Patents by Inventor Terunao Hanaoka
Terunao Hanaoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10859814Abstract: In an electro-optical device, a mirror that is formed on an element substrate is sealed by a frame shaped spacer and a plate-like light-transmitting cover which is adhered to the spacer. An inorganic barrier layer is formed on an outer face of the spacer and a side face of the light-transmitting cover, and the boundary of the spacer and the light-transmitting cover is covered by the inorganic barrier layer.Type: GrantFiled: July 17, 2017Date of Patent: December 8, 2020Assignee: SEIKO EPSON CORPORATIONInventors: Terunao Hanaoka, Shuhei Yamada
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Patent number: 10156779Abstract: In an electro-optical device, a light-transmitting cover is disposed in mirrors, and when light is applied toward the mirrors through the light-transmitting cover, the temperature of the light-transmitting cover tires to increase due to the applied light. Here, in the electro-optical device, first metal portions that are in contact with the light-transmitting cover and the element substrate are formed. For this reason, it is possible to release the heat of the light-transmitting cover to a substrate through the first metal portions and the element substrate.Type: GrantFiled: December 28, 2017Date of Patent: December 18, 2018Assignee: SEIKO EPSON CORPORATIONInventor: Terunao Hanaoka
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Patent number: 10054787Abstract: In an electro-optical device, a mirror and the like which is formed on an element substrate is sealed using a sealing member. The sealing member is provided with a frame section and a cover section. In addition, the sealing member is provided on one face of the element substrate so that the mirror is surrounded by the element substrate and the sealing member and such that the mirror is positioned between a portion of the cover section and the element substrate. The sealing member is formed of a light-transmitting member having a frame section and a cover section which are integrally formed, and there is no interface between the frame section and the cover section.Type: GrantFiled: June 13, 2017Date of Patent: August 21, 2018Assignee: SEIKO EPSON CORPORATIONInventors: Suguru Uchiyama, Terunao Hanaoka
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Publication number: 20180120681Abstract: In an electro-optical device, a light-transmitting cover is disposed in mirrors, and when light is applied toward the mirrors through the light-transmitting cover, the temperature of the light-transmitting cover tires to increase due to the applied light. Here, in the electro-optical device, first metal portions that are in contact with the light-transmitting cover and the element substrate are formed. For this reason, it is possible to release the heat of the light-transmitting cover to a substrate through the first metal portions and the element substrate.Type: ApplicationFiled: December 28, 2017Publication date: May 3, 2018Applicant: SEIKO EPSON CORPORATIONInventor: Terunao HANAOKA
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Patent number: 9885945Abstract: In an electro-optical device, a light-transmitting cover is disposed in mirrors, and when light is applied toward the mirrors through the light-transmitting cover, the temperature of the light-transmitting cover tires to increase due to the applied light. Here, in the electro-optical device, first metal portions that are in contact with the light-transmitting cover and the element substrate are formed. For this reason, it is possible to release the heat of the light-transmitting cover to a substrate through the first metal portions and the element substrate.Type: GrantFiled: September 8, 2016Date of Patent: February 6, 2018Assignee: SEIKO EPSON CORPORATIONInventor: Terunao Hanaoka
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Publication number: 20170315344Abstract: In an electro-optical device, a mirror that is formed on an element substrate is sealed by a frame shaped spacer and a plate-like light-transmitting cover which is adhered to the spacer. An inorganic barrier layer is formed on an outer face of the spacer and a side face of the light-transmitting cover, and the boundary of the spacer and the light-transmitting cover is covered by the inorganic barrier layer.Type: ApplicationFiled: July 17, 2017Publication date: November 2, 2017Applicant: SEIKO EPSON CORPORATIONInventors: Terunao HANAOKA, Shuhei YAMADA
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Publication number: 20170276930Abstract: In an electro-optical device, a mirror and the like which is formed on an element substrate is sealed using a sealing member. The sealing member is provided with a frame section and a cover section. In addition, the sealing member is provided on one face of the element substrate so that the mirror is surrounded by the element substrate and the sealing member and such that the mirror is positioned between a portion of the cover section and the element substrate. The sealing member is formed of a light-transmitting member having a frame section and a cover section which are integrally formed, and there is no interface between the frame section and the cover section.Type: ApplicationFiled: June 13, 2017Publication date: September 28, 2017Applicant: SEIKO EPSON CORPORATIONInventors: Suguru UCHIYAMA, Terunao HANAOKA
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Patent number: 9748115Abstract: An aspect of the invention is an electronic component including a semiconductor substrate 11 that has an electrode pad 12, a first resin layer 14 and a third resin layer 15 that are located above the semiconductor substrate, a second resin layer 16 that is formed such that at least portions of the second resin layer are located on the first resin layer and the third resin layer, a resin projection 17 that includes the first to third resin layers and is higher than the first resin layer, and a wiring layer 24 that is electrically connected to the electrode pad and lies above the resin projection.Type: GrantFiled: November 12, 2015Date of Patent: August 29, 2017Assignee: SEIKO EPSON CORPORATIONInventor: Terunao Hanaoka
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Patent number: 9709800Abstract: In an electro-optical device, a mirror and the like which is formed on an element substrate is sealed using a sealing member. The sealing member is provided with a frame section and a coyer section. In addition, the sealing member is provided on one face of the element substrate so that the mirror is surrounded by the element substrate and the sealing member and such that the mirror is positioned between a portion of the cover section and the element substrate. The sealing member is formed of a light-transmitting member having a frame section and a cover section which are integrally formed, and there is no interface between the frame section and the cover section.Type: GrantFiled: February 5, 2016Date of Patent: July 18, 2017Assignee: SEIKO EPSON CORPORATIONInventors: Suguru Uchiyama, Terunao Hanaoka
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Publication number: 20160377965Abstract: In an electro-optical device, a light-transmitting cover is disposed in mirrors, and when light is applied toward the mirrors through the light-transmitting cover, the temperature of the light-transmitting cover tires to increase due to the applied light. Here, in the electro-optical device, first metal portions that are in contact with the light-transmitting cover and the element substrate are formed. For this reason, it is possible to release the heat of the light-transmitting cover to a substrate through the first metal portions and the element substrate.Type: ApplicationFiled: September 8, 2016Publication date: December 29, 2016Applicant: SEIKO EPSON CORPORATIONInventor: Terunao HANAOKA
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Patent number: 9465210Abstract: In an electro-optical device, a light-transmitting cover is disposed in mirrors, and when light is applied toward the mirrors through the light-transmitting cover, the temperature of the light-transmitting cover tires to increase due to the applied light. Here, in the electro-optical device, first metal portions that are in contact with the light-transmitting cover and the element substrate are formed. For this reason, it is possible to release the heat of the light-transmitting cover to a substrate through the first metal portions and the element substrate.Type: GrantFiled: February 8, 2016Date of Patent: October 11, 2016Assignee: SEIKO EPSON CORPORATIONInventor: Terunao Hanaoka
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Publication number: 20160282609Abstract: In an electro-optical device, a mirror that is formed on an element substrate is sealed by a frame shaped spacer and a plate-like light-transmitting cover which is adhered to the spacer. An inorganic barrier layer is formed on an outer face of the spacer and a side face of the light-transmitting cover, and the boundary of the spacer and the light-transmitting cover is covered by the inorganic barrier layer.Type: ApplicationFiled: February 10, 2016Publication date: September 29, 2016Applicant: SEIKO EPSON CORPORATIONInventors: Terunao HANAOKA, Shuhei YAMADA
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Publication number: 20160282610Abstract: In an electro-optical device, a light-transmitting cover is disposed in mirrors, and when light is applied toward the mirrors through the light-transmitting cover, the temperature of the light-transmitting cover tires to increase due to the applied light. Here, in the electro-optical device, first metal portions that are in contact with the light-transmitting cover and the element substrate are formed. For this reason, it is possible to release the heat of the light-transmitting cover to a substrate through the first metal portions and the element substrate.Type: ApplicationFiled: February 8, 2016Publication date: September 29, 2016Applicant: SEIKO EPSON CORPORATIONInventor: Terunao HANAOKA
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Publication number: 20160282606Abstract: In an electro-optical device, a mirror and the like which is formed on an element substrate is sealed using a sealing member. The sealing member is provided with a frame section and a coyer section. In addition, the sealing member is provided on one face of the element substrate so that the mirror is surrounded by the element substrate and the sealing member and such that the mirror is positioned between a portion of the cover section and the element substrate. The sealing member is formed of a light-transmitting member having a frame section and a cover section which are integrally formed, and there is no interface between the frame section and the cover section.Type: ApplicationFiled: February 5, 2016Publication date: September 29, 2016Applicant: SEIKO EPSON CORPORATIONInventors: Suguru UCHIYAMA, Terunao HANAOKA
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Patent number: 9443993Abstract: A method for manufacturing a spectroscopic sensor includes: (a) forming a light receiving element on a semiconductor substrate; (b) forming an angle restricting filter on the semiconductor substrate; and (c) forming a spectroscopic filter on the angle restricting filter. The step (c) of forming a spectroscopic filter includes: (c1) forming a first light transmitting film having a peripheral edge that overlaps a light blocking portion in plan view ox the semiconductor substrate by a lift-off method; and (c2) forming a second light transmitting film at a position spaced apart from the first light transmitting film in plan view of the semiconductor substrate by the lift-off method, the second light transmitting film having a peripheral edge that overlaps the light blocking portion in plan view of the semiconductor substrate.Type: GrantFiled: March 19, 2014Date of Patent: September 13, 2016Assignee: SEIKO EPSON CORPORATIONInventors: Noriyuki Nakamura, Terunao Hanaoka, Kunihiko Yano
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Publication number: 20160148871Abstract: An aspect of the invention is an electronic component including a semiconductor substrate 11 that has an electrode pad 12, a first resin layer 14 and a third resin layer 15 that are located above the semiconductor substrate, a second resin layer 16 that is formed such that at least portions of the second resin layer are located on the first resin layer and the third resin layer, a resin projection 17 that includes the first to third resin layers and is higher than the first resin layer, and a wiring layer 24 that is electrically connected to the electrode pad and lies above the resin projection.Type: ApplicationFiled: November 12, 2015Publication date: May 26, 2016Applicant: SEIKO EPSON CORPORATIONInventor: Terunao HANAOKA
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Publication number: 20140295610Abstract: A method for manufacturing a spectroscopic sensor includes: (a) forming a light receiving element on a semiconductor substrate; (b) forming an angle restricting filter on the semiconductor substrate; and (c) forming a spectroscopic filter on the angle restricting filter. The step (c) of forming a spectroscopic filter includes: (c1) forming a first light transmitting film having a peripheral edge that overlaps a light blocking portion in plan view ox the semiconductor substrate by a lift-off method; and (c2) forming a second light transmitting film at a position spaced apart from the first light transmitting film in plan view of the semiconductor substrate by the lift-off method, the second light transmitting film having a peripheral edge that overlaps the light blocking portion in plan view of the semiconductor substrate.Type: ApplicationFiled: March 19, 2014Publication date: October 2, 2014Applicant: SEIKO EPSON CORPORATIONInventors: Noriyuki NAKAMURA, Terunao HANAOKA, Kunihiko YANO
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Patent number: 8749001Abstract: An electronic component includes: a semiconductor element including a circuit; a vibration element; a first electrode arranged on a first surface of the semiconductor element and connected to the circuit and the vibration element arranged on the first surface side; a second electrode arranged on the first surface; a first wiring board including a first wire connected to the second electrode; and a second wiring board including a second wire to which the first wire is connected. At least a part of an inner side region of an outer contour of the vibration element is arranged to overlap the second electrode in plan view facing the first surface.Type: GrantFiled: September 9, 2011Date of Patent: June 10, 2014Assignee: Seiko Epson CorporationInventors: Terunao Hanaoka, Akinori Shindo, Yasuo Yamasaki, Seiichi Chiba, Toshiyuki Enta, Shuji Kojima
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Publication number: 20140103467Abstract: A sensor device includes a first electrode disposed on active surface side of a silicon substrate, an external connecting terminal electrically connected to the first electrode, at least one stress relaxation layer disposed between the silicon substrate and the external connecting terminal, a connecting terminal disposed on the active surface side of the silicon substrate, and a vibration gyro element having weight sections as mass adjustment sections, the vibration gyro element is held by the silicon substrate due to connection between the connection electrode and the external connecting terminal, and a meltage protection layer formed in an area where the stress relaxation layer and the mass adjustment section overlap each other in a plan view is provided.Type: ApplicationFiled: December 16, 2013Publication date: April 17, 2014Applicant: Seiko Epson CorporationInventors: Seiichi CHIBA, Shuji KOJIMA, Toshiyuki ENTA, Akinori SHINDO, Terunao HANAOKA, Yasuo YAMASAKI
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Patent number: 8631701Abstract: A sensor device includes a first electrode disposed on active surface side of a silicon substrate, an external connecting terminal electrically connected to the first electrode, at least one stress relaxation layer disposed between the silicon substrate and the external connecting terminal, a connecting terminal disposed on the active surface side of the silicon substrate, and a vibration gyro element having weight sections as mass adjustment sections, the vibration gyro element is held by the silicon substrate due to connection between the connection electrode and the external connecting terminal, and a meltage protection layer formed in an area where the stress relaxation layer and the mass adjustment section overlap each other in a plan view is provided.Type: GrantFiled: September 6, 2011Date of Patent: January 21, 2014Assignee: Seiko Epson CorporationInventors: Seiichi Chiba, Shuji Kojima, Toshiyuki Enta, Akinori Shindo, Terunao Hanaoka, Yasuo Yamasaki