Abstract: An integrated electrode structure can comprise a catheter shaft comprising a proximal end and a distal end, the catheter shaft defining a catheter shaft longitudinal axis. A flexible tip portion can be located adjacent to the distal end of the catheter shaft, the flexible tip portion comprising a flexible framework. A plurality of microelectrodes can be disposed on the flexible framework and can form a flexible array of microelectrodes adapted to conform to tissue. A plurality of conductive traces can be disposed on the flexible framework, each of the plurality of conductive traces can be electrically coupled with a respective one of the plurality of microelectrodes.

Abstract: An integrated electrode structure can comprise a catheter shaft comprising a proximal end and a distal end, the catheter shaft defining a catheter shaft longitudinal axis. A flexible tip portion can be located adjacent to the distal end of the catheter shaft, the flexible tip portion comprising a flexible framework. A plurality of microelectrodes can be disposed on the flexible framework and can form a flexible array of microelectrodes adapted to conform to tissue. A plurality of conductive traces can be disposed on the flexible framework, each of the plurality of conductive traces can be electrically coupled with a respective one of the plurality of microelectrodes.

Abstract: Methods of manufacturing and assembling a catheter shaft may include depositing electrical traces on an interior surface of the shaft of the catheter, rather than using separate wires, forming a bore in a sensor, and electrically coupling the sensor to the trace through a bore in the sensor.

Abstract: An integrated electrode structure can comprise a catheter shaft comprising a proximal end and a distal end, the catheter shaft defining a catheter shaft longitudinal axis. A flexible tip portion can be located adjacent to the distal end of the catheter shaft, the flexible tip portion comprising a flexible framework. A plurality of microelectrodes can be disposed on the flexible framework and can form a flexible array of microelectrodes adapted to conform to tissue. A plurality of conductive traces can be disposed on the flexible framework, each of the plurality of conductive traces can be electrically coupled with a respective one of the plurality of microelectrodes.

Abstract: A connection device for a deflectable medical device, such as a catheter, comprises an elongate planarity wire having a proximal end and a distal end, an elongate activation wire having a proximal end a distal end, a passage and an interface. The passage extends through the planarity wire near the distal end of the planarity wire. The distal end of the activation wire extends through the passage. The interface is between the passage and the activation wire, and may comprise one or more of the following: a hook and bore interface, a detent interface, a mechanical interface, or a metallurgical interface.

Abstract: An integrated electrode structure can comprise a catheter shaft comprising a proximal end and a distal end, the catheter shaft defining a catheter shaft longitudinal axis. A flexible tip portion can be located adjacent to the distal end of the catheter shaft, the flexible tip portion comprising a flexible framework. A plurality of microelectrodes can be disposed on the flexible framework and can form a flexible array of microelectrodes adapted to conform to tissue. A plurality of conductive traces can be disposed on the flexible framework, each of the plurality of conductive traces can be electrically coupled with a respective one of the plurality of microelectrodes.

Abstract: An integrated electrode structure can comprise a catheter shaft comprising a proximal end and a distal end, the catheter shaft defining a catheter shaft longitudinal axis. A flexible tip portion can be located adjacent to the distal end of the catheter shaft, the flexible tip portion comprising a flexible framework. A plurality of microelectrodes can be disposed on the flexible framework and can form a flexible array of microelectrodes adapted to conform to tissue. A plurality of conductive traces can be disposed on the flexible framework, each of the plurality of conductive traces can be electrically coupled with a respective one of the plurality of microelectrodes.

Abstract: An integrated electrode structure can comprise a catheter shaft comprising a proximal end and a distal end, the catheter shaft defining a catheter shaft longitudinal axis. A flexible tip portion can be located adjacent to the distal end of the catheter shaft, the flexible tip portion comprising a flexible framework. A plurality of microelectrodes can be disposed on the flexible framework and can form a flexible array of microelectrodes adapted to conform to tissue. A plurality of conductive traces can be disposed on the flexible framework, each of the plurality of conductive traces can be electrically coupled with a respective one of the plurality of microelectrodes.

Abstract: An elongate medical device may include an elongate body defining a longitudinal axis, a sensor, and a flexible substrate wrapped so as to form a tube. The sensor may be disposed within the tube, and the tube may be disposed about the longitudinal axis. The elongate body may be a corewire, in an embodiment, and the corewire may extend through the tube. The sensor may comprise a coil, in an embodiment, and the corewire may extend through the coil. The elongate medical device may be a guidewire, in an embodiment.

Abstract: A medical device for the diagnosis or treatment of tissue in a body and method for fabricating the same are provided. The device includes an elongate, tubular, deformable shaft comprising a proximal end and a distal end. The device also includes an electronic subassembly (54) disposed within the shaft and a conductor (76, 78) coupled to and extending from the electronic subassembly. The electronic subassembly includes a flexible substrate (72) and an electronic device (74). The flexible substrate comprises an interior side (84) and an exterior side (86) opposite the interior side. The flexible substrate also defines a first conductive area (92, 94). The electronic device is mounted on the interior side of the flexible substrate, is coupled to the first conductive area, and is at least partially enclosed within the flexible substrate.

Abstract: An integrated electrode structure can comprise a catheter shaft comprising a proximal end and a distal end, the catheter shaft defining a catheter shaft longitudinal axis. A flexible tip portion can be located adjacent to the distal end of the catheter shaft, the flexible tip portion comprising a flexible framework. A plurality of microelectrodes can be disposed on the flexible framework and can form a flexible array of microelectrodes adapted to conform to tissue. A plurality of conductive traces can be disposed on the flexible framework, each of the plurality of conductive traces can be electrically coupled with a respective one of the plurality of microelectrodes.

Abstract: A medical device for the diagnosis or treatment of tissue in a body and method for fabricating the same are provided. The device includes an elongate, tubular, deformable shaft comprising a proximal end and a distal end. The device also includes an electronic subassembly (54) disposed within the shaft and a conductor (76, 78) coupled to and extending from the electronic subassembly. The electronic subassembly includes a flexible substrate (72) and an electronic device (74). The flexible substrate comprises an interior side (84) and an exterior side (86) opposite the interior side. The flexible substrate also defines a first conductive area (92, 94). The electronic device is mounted on the interior side of the flexible substrate, is coupled to the first conductive area, and is at least partially enclosed within the flexible substrate.

Abstract: Methods of manufacturing and assembling a catheter shaft may include depositing electrical traces on an interior surface of the shaft of the catheter, rather than using separate wires, forming a bore in a sensor, and electrically coupling the sensor to the trace through a bore in the sensor.

Abstract: In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected using an interposer. In one embodiment, the interposer 106 includes columnar interconnects which may be fabricated by etching a conductive member such as copper foil, for example. In one application, the pitch or center to center spacing of the columnar interconnects may be defined by masking techniques to provide an interconnect pitch suitable for a particular application. In yet another aspect, etching rates may be controlled to provide height to width aspect ratios of the columnar interconnects which are suitable for various applications.

Abstract: In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected using an interposer. In one embodiment, the interposer 106 includes columnar interconnects which may be fabricated by etching a conductive member such as copper foil, for example. In one application, the pitch or center to center spacing of the columnar interconnects may be defined by masking techniques to provide an interconnect pitch suitable for a particular application. In yet another aspect, etching rates may be controlled to provide height to width aspect ratios of the columnar interconnects which are suitable for various applications.

Abstract: In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected using an interposer. In one embodiment, the interposer 106 includes columnar interconnects which may be fabricated by etching a conductive member such as copper foil, for example. In one application, the pitch or center to center spacing of the columnar interconnects may be defined by masking techniques to provide an interconnect pitch suitable for a particular application. In yet another aspect, etching rates may be controlled to provide height to width aspect ratios of the columnar interconnects which are suitable for various applications.

Abstract: The main new features of the disclosure relate to the ability to add stiffness to a shield portion of an active implantable medical device (AIMD) without increasing the net displaced volume to the AIMD in application. A number of techniques for adding stiffness are disclosed, depicted and claimed herein; for example using a sheet or strip(s) of material. A sheet of material can be bonded to a portion of an AIMD housing where an internal component makes contact with and/or is otherwise supported by the housing. The sheet and/or rib can be adhered or welded, soldered, brazed, etc. The sheet or rib can couple to the interior and/or exterior of the housing. Also, preproduction preparation of bulk material used to fabricate the shields can include region(s) of increased cross section (thickness). Such bulk material can have regions of increased cross section (thickness) that correspond to production equipment for punching, shaping and/or trimming the bulk material into the desired AIMD housing.

Abstract: A system may include an integrated circuit die, an integrated circuit package coupled to the integrated circuit die, mold compound in contact with the integrated circuit die and the integrated circuit package, and an interconnect coupled to the integrated circuit package. A first portion of the interconnect may be in contact with the mold compound, a second portion of the interconnect might not contact the mold compound, and a third portion of the interconnect may be in contact with the integrated circuit package.

Abstract: Electronic device support and processing methods are described. One embodiment includes a method of processing an electronic device including solder bumps extending therefrom. The method includes providing at least one fluid selected from the group consisting of electrorheological fluids and magnorheological fluids on a support structure. The solder bumps extending from the electronic device are positioned in the fluid. The fluid is activated by applying a field selected from the group consisting of an electric field and a magnetic field to the fluid. The activated fluid mechanically holds the electronic device in place. A surface of the electronic device is polished while the electronic device is held in place by the activated fluid. The fluid is deactivated by removing the applied field from the fluid, and the electronic device is separated from the deactivated fluid. Other embodiments are described and claimed.

Abstract: An apparatus including a support substrate comprising a plurality of first support contacts and a plurality of second support contacts on a surface of the support substrate; a chip comprising a plurality of circuits coupled to respective ones of a plurality of externally accessible chip contacts, wherein the chip contacts are coupled to respective ones of the first support contacts; a plurality of fusible masses coupled to respective ones of the plurality of second support contacts; an electrically-insulating encapsulant on the support substrate and the chip. A method including forming a plurality of fusible masses on respective ones of a plurality of externally accessible support contacts on a surface of a support substrate, the substrate further comprising a circuit structure on the surface; and encapsulating a portion of the support substrate and the circuit structure with an electrically insulating encapsulant.