Patents by Inventor Terrance H. Dawdy

Terrance H. Dawdy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5232996
    Abstract: A two-part adhesive composition useful for bonding various materials including plastic or thermoplastic substrates. The first part of the adhesive contains an epoxy compound and an acrylate-terminated polyurethane while the second part of the adhesive contains an amine hardener. The presence of the acrylate-terminated polyurethane allows the adhesive composition to be applied to unprepared substrates to form a bond having high strength.
    Type: Grant
    Filed: May 7, 1992
    Date of Patent: August 3, 1993
    Assignee: Lord Corporation
    Inventors: Dilip N. Shah, Terrance H. Dawdy
  • Patent number: 4769419
    Abstract: Novel structural adhesive compositions for metal-bonding applications. The adhesives comprise olefinic-terminated liquid rubbers which are reacted with monoisocyanate compounds. The compositions according to the present invention are especially useful in formulating ambient temperature curable structural adhesive compositions.
    Type: Grant
    Filed: December 1, 1986
    Date of Patent: September 6, 1988
    Inventor: Terrance H. Dawdy
  • Patent number: 4467071
    Abstract: Structural adhesive systems having improved heat resistance comprising a solution or dispersion of a polymeric material in a monomer copolymerizable therewith, an unsaturated organophosphorus partial ester and an epoxy resin are disclosed.
    Type: Grant
    Filed: September 13, 1982
    Date of Patent: August 21, 1984
    Assignee: Lord Corporation
    Inventor: Terrance H. Dawdy
  • Patent number: 4452944
    Abstract: Novel structural adhesives for bonding metals and plastics are disclosed. The adhesives, comprising a solution or dispersion of a polymeric material, a monomer which is copolymerizable with such polymeric material and phosphorous-containing compounds are characterized by improved performance at elevated temperatures and excellent resistance to thermal degradation.
    Type: Grant
    Filed: February 11, 1982
    Date of Patent: June 5, 1984
    Assignee: Lord Corporation
    Inventor: Terrance H. Dawdy
  • Patent number: 4397707
    Abstract: Adhesion between an adhesive of the class of polymerizable liquid ethylenically unsaturated compounds containing a single vinyl group and solid polyester-containing plastic materials is improved by treating the substrate with a primer composition comprising an aromatic polyisocyanate and an amino resin and moisture-curing the polyisocyanate compound prior to application of the adhesive. The adhesive-joined assemblies are cured in a first stage at room temperature and, in a second stage, are post-baked at 100.degree. to 150.degree. C. to complete cure of the adhesive and the primer.
    Type: Grant
    Filed: January 20, 1982
    Date of Patent: August 9, 1983
    Assignee: Lord Corporation
    Inventor: Terrance H. Dawdy
  • Patent number: 4293665
    Abstract: Novel structural adhesive systems for metal-bonding applications. The adhesives, comprising a solution or dispersion of a polymeric material in a monomer copolymerizable therewith having incorporated therein certain phosphorus-containing compounds, are characterized by an unexpected ability of providing strong adhesion to untreated metal surfaces without adversely affecting adhesive performance, including resistance to deleterious environments. The environmental resistance of the herein described adhesives can be further improved by the addition of one or more polybasic lead salts, metal molybdates and metal phosphates.
    Type: Grant
    Filed: January 11, 1980
    Date of Patent: October 6, 1981
    Assignee: Lord Corporation
    Inventors: Denis J. Zalucha, Frederick H. Sexsmith, Ernest C. Hornaman, Terrance H. Dawdy
  • Patent number: 4223115
    Abstract: Novel structural adhesive systems for metal-bonding applications. The adhesives, comprising a solution or dispersion of a polymeric material in a monomer copolymerizable therewith having incorporated therein certain phosphorus-containing compounds, are characterized by an unexpected ability of providing strong adhesion to untreated metal surfaces without adversely affecting adhesive performance, including resistance to deleterious environments. The environmental resistance of the herein described adhesives can be further improved by the addition of one or more polybasic lead salts, metal molybdates and metal phosphates.
    Type: Grant
    Filed: April 24, 1978
    Date of Patent: September 16, 1980
    Assignee: Lord Corporation
    Inventors: Denis J. Zalucha, Frederick H. Sexsmith, Ernest C. Hornaman, Terrance H. Dawdy