Abstract: In a nozzle plate production method and apparatus, a metallic sheet material is punched to form nozzle holes therein by using a press having punches. Each of the punches includes a tapered conical portion, a straight cylindrical portion, and a rounded interconnecting portion. The interconnecting portion smoothly interconnects the conical portion and the cylindrical portion. Nibs produced on a bottom surface of the sheet material at the nozzle holes by the nozzle hole punching are removed by use of a tape grinding machine. A top surface and the bottom surface of the sheet material are buffed to provide a predetermined level of surface roughness. Burrs produced on the top and bottom surfaces of the sheet material at the nozzle holes by the buffing are removed by ultrasonic cleaning.

Abstract: An IC sheet cutting press performs a series of press cutting operations to separate ICs from an IC sheet while feeding the IC sheet stepwise. In the IC sheet cutting press, a series of press molds and an IC feed mechanism are mounted on a common die set to constitute a single press mold unit. When a different type of IC sheet is to be machined, the entire press mold unit can be exchanged with another one, so that various adjustments, e.g., adjustment of arrangement intervals of the press molds or a feed interval of the IC sheet can be omitted, and the operating efficiency of the cutting press and hence the compatibility are improved.An IC sheet processing apparatus, in which the IC sheet cutting press described aboved is combined with an automatic IC sheet loading unit, an IC lead bending press, and an IC storage unit for storing ICs after the lead bending operation, allows automatic IC sheet processing including the cutting operation of ICs from the IC sheet over a long period to time.