Abstract: A dissolved nitrogen concentration monitoring method is used for monitoring a dissolved nitrogen concentration of a cleaning liquid when an ultrasonic wave is irradiated onto the cleaning liquid in which a substrate is dipped. The method includes measuring an amount of increase of a dissolved oxygen concentration of the cleaning liquid resulting from an oxygen molecule generated from a water molecule as a result of a radical reaction caused by ultrasonic wave irradiation. A dissolved nitrogen concentration of the cleaning liquid is calculated from the measured amount of increase of dissolved oxygen concentration based on a predetermined relationship between a dissolved nitrogen concentration and an amount of increase of dissolved oxygen concentration.

Abstract: A cleaning apparatus for cleaning an object includes a cleaning tank holding a cleaning liquid, the object being cleanable by the cleaning liquid. A coupling tank holding an intermediate medium is in contact with a portion of the cleaning tank. An ultrasonic wave generation unit is disposed at the coupling tank and configured to ultrasonically vibrate the cleaning liquid via the intermediate medium. A modification unit is configured to modify a difference in sonic velocity between the cleaning liquid and the intermediate medium.

Abstract: A cleaning method for cleaning an object includes preparing a cleaning liquid. A dissolved nitrogen concentration in the cleaning liquid is adjusted based on a size of a foreign substance to be removed from the object with a highest removal efficiency. The object is dipped in the cleaning liquid while irradiating the cleaning liquid with ultrasonic waves.

Abstract: An ultrasonic cleaning method for cleaning an object in a solution having a gas dissolved therein includes irradiating ultrasonic waves to the solution having a first dissolved gas concentration. While the ultrasonic waves are being irradiated to the solution, a dissolved gas concentration in the solution is changed from the first dissolved gas concentration to a second dissolved gas concentration that is lower than the first dissolved gas concentration such that sonoluminescence occurs.

Abstract: A calibration method for calibrating a measurement device for measuring a concentration of a gas dissolved in a liquid includes varying the concentration of the gas dissolved in the liquid, and predetermining, as a reference concentration, a concentration of the gas at which an intensity of luminescence produced when the liquid is irradiated with ultrasonic waves shows a peak. The liquid is illuminated with ultrasonic waves while varying the concentration of the gas in the liquid and a measured value is measured, using the measurement device, as a concentration of the gas in the liquid when the intensity of the luminescence shows a peak. The measurement device is calibrated based on the measured value and the reference concentration.

Abstract: A micro-bubble generating device is provided with a micro-bubble generating mechanism and a leading conduit provided with a widening section and a tube part, the widening section and the tube part in communication with each other in the leading conduit. The widening section has a hollow shape which has an axis Z as a central axis, and has base surfaces and a peripheral surface, and communicates with a nozzle of the micro-bubble-generating mechanism via one base surface of the widening section, and communicates with the tube part via the other base surface. The cross section orthogonal to a flow axis Z of the micro-bubbles of the widening section is larger than the cross section orthogonal to the flow axis Z of the tube part.

Abstract: A method for the wet-chemical treatment of a semiconductor wafer involves: a) rotating a semiconductor wafer; b) applying a cleaning liquid comprising gas bubbles having a diameter of 100 ?m or less to the rotating wafer such that a liquid film forms on the wafer; c) exposing the rotating semiconductor wafer to a gas atmosphere containing a reactive gas; and d) removing the liquid film from the wafer.

Abstract: A cleaning liquid for an electronic material, in particular, a silicon wafer, uses ultra-pure water or hydrogen water as raw material water, and performs cleaning in combination with ultrasonic irradiation under the presence of hydrogen micro-bubbles. The method enables efficient cleaning and removal of particle components and the like on the wafer surface and prevention of re-contamination.

Abstract: A micro-bubble generating device is provided with a micro-bubble generating mechanism and a leading conduit provided with a widening section and a tube part, the widening section and the tube part in communication with each other in the leading conduit. The widening section has a hollow shape which has an axis Z as a central axis, and has base surfaces and a peripheral surface, and communicates with a nozzle of the micro-bubble-generating mechanism via one base surface of the widening section, and communicates with the tube part via the other base surface. The cross section orthogonal to a flow axis Z of the micro-bubbles of the widening section is larger than the cross section orthogonal to the flow axis Z of the tube part.

Abstract: A wax removal method uniformly removes wax adhering to a wafer surface and reduces the problems of re-adhesion of particles and filter clogging of a cleaning bath during cleaning. The method uses cleaning liquid which contains microbubbles.

Abstract: A method for the wet-chemical treatment of a semiconductor wafer involves: a) rotating a semiconductor wafer; b) applying a cleaning liquid comprising gas bubbles having a diameter of 100 ?m or less to the rotating wafer such that a liquid film forms on the wafer; c) exposing the rotating semiconductor wafer to a gas atmosphere containing a reactive gas; and d) removing the liquid film from the wafer.

Abstract: A cleaning liquid for an electronic material, in particular, a silicon wafer, uses ultra-pure water or hydrogen water as raw material water, and performs cleaning in combination with ultrasonic irradiation under the presence of hydrogen micro-bubbles. The method enables efficient cleaning and removal of particle components and the like on the wafer surface and prevention of re-contamination.

Abstract: A method for the supply of a constant-concentration ozonated water, employs a unit for producing ozonated water and a system for using the ozonated water at a place separated therefrom, interposing an ozonated water circulating line between the ozonated water producing unit and the place for using the ozonated water, causing the interior of the circulating line to circulate the ozonated water so that the flow rate may be constantly fixed at the outlet of the ozonated water producing unit, monitoring the ozone concentration of the ozonated water in the neighborhood of the outlet, adjusting the amount of an ozone gas supplied to the ozonated water producing unit based on the results of the monitoring, further monitoring the amount of the ozonated water used at the place for using the ozonated water, and controlling the amount of the ozonated water to be produced based on the results of this monitoring.

Abstract: A functional water containing a fluorine-containing component obtained by electrolyzing an aqueous solution containing fluoride ion using electrodes having conductive diamonds, a method of producing the same, and a method and an apparatus of rinsing electronic parts using the functional water as a rinsing water. The fluorine-containing component produced by electrolyzing the fluoride ion using the conductive diamond, has stronger rinsing effect than that of a fluorine-containing component obtained by electrolyzing the fluoride ion itself before electrolysis or the fluoride ion using other electrodes. Therefore, an amount of hydrofluoric acid used can greatly be decreased.

Abstract: An apparatus is provided which allows the ozonated water concentration to be retained and avoids being affected by the fluctuation of the amount of the ozonated water to be used.

Abstract: A method is provided forwarding ozonated water efficiently with the loss of ozone lowered. The method for forwarding ozonated water is from an ozonated water producing device to a use point separated from the device. This enables the use point to be supplied with ozonated water having a concentration adjusted as aimed at, by adding a diluting water to a raw material ozonated water in the neighborhood of the ozonated water producing device under a condition inhibiting exposure to an ambient air, adjusting the amount of the diluting water to be added thereby giving the ozonated water a target concentration at the use point, and subsequently guiding the ozonated water through a pipe to the use point.

Abstract: A functional water containing a fluorine-containing component obtained by electrolyzing an aqueous solution containing fluoride ion using electrodes having conductive diamonds, a method of producing the same, and a method and an apparatus of rinsing electronic parts using the functional water as a rinsing water. The fluorine-containing component produced by electrolyzing the fluoride ion using the conductive diamond, has stronger rinsing effect than that of a fluorine-containing component obtained by electrolyzing the fluoride ion itself before electrolysis or the fluoride ion using other electrodes. Therefore, an amount of hydrofluoric acid used can greatly be decreased.