Abstract: The present invention is a method for inspecting objects. The method includes obtaining a structural model of a first object, the model providing dimensions and material properties for the first object, inspecting a second object to provide inspection data for at least two views of a structure of the second object, comparing inspection and predicted data based on the structural model of the first object and a simulation of the inspection process, reconstructing stereographic data for the second object based on the structural model of the first object and contributions of the inspection data of the second object. In another embodiment, where there is a structural model of an object, the object can be subjected to a dynamic process and the object is inspected throughout the process.

Abstract: An integrated x-ray detection system includes an x-ray detector fabricated on a wafer with a housing for containing a gas. The detector has a plurality of microstrip anodes and the housing passes x-rays which partially ionize the gas thereby producing a pulse at one of the anodes. The same wafer also has a plurality of integrated active signal processing circuits which are respectively coupled to the anodes. Each active signal processing circuit receives and processes pulses from respective ones of the anodes and outputs a digital signal indicating the location and energy of x-rays detected by the detector. An isolation layer separates the x-ray detector from the active signal processing circuits.

Abstract: An integrated x-ray detection system includes an x-ray detector fabricated on a wafer with a housing for containing a gas. The detector has a plurality of microstrip anodes and the housing passes x-rays which partially ionize the gas thereby producing a pulse at one of the anodes. The same wafer also has a plurality of integrated active signal processing circuits which are respectively coupled to the anodes. Each active signal processing circuit receives and processes pulses from respective ones of the anodes and outputs a digital signal indicating the location and energy of x-rays detected by the detector. An isolation layer separates the x-ray detector from the active signal processing circuits.