Abstract: A multilayer package includes a plurality of interconnected large-layer-count (LLC) substrates. The LLC substrates each include conductive pads on the top and bottom surfaces of the substrate, a via in the substrate including conductive material to contact the pads on the top and bottom surfaces, and a post on a pad over the via. The posts of the substrates confront and abut each other, and are electrically bonded together. A non-flowable adhesive film mechanically bonds the LLC substrates, and has an aperture receiving the posts of the substrates.

Abstract: A process of laminating a large-layer-count (LLC) substrates includes formation of first and second vias through respective substrates. A conductive path is formed through each of the respective vias, and posts are formed on the respective vias, electrically connected to the respective conductive path. A non-flowable adhesive layer having an aperture is provided between the LLC substrates so that the posts confront each other through the aperture. The LLC substrates are pressed together through the non-flowable adhesive layer to mechanically bond them together, and so that the posts abut each other. Simultaneously, the posts are electrically bonded to each other in the aperture.

Abstract: A curved lead provides a mechanical and electrical connection between a board contact on a circuit board and a chip contact associated with a circuit chip. The chip can be mounted to the circuit board, to a chip carrier or to a multiple-chip module. The curved lead is substantially entirely plated with solder and is formed of a single piece of conductive material. The curved lead has a first surface for connection to the chip contact and a second surface, generally parallel to the first surface, for connection to the board contact. The first and second surfaces are connected by at least one curved portion and are arranged to mount the circuit chip to the circuit board with the solder in a compliant, generally parallel arrangement substantially free of stress.

Abstract: A curved lead provides a mechanical and electrical connection between a board contact on a circuit board and a chip contact associated with a circuit chip. The chip can be mounted to the circuit board, to a chip carrier or to a multiple-chip module. The curved lead is substantially entirely plated with solder and is formed of a single piece of conductive material. The curved lead has a first surf ace for connection to the chip contact and a second surface, generally parallel to the first surface, for connection to the board contact. The first and second surfaces are connected by at least one curved portion and are arranged to mount the circuit chip to the circuit board with the solder in a compliant, generally parallel arrangement substantially free of stress.