Patents by Inventor Teruaki Konishi
Teruaki Konishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11615971Abstract: There is provided a substrate processing apparatus including: a processing part configured to process a substrate with a processing liquid; and a processing liquid generation part configured to generate the processing liquid supplied to the processing part. The processing liquid generation part includes: a reservoir configured to store the processing liquid; a circulation line through which the processing liquid stored in the reservoir is circulated; a heater configured to heat the processing liquid; and a nozzle provided at a downstream side of the circulation line and has at least one ejection port formed to eject the processing liquid heated by the heater from above a liquid level of the processing liquid stored in the reservoir.Type: GrantFiled: December 12, 2019Date of Patent: March 28, 2023Assignee: TOKYO ELECTRON LIMITEDInventors: Teruaki Konishi, Kouzou Kanagawa, Osamu Kuroda, Koji Tanaka, Kotaro Tsurusaki, Hidemasa Aratake, Kouji Ogura, Keita Hirase
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Patent number: 11424141Abstract: A substrate processing apparatus, a substrate processing method and a recording medium capable of shortening an etching processing time are provided. The substrate processing apparatus includes a substrate processing tub, a mixing unit and a supply line. The substrate processing tub is configured to perform an etching processing therein with an etching liquid. The mixing unit is configured to mix a new liquid with a silicon-containing compound or a liquid containing the silicon-containing compound. The supply line is configured to supply a mixed solution mixed by the mixing unit into the substrate processing tub.Type: GrantFiled: October 19, 2018Date of Patent: August 23, 2022Assignee: TOKYO ELECTRON LIMITEDInventors: Jian Zhang, Takao Inada, Hisashi Kawano, Seigo Fujitsu, Hideaki Sato, Teruaki Konishi, Toshiyuki Shiokawa, Koji Ogura, Hiroshi Yoshida
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Patent number: 11152234Abstract: A processing liquid used in a substrate liquid processing apparatus can be supplied in a constant amount with high accuracy. A substrate liquid processing apparatus A1 includes a storage line 61 configured to store a processing liquid therein; an introduction line 62 configured to introduce the processing liquid into the storage line 61; a discharge line 63 configured to discharge the processing liquid from the storage line 61; and a gas supply unit 65 configured to perform a strickling of the processing liquid by jetting a gas to a surface of the processing liquid stored in the storage line 61.Type: GrantFiled: March 29, 2018Date of Patent: October 19, 2021Assignee: TOKYO ELECTRON LIMITEDInventors: Teruaki Konishi, Kazusige Sano, Koji Tanaka
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Publication number: 20200194280Abstract: There is provided a substrate processing apparatus including: a processing part configured to process a substrate with a processing liquid; and a processing liquid generation part configured to generate the processing liquid supplied to the processing part. The processing liquid generation part includes: a reservoir configured to store the processing liquid; a circulation line through which the processing liquid stored in the reservoir is circulated; a heater configured to heat the processing liquid; and a nozzle provided at a downstream side of the circulation line and has at least one ejection port formed to eject the processing liquid heated by the heater from above a liquid level of the processing liquid stored in the reservoir.Type: ApplicationFiled: December 12, 2019Publication date: June 18, 2020Inventors: Teruaki KONISHI, Kouzou KANAGAWA, Osamu KURODA, Koji TANAKA, Kotaro TSURUSAKI, Hidemasa ARATAKE, Kouji OGURA, Keita HIRASE
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Publication number: 20190122906Abstract: A substrate processing apparatus, a substrate processing method and a recording medium capable of shortening an etching processing time are provided. The substrate processing apparatus includes a substrate processing tub, a mixing unit and a supply line. The substrate processing tub is configured to perform an etching processing therein with an etching liquid. The mixing unit is configured to mix a new liquid with a silicon-containing compound or a liquid containing the silicon-containing compound. The supply line is configured to supply a mixed solution mixed by the mixing unit into the substrate processing tub.Type: ApplicationFiled: October 19, 2018Publication date: April 25, 2019Inventors: Jian Zhang, Takao Inada, Hisashi Kawano, Seigo Fujitsu, Hideaki Sato, Teruaki Konishi, Toshiyuki Shiokawa, Koji Ogura, Hiroshi Yoshida
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Publication number: 20180286718Abstract: A processing liquid used in a substrate liquid processing apparatus can be supplied in a constant amount with high accuracy. A substrate liquid processing apparatus A1 includes a storage line 61 configured to store a processing liquid therein; an introduction line 62 configured to introduce the processing liquid into the storage line 61; a discharge line 63 configured to discharge the processing liquid from the storage line 61; and a gas supply unit 65 configured to perform a strickling of the processing liquid by jetting a gas to a surface of the processing liquid stored in the storage line 61.Type: ApplicationFiled: March 29, 2018Publication date: October 4, 2018Inventors: Teruaki Konishi, Kazusige Sano, Koji Tanaka
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Patent number: 9355875Abstract: Liquid processing units 2 each for performing a liquid process on a substrate are arranged horizontally side by side, a gas exhaust pipe 3 for exhausting an atmosphere within the liquid processing units is provided under the liquid processing units 2 to be extended along an arrangement of the liquid processing units 2, and a flow control member group 402 is disposed under the gas exhaust pipe 3. Liquid supply main pipe 5 and liquid drain main pipe 6 are provided under the flow control member group 402 to be extended along the arrangement of the liquid processing units 2. Liquid supply branch pipes are branched from the liquid supply main pipe 5 and connected with the liquid processing unit 2 via the flow control member group 402, and liquid drain branch pipes are branched from the liquid drain main pipe 6 and connected with the liquid processing unit 2.Type: GrantFiled: December 27, 2011Date of Patent: May 31, 2016Assignee: TOKYO ELECTRON LIMITEDInventors: Teruaki Konishi, Takahiro Tetsuka
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Publication number: 20120160353Abstract: A liquid processing apparatus includes at least one liquid processing unit for performing a liquid process on a substrate with a processing solution; supply pipes for supplying the processing solution into the at least one liquid processing unit; a housing accommodating a flow control member group provided on the supply pipes; and an upstream port and a downstream port detachably connected to the supply pipes located at an upstream side of the flow control member group and a downstream side of the flow control member group, respectably. Here, one end of the supply pipes is connected with the liquid processing unit and the other end thereof is extended to below the liquid processing unit and both the upstream and downstream ports are provided in the housing facing a main maintenance region located at a lateral side of the liquid processing apparatus.Type: ApplicationFiled: December 28, 2011Publication date: June 28, 2012Applicant: TOKYO ELECTRON LIMITEDInventors: Teruaki Konishi, Takahiro Tetsuka
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Publication number: 20120160279Abstract: Liquid processing units 2 each for performing a liquid process on a substrate are arranged horizontally side by side, a gas exhaust pipe 3 for exhausting an atmosphere within the liquid processing units is provided under the liquid processing units 2 to be extended along an arrangement of the liquid processing units 2, and a flow control member group 402 is disposed under the gas exhaust pipe 3. Liquid supply main pipe 5 and liquid drain main pipe 6 are provided under the flow control member group 402 to be extended along the arrangement of the liquid processing units 2. Liquid supply branch pipes are branched from the liquid supply main pipe 5 and connected with the liquid processing unit 2 via the flow control member group 402, and liquid drain branch pipes are branched from the liquid drain main pipe 6 and connected with the liquid processing unit 2.Type: ApplicationFiled: December 27, 2011Publication date: June 28, 2012Applicant: TOKYO ELECTRON LIMITEDInventors: Teruaki Konishi, Takahiro Tetsuka
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Patent number: 6340330Abstract: An object of the present invention is to provide a game device which gives variety to a fighting game for leading a player to play the game repeatedly, and to provide an information storage medium usable in the game device. The player can select one of a normal game mode in which a game character controlled by the player fights against an enemy game character and a weapon obtaining mode in which the player's game character can obtain an item (e.g., weapon) to be used. The weapon obtained in the weapon obtaining mode can be used in the normal game mode. Depending on the weapon used by the player's game character, various functions such as the number and type of special techniques, the basic position, a series of actions subsequent to the basic position, a hit area of weapon, offensive power, durability and so on may be changed in the same game character controlled by the player. The weapon obtaining mode may also be used as an operation guidance mode for beginners.Type: GrantFiled: September 21, 1998Date of Patent: January 22, 2002Assignee: Namco Ltd.Inventors: Masuya Oishi, Teruaki Konishi, Hiroaki Yotoriyama, Tadashi Iguchi