Abstract: An embroidery surface treating device comprising a cloth support table (12) having an air-permeable plate (12a) at an opening part on the upper surface thereof, a suction device (13) for sucking, from underside, an embroidery cloth (1) embroidered in a state stacked with one to a plurality of sheets (5) and placed on the cloth support table (12), and a cutter (18) for sequentially cutting and removing the needle threads (2) of embroidery patterns appearing on the surface of the uppermost sheet of the plurality of sheets stacked on the embroidery cloth (1) placed on the cloth support table (12) while relatively moving in parallel with the cloth support table (12) or for sequentially cutting off the needle threads (2) of embroidery patterns between any adjacent sheets (5) and (5) of the plurality of stacked sheets (5), whereby the needle threads erected to a desired height in a tufty and fluffy state can be formed easily and stereoscopic imposing embroidery patterns can be obtained.

Abstract: A method for forming an embroidery pattern which comprises embroidering a cloth (1) for embroider by the use of an ordinary embroidery yam as a needle thread (2) and, as a bobbin thread (5), a yam obtained by twisting together an ordinary yarn used usually and a yam formed with a material capable of thermal fusion splicing or a yam obtained by covering an ordinary yam with a material capable of thermal fusion splicing, then heating them to fuse the material capable of thermal fusion splicing in the bobbin thread (5) and splice the ordinary yam of the bobbin thread and the needle thread (2) appearing on the back of the above cloth (1) to the back of the above cloth (1), and cutting each needle thread (2) appearing on the front surface of the cloth (1) at an intermediate portion thereof, thereby fluffing the needle thread (2) out; and a cloth having an embroidery pattern formed by the method or a method similar to that.

Abstract: A thermoelectric module is capable of successfully reducing the heat stress for increased reliability. The module includes a plurality of thermoelectric chips of P-type and N-type arranged in a matrix between sets of first and second contacts to form a series electrical circuit. The chips are arranged to give at least three chip arrays each having a limited number of the chips. A first carrier is provided on one side of the chips to carry the first contacts and to include first bridges each integrally joining two adjacent first contacts to define first discrete couples for electrical connection of the chips in each chip array. The first carrier further includes at least two inter-array bridges which are solely responsible for electrical interconnection between the adjacent chip arrays.

Abstract: A thermoelectric module is capable of successfully reducing the heat stress for increased reliability. The module includes a plurality of thermoelectric chips of P-type and N-type arranged in a matrix between sets of first and second contacts to form a series electrical circuit. The chips are arranged to give at least three chip arrays each having a limited number of the chips. A first carrier is provided on one side of the chips to carry the first contacts and to include first bridges each integrally joining two adjacent first contacts to define first discrete couples for electrical connection of the chips in each chip array. The first carrier further includes at least two inter-array bridges which are solely responsible for electrical interconnection between the adjacent chip arrays.

Abstract: A method of fabricating a thermoelectric module in which a plurality of thermoelectric chips are arranged in a matrix between first and second dielectric substrates and electrically connected in series so as to heat one of the substrates and cool the other substrate. Elongated thermoelectric bars of P-type and N-type to be cut into the chips are employed together with a first conductive plate having a plurality of first contacts arranged in a matrix pattern. Adjacent first contacts spaced along the row are interconnected by horizontal bridges.

Abstract: A Peltier effect module comprising a plurality of Peltier effect elements arranged in parallel between a pair of substrates where the Peltier effect elements are connected to connection electrodes disposed on the substrates. The array of Peltier effect elements is sealed off by a hollow seal frame surrounding the Peltier effect element array with a seal formed by a bond between both end edges of the seal frame and the substrates. Because the perimeter around the Peltier effect elements is sealed using a seal frame metalically bonded at both ends to the substrates, resistance to moisture penetration is largely determined by the material from which the seal frame is made. Therefore, by appropriately selecting the seal frame materials, the Peltier effect module can be reliably protected for a long period of time against moisture penetration.

Abstract: A keyless chuck for a rotary tool comprises a chuck body which is adapted to be coupled at its one end to a drive spindle of a drive source and coupled at the other end to a tool bit for establishing a driving connection from the drive source to the tool bit. Relatively rotatable to the chuck body is a handle ring which is operatively connected to a set of gripping jaws for tightening the gripping jaws on the tool bit upon being rotated in one direction and loosening the same upon being rotated in the opposite direction. The handle ring is disposed on the chuck body in such a manner as to coincide the rotating direction of the handle ring for tightening the gripping jaws with the reverse rotating direction of the chuck body for removing the tool bit from a workpiece.