Abstract: A thermally conductive adhesive comprises a mixture of at least two types of silver particles including a first type having a surface area to mass ratio in the range of 0.59 m2/g to 2.19 m2/g and a tap density in the range of 3.2 to 6.9 g/cm3 and a second type having a surface area to mass ratio of 0.04 to 0.17 m2/g and a tap density in the range of about 4.7 to 8.2 g/cm3. According to certain embodiments of the invention the first type of silver particles includes oblong silver particles. The thermally conductive adhesive further comprises a binder, and optionally a solvent.

Abstract: The present invention relates to cured compositions useful as adhesives and sealants formed by dispersing an amine-terminated polyamide curative into a base to form a composite and activating the composite forming the cured composition. Bases described include epoxies, polysulfides and cyanoacrylates. Curing mechanisms include heat and pressure activation. The amine-terminated polyamide curative has a ratio of equivalents of amine to acid groups of from about 1.05:1.00 equivalents NH.sub.X :COOH to no greater than about 1.95:1.00 when x is 1 or 2.

Abstract: Disclosed are polyurethane base resins, and polyurethane composites and adhesive compositions formed using the base resins. The polyurethane base resins are formed by reacting a polycarbodiimide-modified 4, 4'-diphenylmethane diisocyanate with a mixture of the following polyols: (a) a hydroxyl-terminated, linear, saturated liquid copolyester diol having a glass transition temperature of at most -10.degree. C. and at least -60.degree. C.; and (b) a homopolyester polyol that is a ring-opened polymer of a cyclic ester. The polyurethane composites include typical active hydrogen-containing species that will react with isocyanates and promote curing, in addition to the polyurethane base resin. The polyurethane adhesive compositions, which are thermosetting, include the cured polyurethane base resin, cured by exposure to moisture or any other applicable curing mechanism. The adhesive compositions have improved performance (e.g.

Abstract: A moisture curable composition comprised of a moisture curable base and a curing agent which does not contain molecular water but which produces water upon activation so as to cure the curable base. The composition exhibits improved stability and shelf life and can be formulated so that curing of the composition can be controlled substantially independently of ambient conditions.

Abstract: The present invention relates to thermosetting polyurethane structural adhesive composites and compositions and processes for producing the same comprising dispersing an amine-terminated solid polyamide resin into a polyurethane base resin to form a nonactivated adhesive composite, and activating the same by heating to form an adhesive composition. Another aspect of the invention relates to dispersing an amine-terminated solid polyamide resin and a water generating compound into the polyurethane base resin and heat-activating the same to form an adhesive composition. The invention also relates to polyurethane base resins suitable for use in the processes of the invention, which may also be moisture cured to form a reactive adhesive composition.

Abstract: The invention relates to alkyl- or aryl-terminated polyamide compositions and polyamide rheological additives that function as a sag/slump control agent and provide superior shear-thinning and viscosity recovery properties in systems that react with or are sensitive to water and other active hydrogen containing materials and systems that do not react with or are not sensitive to water or other active hydrogen containing materials, and are useful in sealants, caulks, adhesives and coatings.

Abstract: The present invention relates to foamable thermosetting polyurethane structural adhesive composites and compositions and processes for producing the same comprising dispersing a water-generating curing composition into a polyurethane base resin to form a nonactivated adhesive composite, and activating the same by heating to form an adhesive composition. Another aspect of the invention relates to dispersing a water-generating compound and an amine-terminated solid polyamide resin into the polyurethane base resin and heat-activating the same to form an adhesive composition.