Patents by Inventor Teruhito Takeuchi

Teruhito Takeuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device, a mobile communication device, and a method for manufacturing a semiconductor device
    Patent number: 8890334
    Abstract: There is reduced the difference in inductance between bonding wires to be coupled to two semiconductor chips stacked one over another. A semiconductor device includes external terminals, lower and upper semiconductor chips, and first and second bonding wires. The lower semiconductor chip has first bonding pads, and the upper semiconductor chip has second bonding pads. The first bonding wire couples the first bonding pad of the lower semiconductor chip and the external terminal, and the second bonding wire couples the second bonding pad of the upper semiconductor chip and the external terminal. The diameter of the second bonding wire is larger than the diameter of the first bonding wire.
    Type: Grant
    Filed: July 25, 2013
    Date of Patent: November 18, 2014
    Assignee: Renesas Electronics Corporation
    Inventors: Toru Narita, Teruhito Takeuchi, Joichi Saito
  • SEMICONDUCTOR DEVICE, A MOBILE COMMUNICATION DEVICE, AND A METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
    Publication number: 20140027906
    Abstract: There is reduced the difference in inductance between bonding wires to be coupled to two semiconductor chips stacked one over another. A semiconductor device includes external terminals, lower and upper semiconductor chips, and first and second bonding wires. The lower semiconductor chip has first bonding pads, and the upper semiconductor chip has second bonding pads. The first bonding wire couples the first bonding pad of the lower semiconductor chip and the external terminal, and the second bonding wire couples the second bonding pad of the upper semiconductor chip and the external terminal. The diameter of the second bonding wire is larger than the diameter of the first bonding wire.
    Type: Application
    Filed: July 25, 2013
    Publication date: January 30, 2014
    Applicant: Renesas Electronics Corporation
    Inventors: Toru Narita, Teruhito Takeuchi, Joichi Saito