Abstract: Methods and systems for monitoring use, determining risk, and pricing insurance policies for a vehicle having one or more autonomous or semi-autonomous operation features are provided. According to certain aspects, an identity of a vehicle operator may be determined and a vehicle operator profile and/or operating data regarding autonomous operation features of the vehicle may be received after the vehicle operator opts into a rewards program and agrees to share their data. Autonomous operation and vehicle operator risk levels associated with operation of the autonomous or semi-autonomous vehicle may be determined. Based upon the risk levels and/or comparison thereof, one or more autonomous operation features may be disengaged. A preparedness level of the vehicle operator to assume or reassume control of operating the vehicle is determined prior to disengagement. If satisfactory, an alert is presented to the vehicle operator prior to disengagement of the autonomous operation features.

Abstract: According to certain aspects, a computer-implemented method for operating an autonomous or semi-autonomous vehicle may be provided. With the customer's permission, an identity of a vehicle operator may be identified and a vehicle operator profile may be retrieved. Operating data regarding autonomous operation features operating the vehicle may be received from vehicle-mounted sensors. When a request to disable an autonomous feature is received, a risk level for the autonomous feature is determined and compared with a driver behavior setting for the autonomous feature stored in the vehicle operator profile. Based upon the risk level comparison, the autonomous vehicle retains control of vehicle or the autonomous feature is disengaged depending upon which is the safer driver—the autonomous vehicle or the vehicle human occupant. As a result, unsafe disengagement of self-driving functionality for autonomous vehicles may be alleviated.

Abstract: The method of removing an epoxy bonded microelectronic component from a substrate includes the steps of heating a removal tool comprising a blade portion. The heated blade portion engages against the cured epoxy positioned around the edge of the component, and the epoxy is removed. The blade portion is positioned between an edge of the component and an adjacent portion of the substrate to lift the component from the substrate. A screwdriver receiving tip can also be attached to the removal tool. The screwdriver receiving tip includes an orifice that receives a screwdriver shaft that is freely rotatable therein. The removal tool is heated, thereby heating the screwdriver receiving tip and screwdriver shaft so that any screw to be removed is heated and removed. A tool is also disclosed for removing the microelectronic component from a substrate. The tool includes a removal tool comprising a proximal body and a distal heating end.

Abstract: The method of removing an epoxy bonded microelectronic component from a substrate includes the steps of heating a removal tool comprising a blade portion. The heated blade portion engages against the cured epoxy positioned around the edge of the component, and the epoxy is removed. The blade portion is positioned between an edge of the component and an adjacent portion of the substrate to lift the component from the substrate. A screwdriver receiving tip can also be attached to the removal tool. The screwdriver receiving tip includes an orifice that receives a screwdriver shaft that is freely rotatable therein. The removal tool is heated, thereby heating the screwdriver receiving tip and screwdriver shaft so that any screw to be removed is heated and removed. A tool is also disclosed for removing the microelectronic component from a substrate. The tool includes a removal tool comprising a proximal body and a distal heating end.