Abstract: An organic light-emitting diode (OLED) display may have an array of organic light-emitting diode pixels that each have OLED layers interposed between a cathode and an anode. Voltage may be applied to the anode of each pixel to control the magnitude of emitted light. The conductivity of the OLED layers may allow leakage current to pass between neighboring anodes in the display. To reduce leakage current and the accompanying cross-talk in a display, a cutting structure may disrupt continuity of the OLED layers. The cutting structure may have two undercuts to disrupt continuity of at least some of the OLED layers. The cutting structure may include a conductive portion that provides a cathode voltage to a cathode layer for the OLED pixels.

Abstract: Pixels in an organic light-emitting diode (OLED) display may be microcavity OLED pixels having optical cavities. The optical cavities may be defined by a partially transparent cathode layer and a reflective anode structure. The anode of the pixels may include both the reflective anode structure and a supplemental anode that is transparent and that is used to tune the thickness of the optical cavity for each pixel. Organic light-emitting diode layers may be formed over the pixels and may have a uniform thickness in each pixel in the display. Pixels may have a conductive spacer between a transparent anode portion and a reflective anode portion, without an intervening dielectric layer. The conductive spacer may be formed from a material such as titanium nitride that is compatible with both anode portions. The transparent anode portions may have varying thicknesses to control the thickness of the optical cavities of the pixels.

Abstract: Pixels in an organic light-emitting diode (OLED) display may be microcavity OLED pixels having optical cavities. The optical cavities may be defined by a partially transparent cathode layer and a reflective anode structure. The anode of the pixels may include both the reflective anode structure and a supplemental anode that is transparent and that is used to tune the thickness of the optical cavity for each pixel. Organic light-emitting diode layers may be formed over the pixels and may have a uniform thickness in each pixel in the display. Pixels may have a conductive spacer between a transparent anode portion and a reflective anode portion, without an intervening dielectric layer. The conductive spacer may be formed from a material such as titanium nitride that is compatible with both anode portions. The transparent anode portions may have varying thicknesses to control the thickness of the optical cavities of the pixels.

Abstract: Pixels in an organic light-emitting diode (OLED) display may be microcavity OLED pixels having optical cavities. The optical cavities may be defined by a partially transparent cathode layer and a reflective anode structure. The anode of the pixels may include both the reflective anode structure and a supplemental anode that is transparent and that is used to tune the thickness of the optical cavity for each pixel. Organic light-emitting diode layers may be formed over the pixels and may have a uniform thickness in each pixel in the display. Pixels may have a conductive spacer between a transparent anode portion and a reflective anode portion, without an intervening dielectric layer. The conductive spacer may be formed from a material such as titanium nitride that is compatible with both anode portions. The transparent anode portions may have varying thicknesses to control the thickness of the optical cavities of the pixels.

Abstract: This disclosure provides systems, methods and apparatus for displaying images. A display apparatus includes display elements formed on a transparent substrate. An elevated aperture layer (EAL) is fabricated over the display elements. An opposing substrate is coupled to the transparent substrate, with the display elements and the EAL positioned between the two substrates. To prevent the opposing substrate from coming into contact with the EAL and potentially damaging the EAL or the display elements, a spacer is built from the same materials used to form the display elements and the EAL. The spacer extends to a distance above the transparent substrate beyond upper surface of the EAL and encapsulates layers of polymer material used in creating a mold for the EAL.

Abstract: This disclosure provides systems, methods, and apparatus for reducing ambient light reflection in a display device having a backplane incorporating low-temperature polycrystalline silicon (LTPS) transistors. Ambient reflection can be reduced by incorporating both conductive and non-conductive light-absorbing materials into the display backplane. A light-absorbing conductive material that can withstand the temperatures generated by laser annealing of LTPS transistor channels can be deposited and patterned such that its footprint substantially coincides with the footprints of the LTPS channels. After the LTPS channels are fabricated, a light-absorbing dielectric material can be deposited with a footprint extending at least below the footprints of other reflective components of the backplane to be positioned above the light-absorbing dielectric material.

Abstract: This disclosure provides systems, methods, and apparatus for improving angular distribution of light and total light throughput in a display device. A display device can include first and second substrates and an array of display elements positioned between the first and second substrates. A first light blocking layer can be positioned on the first substrate and can define a first plurality of apertures. A second light blocking layer can be positioned on the second substrate and can define a first second of apertures. A plurality of reflective sidewalls can be positioned adjacent to at least one edge of a respective aperture of the first plurality of apertures. The reflective sidewalls can help to improve angular distribution of light and total light throughput of the display device.

Abstract: This disclosure provides systems, methods, and apparatus for facilitating repair of inoperable MEMS display elements. A display apparatus can include a plurality of display elements over a substrate. Each display element can have a pixel output interconnect. The display apparatus also can include a plurality of conductive bridges each associated with the pixel output interconnects of a respective pair of adjacent display elements. A first conductive bridge can include an electrical connection between the pixel output interconnects of a first pair of adjacent display elements. A second conductive bridge associated with a second pair of adjacent display elements can be electrically isolated from the pixel output interconnects of at least one display element of the second pair of display elements. A laser or other means can be used to form an electrical connection between the first conductive bridge and the respective pair of adjacent display elements.

Abstract: Implementations described herein relate to display devices including a metal circuit layer embedded in a dielectric layer configured to provide optical properties. Trenches in the dielectric layer may be etched so that the thickness of the metal circuit layer may extend away from other circuit layers. In some implementations, the metal circuit layer can include thick metal routing lines to send data to pixels of the display device. The thick metal routing lines can provide high conductivity, minimal voltage drop, and signal speed that is sufficiently high to write data to many pixels over long distances. In some implementations, the dielectric layer can be configured to absorb light. Examples of such dielectric layers include carbon-doped spin-on-glass dielectric layers.

Abstract: This disclosure provides systems, methods and apparatus including devices that include layers of passivation material covering at least a portion of an exterior surface of a thin film component within a microelectromechanical device. The thin film component may include an electrically conductive layer that connects via an anchor to a conductive surface on a substrate. The disclosure further provides processes for providing a first layer of passivation material on an exterior surface of a thin film component and for electrically connecting that thin film component to a conductive surface on a substrate. The disclosure further provides processes for providing a second layer of passivation material on any exposed surfaces of the thin film component after release of the microelectromechanical device.

Abstract: This disclosure provides systems, methods and apparatus including devices that include a layer of passivation material covering at least a portion of an exterior surface of a thin film component within a microelectomechanical device. The thin film component may include an electrically conductive layer that connects via an anchor to a conductive surface on a substrate. The disclosure further provides processes for providing a layer of passivation material on an exterior surface of a thin film component and for electrically connecting that thin film component to a conductive surface on a substrate.

Abstract: This disclosure provides systems, methods and apparatus relating to electromechanical display devices. In one aspect, a multi-stage interferometric modulator (IMOD) can include a movable reflector that can be moved to different positions to produce different reflected colors. The IMOD can include deformable elements that are coupled to a back side of the movable reflector and provide support to the movable reflector. The deformable elements can provide a restoring force that biases the movable reflector to a resting position. The IMOD can include one or more restoring force modifiers that are configured to increase the restoring force when engaged. The restoring force modifiers can be between the movable reflector and the deformable elements such that the deformable elements contact the restoring force modifiers when the movable reflector is displaced to a contacting position.

Abstract: This disclosure provides systems, methods and apparatus including devices that include a layer of passivation material covering at least a portion of an exterior surface of a thin film component within a microelectomechanical device. The thin film component may include an electrically conductive layer that connects via an anchor to a conductive surface on a substrate. The disclosure further provides processes for providing a layer of passivation material on an exterior surface of a thin film component and for electrically connecting that thin film component to a conductive surface on a substrate.

Abstract: This disclosure provides systems, methods and apparatus including devices that include layers of passivation material covering at least a portion of an exterior surface of a thin film component within a microelectromechanical device. The thin film component may include an electrically conductive layer that connects via an anchor to a conductive surface on a substrate. The disclosure further provides processes for providing a first layer of passivation material on an exterior surface of a thin film component and for electrically connecting that thin film component to a conductive surface on a substrate. The disclosure further provides processes for providing a second layer of passivation material on any exposed surfaces of the thin film component after release of the microelectromechanical device.

Abstract: This disclosure provides systems, methods and apparatus for locating at least a portion of the routing interconnects on the aperture plate to reduce or completely eliminate bezel space, reduce line resistance, reduce line capacitance and increase power savings. In some implementations, one aspect, the routing interconnects may electrically connect row interconnects from an array of pixels to a row voltage driver. In some implementations, a conductive spacer may be coupled between an aperture plate and a light modulator substrate and may electrically connect at least one row interconnect on the light modulator substrate to at least one routing interconnect on the aperture plate. Some or all of the routing interconnects may run through the display area of the electromechanical device. Some or all of the conductive spacers may make contact with a row interconnect and a routing interconnected within the display area, for example via a conductive contact pad.

Abstract: This disclosure provides systems, methods and apparatus for displaying images. A display apparatus includes display elements formed on a transparent substrate. An elevated aperture layer (EAL) is fabricated over the display elements. An opposing substrate is coupled to the transparent substrate, with the display elements and the EAL positioned between the two substrates. To prevent the opposing substrate from coming into contact with the EAL and potentially damaging the EAL or the display elements, a spacer is built from the same materials used to form the display elements and the EAL. The spacer extends to a distance above the transparent substrate beyond upper surface of the EAL and encapsulates layers of polymer material used in creating a mold for the EAL.

Abstract: This disclosure provides systems, methods and apparatus relating to electromechanical display devices. In one aspect, a multi-stage interferometric modulator (IMOD) can include a movable reflector that can be moved to different positions to produce different reflected colors. The IMOD can include deformable elements that are coupled to a back side of the movable reflector and provide support to the movable reflector. The deformable elements can provide a restoring force that biases the movable reflector to a resting position. The IMOD can include one or more restoring force modifiers that are configured to increase the restoring force when engaged. The restoring force modifiers can be between the movable reflector and the deformable elements such that the deformable elements contact the restoring force modifiers when the movable reflector is displaced to a contacting position.

Abstract: Systems, methods and apparatus for processing a substrate are described. A reactor includes a reaction chamber, a composite nozzle, and a reaction chamber outlet. The composite nozzle extends along a side of the chamber and includes a first nozzle and a second nozzle separate from and parallel the first nozzle. Each nozzle includes a body extending along an axis of elongation, an inlet providing communication between at least one source of a common species and an inner volume of the body, and holes spaced along the axis. The holes provide fluid communication between the inner volume and the chamber. The outlet is configured to allow flow from the composite nozzle through the chamber to the outlet. The first nozzle inlet is positioned at a first end of the first body, and the second nozzle inlet is positioned at a second end of the second body. The second end is opposite the first end of the first body.

Abstract: Systems, methods and apparatus for processing a substrate are disclosed. A reactor for processing a substrate includes a reaction chamber, a substrate support, a nozzle, and an outlet. The chamber is configured to process a single substrate on the substrate support. The nozzle extends along an axis of elongation along a side of the chamber. The nozzle includes a nozzle body forming an inner volume, an inlet providing fluid communication between a reactant source and the inner volume, and a plurality of holes spaced along the axis of elongation. The holes provide fluid communication between the inner volume of the nozzle body and the reaction chamber. The nozzle is configured such that fluid conductance through the holes increases with increasing distance from the inlet. The outlet is configured to allow flow from the nozzle through the reaction chamber to the outlet. The flow is parallel to a major surface of the substrate.

Abstract: This disclosure provides systems, methods and apparatus for processing multiple substrates in a processing tool. An apparatus for processing substrates can include a process chamber, a common reactant source, and a common exhaust pump. The process chamber can be configured to process multiple substrates. The process chamber can include a plurality of stacked individual subchambers. Each subchamber can be configured to process one substrate. The common reactant source can be configured to provide reactant to each of the subchambers in parallel. The common exhaust pump can be connected to each of the subchambers.