Patents by Inventor Teruhiko Ogawa

Teruhiko Ogawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8396605
    Abstract: A system, for simulating a heat and power supply facility, that is capable of easily constructing a heat and power supply facility, and that performs a simulation so as to approximate operating conditions including a load factor to an actual situation, by approximating, to a high accuracy, any item included in a total combined energy to a target value.
    Type: Grant
    Filed: April 17, 2009
    Date of Patent: March 12, 2013
    Assignee: E. I. Engineering Co., Ltd.
    Inventors: Teruhiko Ogawa, Satoshi Shimizu, Toshiko Kurata
  • Publication number: 20110035069
    Abstract: There is provided a system, for simulating a heat and power supply facility, that is capable of easily constructing a heat and power supply facility, and that performs a simulation so as to approximate operating conditions including a load factor to an actual situation, by approximating, to a high accuracy, any item included in a total combined energy to a target value. A system configuration setting section (30) associates in advance the heat and power supply devices with each other and associates in advance the heat and power supply devices with the total combined energy, and selects any of the heat and power supply devices with an operation of an operating condition section, to thereby freely construct a system configuration of the heat and power supply facility in which the heat and power supply devices are associated with each other and the heat and power supply devices are associated with the total combined energy.
    Type: Application
    Filed: April 17, 2009
    Publication date: February 10, 2011
    Applicant: E. I. Engineering Co., Ltd.
    Inventors: Teruhiko Ogawa, Satoshi Shimizu, Toshiko Kurata
  • Patent number: 6329461
    Abstract: A method of producing silicone-containing aqueous coating compositions excellent in shelf stability of the emulsion and in weather resistance, stain resistance, water resistance and solvent resistance of coatings derived therefrom is provided. The method comprises subjecting an aqueous emulsion prepared in advance by emulsification in an aqueous medium containing a polyalkoxypolysiloxane (A), an unsaturated monomer (B) and an emulsifier (C) so as to attain an oil droplet diameter not more than 1,000 nm to polymerization in the presence of a polymerization initiator (D).
    Type: Grant
    Filed: August 3, 1999
    Date of Patent: December 11, 2001
    Assignee: Nippon Gohsei Kagaku Kogyo Kabushiki Kaisha
    Inventors: Mamoru Akiyama, Teruhiko Ogawa, Akio Kitagawa, Masayuki Kyogoku