui, Terence Huang, Ching-Kai Lin, Wenjun Li, Yi Chang Yang, Jowei Dun
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Patent number: 9741808Abstract: A plurality of gate trenches is formed into a semiconductor substrate in an active cell region. One or more other trenches are formed in a different region. Each gate trench has a first conductive material in lower portions and a second conductive material in upper portions. In the gate trenches, a first insulating layer separates the first conductive material from the substrate, a second insulating layer separates the second conductive material from the substrate and a third insulating material separates the first and second conductive materials. The other trenches contain part of the first conductive material in a half-U shape in lower portions and part of the second conductive material in upper portions. In the other trenches, the third insulating layer separates the first and second conductive materials. The first insulating layer is thicker than the third insulating layer, and the third insulating layer is thicker than the second.Type: GrantFiled: March 4, 2016Date of Patent: August 22, 2017Assignee: Alpha and Omage Semiconductor Inc.Inventors: Yeeheng Lee, Lingpeng Guan, Hongyong Xue, Yiming Gu, Yang Xiang, Terence Huang, Sekar Ramamoorthy, Wenjun Li, Hong Chang, Madhur Bobde, Paul Thorup, Hamza Yilmaz
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Patent number: 9691863Abstract: Embodiments of the present disclosure provide a self-aligned contact for a trench power MOSFET device. The device has a layer of nitride provided over the conductive material in the gate trenches and over portions of mesas between every two adjacent contact structures. Alternatively, the device has an oxide layer over the conductive material in the gate trenches and over portions of mesas between every two adjacent contact structures. It is emphasized that this abstract is provided to comply with rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.Type: GrantFiled: April 8, 2015Date of Patent: June 27, 2017Assignee: ALPHA AND OMEGA SEMICONDUCTOR INCORPORATEDInventors: Hongyong Xue, Sik Lui, Terence Huang, Ching-Kai Lin, Wenjun Li, Yi Chang Yang, Jowei Dun
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Publication number: 20170133473Abstract: A plurality of gate trenches is formed into a semiconductor substrate in an active cell region. One or more other trenches are formed in a different region. Each gate trench has a first conductive material in lower portions and a second conductive material in upper portions. In the gate trenches, a first insulating layer separates the first conductive material from the substrate, a second insulating layer separates the second conductive material from the substrate and a third insulating material separates the first and second conductive materials. The other trenches contain part of the first conductive material in a half-U shape in lower portions and part of the second conductive material in upper portions. In the other trenches, the third insulating layer separates the first and second conductive materials. The first insulating layer is thicker than the third insulating layer, and the third insulating layer is thicker than the second.Type: ApplicationFiled: January 23, 2017Publication date: May 11, 2017Inventors: Yeeheng Lee, Lingpeng Guan, Hongyong Xue, Yiming Gu, Yang Xiang, Terence Huang, Sekar Ramamoorthy, Wenjun Li, Hong Chang, Madhur Bobde, Paul Thorup, Hamza Yilmaz
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Publication number: 20160300917Abstract: Embodiments of the present disclosure provide a self-aligned contact for a trench power MOSFET device. The device has a layer of nitride provided over the conductive material in the gate trenches and over portions of mesas between every two adjacent contact structures. Alternatively, the device has an oxide layer over the conductive material in the gate trenches and over portions of mesas between every two adjacent contact structures. It is emphasized that this abstract is provided to comply with rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.Type: ApplicationFiled: April 8, 2015Publication date: October 13, 2016Inventors: Hongyong Xue, Sik Lui, Terence Huang, Ching-Kai Lin, Wenjun Li, Yi Chang Yang, Jowei Dun
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Publication number: 20160190265Abstract: A plurality of gate trenches is formed into a semiconductor substrate in an active cell region. One or more other trenches are formed in a different region. Each gate trench has a first conductive material in lower portions and a second conductive material in upper portions. In the gate trenches, a first insulating layer separates the first conductive material from the substrate, a second insulating layer separates the second conductive material from the substrate and a third insulating material separates the first and second conductive materials. The other trenches contain part of the first conductive material in a half-U shape in lower portions and part of the second conductive material in upper portions. In the other trenches, the third insulating layer separates the first and second conductive materials. The first insulating layer is thicker than the third insulating layer, and the third insulating layer is thicker than the second.Type: ApplicationFiled: March 4, 2016Publication date: June 30, 2016Inventors: Yeeheng Lee, Lingpeng Guan, Hongyong Xue, Yiming Gu, Yang Xiang, Terence Huang, Sekar Ramamoorthy, Wenjun Li, Hong Chang, Madhur Bobde, Paul Thorup, Hamza Yilmaz
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Patent number: 9281368Abstract: A plurality of gate trenches is formed into a semiconductor substrate in an active cell region. One or more other trenches are formed in a different region. Each gate trench has a first conductive material in lower portions and a second conductive material in upper portions. In the gate trenches, a first insulating layer separates the first conductive material from the substrate, a second insulating layer separates the second conductive material from the substrate and a third insulating material separates the first and second conductive materials. The other trenches contain part of the first conductive material in a half-U shape in lower portions and part of the second conductive material in upper portions. In the other trenches, the third insulating layer separates the first and second conductive materials. The first insulating layer is thicker than the third insulating layer, and the third insulating layer is thicker than the second.Type: GrantFiled: December 12, 2014Date of Patent: March 8, 2016Assignee: Alpha and Omega Semiconductor IncorporatedInventors: Yeeheng Lee, Lingpeng Guan, Hongyong Xue, Yiming Gu, Yang Xiang, Terence Huang, Sekar Ramamoorthy, Wenjun Li, Hong Chang, Madhur Bobde, Paul Thorup, Hamza Yilmaz