Abstract: Heat is removed from electronic components located within a closed housing by the use of a heat-conducting metal clip mounted on the housing cover so as to be in pressure contact with the electronic components. The metal clip includes a U-shaped mounting portion firmly clamped to a clip-mounting wall projecting from the cover, and a series of spring arms extending through a slot opening in the cover into pressure contact with individual electronic components. The clamp force of the clip on the mounting wall is designed to act independently of the pressure exerted by each spring arm on an associated electronic component.

Abstract: A heat sinking module cover for use with a potted electronic module assembly is disclosed. An electronic module assembly contains heat generating electrical components. Typically the electrical components are held in relation to a module housing. The module housing, generally, not only provides support but also acts as a heat sink for heat generating electrical components. The electrical components are covered by a potting compound. The potting compound protects the electrical components from dust or any other particles that could affect the function of the electrical component. The present invention discloses a heat sinking module cover with a support portion and a thermal transfer portion. The heat sinking module cover is positioned with respect to the module housing to form a box-like structure. The thermal transfer portion contacts the potting material directly to provide an additional heat sinking means for the electronic module assembly.

Abstract: A mounting assembly mounts an integrated circuit between a printed circuit board and a lower surface of a heat sink. The mounting assembly includes a plurality of electrical leads extending out from the integrated circuit and toward the printed circuit board. The electrical leads extend in a direction away from the lower surface of the heat sink. A spring is secured to the heat sink and disposed adjacent the printed circuit board and facing the integrated circuit to abut the lower surface of the heat sink such that thermal energy will pass from the integrated circuit to the heat sink.