Patents by Inventor Terry Ku

Terry Ku has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package with a balanced-part structure
    Patent number: 7176559
    Abstract: An integrated circuit package includes a balanced-part structure. The condition of thermal stress of chips connected on a substrate decides the amount, locations, weights, and the material of at least a balanced-part fastened on a substrate. The balanced-part is fastened on the substrate to balance stress distribution before an adhering heat sinks process and a packaging molding compound process. The balanced-part also decreases thermal stress affection and avoid warpage defects of the integrated circuit packages.
    Type: Grant
    Filed: August 8, 2003
    Date of Patent: February 13, 2007
    Assignee: Via Technologies, Inc.
    Inventors: Kwun Yao Ho, Moriss Kung, Terry Ku, Andy Liao
  • Integrated circuit package with a balanced-part structure
    Publication number: 20050012189
    Abstract: An integrated circuit package includes a balanced-part structure. The condition of thermal stress of chips connected on a substrate decides the amount, locations, weights, and the material of at least a balanced-part fastened on a substrate. The balanced-part is fastened on the substrate to balance stress distribution before an adhering heat sinks process and a packaging molding compound process. The balanced-parts also decreases thermal stress affection and avoid warpage defects of the integrated circuit packages.
    Type: Application
    Filed: August 8, 2003
    Publication date: January 20, 2005
    Inventors: Kwun Ho, Moriss Kung, Terry Ku, Andy Liao