Abstract: The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate.In manufacturing the article of manufacture, a surface treatment technique such as wet process or a plasma/optional silane coupling agent may be applied to either the substrate, adhesive polyimide film or polyimide film prior to the bonding operation.

Abstract: The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. the bonding operation.A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines. The novel polyimide may also contain unsaturated heterocyclic groups in the polymer backbone or chain, either as a partial or complete replacement for the aromatic diamines used in synthesizing the polyimide.

Abstract: A high speed electrochemical metal removal technique provides for planarization of multilayer copper interconnection in thin film modules. The process uses a neutral salt solution, is compatible with the plating process and has minimum safety and waste disposal problems. The process offers tremendous cost advantages over previously employed micromilling techniques for planarization.

Abstract: An electrochemical color change cell incorporating as a color changing agent intramolecular charge transfer salt or an intermolecular charge transfer salt. The intermolecular charge transfer salts and the intramolecular charge transfer salts have a plurality of oxidation states and a wide variation in color change. The intermolecular and intramolecular charge transfer salts preferably contain a violene moiety and a moiety having a carbonyl group conjugated to an aromatic moiety. The intramolecular charge transfer salts have a stable covalent radical-anion/radical-cation configuration. The intermolecular charge transfer salts have a stable ionic radical-anion/radical-cation configuration.

Abstract: Color photographic elements can be effectively and rapidly bleached using acidic peroxide bleaching solutions when an alkaline prebath solution is used to activate the acidic bleaching solution.

Abstract: Certain cationic hydroquinones are useful catalysts for persulfate bleaching agents in photographic processing methods. These compounds are oxidizable by persulfate and reducible by silver metal at a pH of from 1 to 7, and have a chemically reversible redox couple of from about -0.20 to about +1.5 volts. The persulate bleaching ability is enhanced by the presence of these compounds which are used in a step prior to bleaching.

Abstract: Copper (II) ligand complexes are useful to catalyze the activity of peracid bleaching agents. The complexes can be included in the bleaching solutions, or used in a suitable solution prior to the bleaching step. The ligands are .alpha.-diimines having sites available to complex with copper (II).

Abstract: A method for forming a thin film layer on a dielectric substrate. A nonconducting layer of material is blanket deposited on the dielectric substrate followed by a layer of polymeric dielectric material which is then patterned to partially expose the underlying layer of nonconducting material. The exposed underlying layer of material is contacted with a metallic salt solution. A key part of the present invention is the layer of nonconducting material which catalyzes the deposition of a seed layer from the metallic salt solution. Then, additional metallization may be easily electrolessly plated on the seed layer.

Abstract: A halogenated polymeric material is exposed to a reducing agent and/or an electrolyte and applied voltage to render exposed portions capable of being metallized and of being etched. The exposed portions can also be doped to thereby induce electrical conductivity therein. Also, new structures containing a free standing halogenated polymeric-containing layer and electrical conductive pattern thereon are provided.

Abstract: The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate.In manufacturing the article of manufacture, a surface treatment technique such as wet process or a plasma/optional silane coupling agent may be applied to either the substrate, adhesive polyimide film or polyimide film prior to the bonding operation.

Abstract: Improved adhesion of electroless metal deposited on an organic dielectric layer with phase separated morphology is accomplished by the spontaneous formation of a morphologically and topographically rough surface. In one embodiment a ternary solution of a polar solvent and two polymer precursors of the same polymer which are separable in two phases of different order are cast in film on a substrate and heated to form two phases of different order to spontaneously produce a rough surface. Upon exposure to an alkaline solution, one phase is etched at a faster rate than the other. Seeding and electroless deposition of a metal on the rough surface results in improved adhesion of the metal to the dielectric layer. In a second embodiment a quaternary solution of a polar solvent, a seeding agent, two polymer precursors of the same polymer which are separable in two phases of different order are cast in a thin film on a substrate and heated to form three phases.

Abstract: A method of isomerizing an isoimide to an n-imide is described wherein an electron is supplied to the isoimide which induces the isomerization and wherein the isomerization is catalytic to the electron which remains available to initiate further isomerization. A polyimide is deposited onto a conductive substrate by providing a composition containing a polyisoimide and an electrolyte providing the substrate and a counter electrode in the composition, and providing a bias between the substrate and counter electrode to thereby supply an electron to the polyisoimide which isomerizes to deposit the insoluble polyimide on the substrate.

Abstract: The invention relates to the formation of isoimides from amic acids, especially polyisoimides by a novel process in which polyimides are first converted to polyamic acids and then contacted with an isoimidizing agent. An acyl halide of a heterocyclic nitrogen compound or an acyl halide of a heterocyclic sulphur compound can be used as the isoimidizing agent. The isoimidization may also be carried out in the presence of a compound containing a heterocyclic nitrogen especially a solvent containing a heterocyclic nitrogen.The invention is especially applicable to conducting nucleophilic addition reactions on the surface of polyimides where the surface has been converted to a polyamic acid or on the surface of polyamic acid materials followed by isoimidization and reaction of the isoimide with a nucleophile such as an amine or organic hydroxy compound.Photosensitive metal compounds or electroless metal coating catalysts can be coordinated with the compositions obtained.

Abstract: An electrochemical color change cell incorporating as a color changing agent intramolecular charge transfer salt or an intermolecular charge transfer salt. The intermolecular charge transfer salts and the intramolecular charge transfer salts have a plurality of oxidation states and a wide variation in color change. The intermolecular and intramolecular charge transfer salts preferably contain a violene moiety and a moiety having a carbonyl group conjugated to an aromatic moiety. The intramolecular charge transfer salts have a stable covalent radical-anion/radical-cation configuration. The intermolecular charge transfer salts have a stable ionic radical-anion/radical-cation configuration.

Abstract: A polyimide is deposited onto a conductive substrate by providing a composition containing the polyimide and an electrolyte and/or reducing agent, providing the substrate and a counter electrode in the composition, and providing a bias between the substrate and counter electrode to thereby deposit the polyimide on the substrate.

Abstract: The surface modification of polyimide materials by a chemical process is disclosed to provide a variety of functional groups on the surface. The surface is treated to produce polyamic acid carboxyl groups which are subsequently reacted with epoxies, hydrazines, or alcohols. The carboxyl groups can be also be subjected to other organic reactions, such as reduction with metal hydrides and the like. The versatility and controllability of this process lends itself to promoting adhesion of the polyimide to similarly treated polyimides, other polymers and other substrates as well as combining with metals such as metal catalysts used for depositing conductors on non-conductive surfaces such as circuit boards.

Abstract: Structures and methods of fabrication thereof wherein the method selectively supplies electrons to a first electroactive material in the presence of a second electroactive material wherein the first and second electroactive materials have different redox potentials. The electrons are selectively supplied either by electrochemical means or by appropriately chosen reducing agents. A structure fabricated by these methods has a first electroactive body disposed on a second electroactive body wherein the first body has a pattern therein exposing at the base thereof the surface of the second electroactive material body. Electrons can be selectively supplied to the surface of the second electroactive material body which is exposed at the base of the pattern in the first electroactive material body. Upon exposing the structure to a seeding solution seed is selectively supplied to those regions to which electrons have been selectively supplied.

Abstract: An electrode that has a film adsorbed to its surface by reductive electropolymerization of (vbpy)Re(CO).sub.3 Cl (4-vinyl-4'-methyl-2,2'-bipyridine tricarbonylchlororhenium(I)) or its acetonitrile analogue, [(vbpy)Re(CO).sub.3 (MeCN)].sup.+ (4-vinyl-4'-methyl-2,2'-bipyridine tricarbonylacetonitrile rhenium (I)). The poly(vbpy)Re(CO).sub.3 Cl or poly[(vbpy)Re(CO).sub.3 (MeCN)].sup.+ adsorbed onto the electrode, acts as a catalyst for CO.sub.2 reduction to CO. Stability and the reactivity of the polymer film may be increased by co-reductive electropolymerization of either of the aforesaid Re complexes with [(bpy).sub.2 Ru(vpy).sub.2.sup.2+ (bis(4-vinyl-pyridine)bis(2,2'-bipyridine) ruthenium (II)) (vpy is 4-vinylpyridine). A bilayer film assembly consisting of poly-[(bpy).sub.2 Ru(vpy).sub.2 ].sup.2+ as an inner film and the aforementioned copolymer of Ru/Re yields even greater reactivity to CO.sub.2.A method of forming a polymeric film on an electrode.A method of reducing CO.sub.

Abstract: An electrode that has a film adsorbed to its surface by reductive electropolymerization of (vbpy)Re(CO).sub.3 Cl (4-vinyl-4'-methyl-2,2'-bipyridine tricarbonylchlororhenium(I)) or its acetonitrile analogue, [(vbpy)Re(CO).sub.3 (MeCN)].sup.+ (4-vinyl-4'-methyl-2,2'-bipyridine tricarbonylacetonitrile rhenium (I)). The poly (vbpy)Re(CO).sub.3 Cl or poly-[(vbpy)Re(CO).sub.3 (MeCN)].sup.+ adsorbed onto the electrode, acts as a catalyst for CO.sub.2 reduction to CO. Stability and the reactivity of the polymer film may be increased by co-reductive electropolymeriaztion of either of the aforesaid Re complexes with [(bpy).sub.2 Ru(vpy).sub.2.sup.2+ ](bis(4-vinyl-pyridine)bis(2,2'-bipyridine) ruthenium (II)) (vpy is 4-vinylpyridine). A bilayer film assembly consisting of poly-[(bpy).sub.2 Ru(vpy).sub.2 ].sup.2+ as an inner film and the aforementioned copolymer of Ru/Re yields even greater reactivity to CO.sub.2.A method of forming a polymeric film on an electrode.A method of reducing CO.sub.