Abstract: A gas sensor assembly including a substrate located in a housing. The substrate includes a high temperature gas sensor end and a lower temperature electronics end. A heat transfer, sealing, and support plug is mounted in the housing to the substrate. The plug seals the sensor end from the electronics end and transfers the heat generated at the high temperature sensor end successively through the substrate, the thermally conductive plug, the housing, and into the outside air. In one embodiment, the housing includes a collar which surrounds a portion of the substrate and is coupled to and supported on one end of the plug and a jacket which surrounds the electronics end of the substrate and includes a neck coupled to and supported on an opposite end of the plug.

Abstract: A printing screen which, in one embodiment, is adapted to print resistors on a substrate including conductors. An emulsion material covers at least a first area of the screen and at least a second area of the screen defines a region of the screen through which a thick film paste material passes and is deposited onto the substrate to form the resistors. A pattern of recesses, defined in the bottom surface of the layer of emulsion material, matches the pattern of conductors on the substrate. When the screen is lowered onto or near the substrate, the conductors are fitted into the respective recesses to assure that during printing the screen lays flat against the substrate irrespective of the number, size, or location of the conductors on the substrate for forming resistors of uniform thickness and thus uniform resistance.

Abstract: A sensor is disclosed for sensing an applied load. The sensor includes a rigid substrate. A strain sensitive resistor is mounted to the substrate. The resistor has a pair of ends. The resistor has a length and a width that defines an area. A pair of conductors are connected to the end of the resistor. A dielectric layer is mounted over the resistor. A load transfer device is mounted to the dielectric layer. The load transfer device transfers the applied load directly to the strain sensitive resistor such that the resistor is compressed. The resistor changes resistance in response to the applied load.

Abstract: A sensor is disclosed for sensing an applied load. The sensor includes a rigid substrate. A strain sensitive resistor is mounted to the substrate. The resistor has a pair of ends. The resistor has a length and a width that defines an area. A pair of conductors are connected to the end of the resistor. A dielectric layer is mounted over the resistor. A load transfer device is mounted to the dielectric layer. The load transfer device transfers the applied load directly to the strain sensitive resistor such that the resistor is compressed. The resistor changes resistance in response to the applied load.

Abstract: A ball grid array package includes a substrate with a top and bottom surface. A circuit component is located on the bottom surface. The circuit component has a pair of ends. A pair of conductors are located on the bottom surface. The conductors are connected to the ends of the circuit component. A conductive epoxy covers a portion of the conductors and a portion of the bottom surface. The conductive epoxy is in electrical contact with the conductors. A ball is connected to the conductive epoxy. The conductive epoxy provides an electrical connection between the conductor and the ball. The ball is preferably copper and is subsequently coated to prevent corrosion. Other embodiments of the invention are shown in which the balls are omitted and in which the conductive epoxy is used to fill vias in a substrate.

Abstract: A strain sensor that is suited for use as an occupant weight sensor in a vehicle seat is disclosed. The strain sensor includes a substrate having a top surface and a bottom surface. Several bumps are located on the top surface. The bumps extend above the top surface. The bumps are arranged in a pattern. A dielectric material is located on the top surface. At least one strain sensitive resistor is located on the dielectric material. Several conductive traces are formed on the dielectric material and are electrically connected with the strain sensitive resistor.

Abstract: A ball grid array package that can be readily tested before or after mounting to a printed circuit board. The ball grid array includes a substrate having a top surface and a bottom surface. Several conductive pads are located on the top surface. Several passive circuit elements are located on the top surface between the conductive pads. An insulative coating is placed on top of the passive circuit elements and the substrate. The insulative coating has openings over the conductive pads. The openings are adapted to be accessible by an electrical probe. Conductive vias extend through the substrate between the top and bottom surfaces. The vias electrically connect with the conductive pad on the top surface. Several conductive balls are located on the bottom surface. Each conductive ball is electrically connected to one of the vias.

Abstract: A cost-effective communication filter is prepared by etching the surfaces of a shaped and fired ceramic core, applying an electroless nickel solution to create a nickel layer of limited thickness, electroplating the nickel plated core with a silver layer, patterning the nickel and silver plated core by removing metallization from selected surface areas and then heating the patterned filter block to bond the metal layers. The resulting filters comprise a rigid dielectric core defining a plurality of through-hole passages extending between opposing sides of the core. Present on the core is a pattern of metallized and unmetallized regions wherein the metallized regions of the pattern include an inner layer of nickel and an outer silver-containing layer.

Abstract: A conductive composition for filling a via. The composition is based on total composition and has 4.0-12.0 wt. % organic vehicle and 88.0-96.0 wt. % electrically conductive particles selected from the group consisting of silver and nickel and mixtures thereof.

Abstract: A cost-effective communication filter is prepared by etching the surfaces of a shaped and fired ceramic core, applying an electroless nickel solution to create a nickel layer of limited thickness, electroplating the nickel plated core with a silver layer, patterning the nickel and silver plated core by removing metallization from selected surface areas and then heating the patterned filter block to bond the metal layers. The resulting filters comprise a rigid dielectric core defining a plurality of through-hole passages extending between opposing sides of the core. Present on the core is a pattern of metallized and unmetallized regions wherein the metallized regions of the pattern include an inner layer of nickel and an outer silver-containing layer.

Abstract: A conductive composition for filling a via. The composition is based on total composition and has 4.0-12.0 wt. % organic vehicle and 88.0-96.0 wt. % electrically conductive particles selected from the group consisting of silver and nickel and mixtures thereof.

Abstract: A ball grid array resistor network has a substrate that has top and bottom surfaces. Resistors are disposed on the top surface. Conductors are disposed on the top surface, and each conductor is electrically connected to an end of each resistor. Vias extend through the substrate and are electrically connected to the conductors. Solder spheres are disposed on the bottom surface, and are electrically connected to the vias. A cover coat is disposed over the conductors and resistors. In an alternative embodiment, the vias are eliminated and the resistor network is formed on the bottom surface of the substrate. The resistor network provides a high density of resistors per unit area.

Abstract: A wave transmission line terminator having application in computer data buss termination, single and multiple channel analog transmission line termination and other similar terminations uses thick film components including resistors and capacitors in combination with a ball grid array termination. The thick film resistors are placed on a first side of a substrate opposite the capacitors and ball grid array, and are electrically connected thereto by electrically conductive vias in the substrate. Several different configurations are disclosed which make the terminator more suitable for specific application.

Abstract: A fuel level indicator system that utilizes a resistor card having an arc-shaped resistive path with a first set of spaced apart conductor lines and an arc-shaped resistive ink material overlying the first set of conductor lines. The first conductor lines are formed at an angle with respect to a radial line drawn from the center of the resistive path arc. The resistor card also has an arc-shaped continuously solid conductor base and a second set of spaced apart conductor lines extending from the base at an angle with respect to a radial line drawn from the center of the arc-shaped conductor base. The system includes a wiper assembly having a pair of spaced apart arms. Each arm has a plurality of parallel fingers extending from one end. One of the fingers on a first arm engages a conductor line on the resistive path and a second finger on the first arm engages an adjacent conductor line along the resistive path.

Abstract: A ball grid array capacitor has a substrate with a top and bottom surface and a via extending through the substrate. Several capacitors are located on the bottom surface. The capacitors include a top electrode connected to the via, a dielectric layer connected to the top electrode, and a bottom electrode that is connected to the dielectric layer and a ball pad over the bottom electrode. A passivation layer is located between the capacitors. Several solder spheres are electrically and mechanically connected to the bottom electrode. A resistor can be mounted on the top surface and connected to the via to form a filter.

Abstract: A resistor network for terminating active electronic devices has low cross talk noise between the adjoining resistors and the conductors that connect the resistors to other electronic packages. A substrate has a top and a bottom surface. Resistors are located on the top surface. Conductors are also located on the top surface and are electrically connected to each end of the resistors. Vias extend through the substrate and electrically connect to the conductors. Solder spheres are positioned on the bottom surface and are electrically connected to the vias. An end of each of the resistors is electrically connected in common through a common conductor. The commoned resistors are electrically connected to a common via through the common conductor. The resistor network minimizes cross talk noise between the resistors and provides a high density interconnection.

Abstract: An aluminum nitride housing is molded which includes open holes that pass through the walls. A lead frame is formed by machining or chemically milling individual leads and details therein to form desired circuitry patterns. The lead frame is inserted through the open holes in the aluminum nitride housing and chemically and mechanically bonded thereto using active braze The active braze attaches the lead frame not only to the open holes in the package, but also to the wall of the housing over a larger area. Active braze forms a strong bond between the aluminum nitride and the lead frame, and also forms an excellent and highly reliable thermal junction therebetween. Several different package constructions are illustrated. In one design the aluminum nitride takes on a bathtub configuration onto which a flat cover may be attached.

Abstract: Solder active braze compositions are disclosed which enable the formation of circuit traces having improved leach resistance during soldering operations so that it is not necessary to apply protective coatings onto the circuit traces. Additionally, the solder active braze compositions disclosed herein can be readily soldered to so that it is not necessary to separately apply a coating onto the circuit trace so that electrical connections can be made to the traces by soldering. Also disclosed are electronic assemblies comprising circuit traces formed from the particular solder active braze compositions, and methods of forming such electronic assemblies.

Abstract: Hermetically sealed chip packages are described which are capable of withstanding elevated temperatures and accompanying temperature fluctuations. The chip packages feature electrically conductive, hermetic vias which provide electrical pathways through generally dielectric ceramic substrates employed in the chip package. Methods of forming such hermetic vias are also disclosed.

Abstract: An apparatus for fabricating composite porcelain substrates employing alternating layers of wire cloth and porcelain green sheet material is disclosed, wherein those alternating layers are compressed toward one another at a somewhat elevated temperature and then kiln fired at a further elevated temperature to form a glazed porcelain surface for receiving further electrical circuitry, for example, of the microelectronic type. Such a composite porcelain substrate has good thermal properties of high conductivity and low coefficient of expansion as well as good electrical insulating properties and mechanical strength. In particular its thermal expansion properties are well matched to many surface mounted devices that may be placed on the substrate thereby reducing the likelihood of thermal damage of device connections. The substrate cost is very low in comparison to the currently available alternatives.