Abstract: An LED module includes a submount having a face in a thickness direction thereof, an LED chip bonded to the face of the submount with a first bond, and a patterned wiring circuit electrically connected to the LED chip. The first bond transmits light emitted from the LED chip. The submount is a light-transmissive member having light diffusing properties, and a planar size larger than a planar size of the LED chip. The patterned wiring circuit is provided on the face of the submount so as not to overlap the LED chip. The submount is constituted by a plurality of light-transmissive layers which are stacked in the thickness direction and have different optical properties so that a light-transmissive layer of the plurality of light-transmissive layers which is farther from the LED chip is higher in reflectance in a wavelength range of the light emitted from the LED chip.

Abstract: An LED module includes a submount having a face in a thickness direction thereof, an LED chip bonded to the face of the submount with a first bond, and a patterned wiring circuit electrically connected to the LED chip. The first bond transmits light emitted from the LED chip. The submount is a light-transmissive member having light diffusing properties, and a planar size larger than a planar size of the LED chip. The patterned wiring circuit is provided on the face of the submount so as not to overlap the LED chip. The submount is constituted by a plurality of light-transmissive layers which are stacked in the thickness direction and have different optical properties so that a light-transmissive layer of the plurality of light-transmissive layers which is farther from the LED chip is higher in reflectance in a wavelength range of the light emitted from the LED chip.

Abstract: An LED module includes: an opaque substrate on which a wiring circuit is provided; a submount bonded to a surface of the opaque substrate with a first bond; an LED chip bonded with a second bond to an opposite side of the submount from the opaque substrate; and wires electrically connecting the LED chip to patterned wiring circuit. In the LED module, the first bond and the second bond each allow light emitted from the LED chip to pass therethrough. The submount is a light-transmissive member. A lighting device includes a device main body and the LED module. The lamp includes the LED module.

Abstract: A tape cassette storage rack can accommodate tape cassettes of different sizes at a predetermined position. The accommodated tape cassette may be directly manually withdrawn from the rack without using a jig or the like. The tape storage racks create a high area efficiency available for the storing of the tape cassettes.

Abstract: An automatic cassette exchanging system for performing cassette exchange between an information recording/reproducing device such as VTR and a cassette storage device. The automatic cassette exchanging system has a basic unit comprising a box and a fixing type cassette storage case which is placed in line in the box with the information recording/reproducing device so that a robot moving space is formed in the front side portion of the box so as to face cassette entrance and exit ports of the fixing type cassette storage case. A cassette exchanging robot is provided in the robot moving space to be movable orthogonally for the cassette exchange therebetween. The automatic cassette exchanging system allows addition of a unit or units comprising a box which has a robot moving space and a rotatable type cassette storage case whose cassette entrance and exit ports can face the robot moving space.