Abstract: A touchpad includes an operating plate having an operating surface on which an inputting operation is performed, an added feature part attached to a first surface of the operating plate opposite from the operating surface, a sensing unit disposed to face toward at least a portion of the first surface, the portion being at least a part of an area of the first surface other than an area to which the added feature part is attached, a holding member disposed at a predetermined distance apart from a first face of the added feature part, the first face of the added feature part being opposite from a second face thereof facing toward the operating plate, and a support member situated between, and in contact with, the added feature part and the holding member, wherein the support member has a lower Young's modulus than the added feature part and the holding member.

Abstract: A touchpad includes an operating plate having an operating surface on which an inputting operation is performed, an added feature part attached to a first surface of the operating plate opposite from the operating surface, a sensing unit disposed to face toward at least a portion of the first surface, the portion being at least a part of an area of the first surface other than an area to which the added feature part is attached, a holding member disposed at a predetermined distance apart from a first face of the added feature part, the first face of the added feature part being opposite from a second face thereof facing toward the operating plate, and a support member situated between, and in contact with, the added feature part and the holding member, wherein the support member has a lower Young's modulus than the added feature part and the holding member.

Abstract: An input device includes a flexible base, a sensor member that is provided on the surface of the flexible base and can detect the operation position of a finger, connection portions that are provided on a back of the flexible base, a printed circuit board of which an area is smaller than the area of the flexible base and which includes terminal portions on the surface thereof facing the back, and an electronic component that is mounted on a surface of the printed circuit board opposite to the surface of the printed circuit board on which the terminal portions are provided and is electrically connected to the terminal portions. The flexible base and the printed circuit board are bonded to each other with an adhesion layer interposed therebetween so that the connection portions come into contact with the terminal portions.

Abstract: An input device includes a flexible base, a sensor member that is provided on the surface of the flexible base and can detect the operation position of a finger, connection portions that are provided on a back of the flexible base, a printed circuit board of which an area is smaller than the area of the flexible base and which includes terminal portions on the surface thereof facing the back, and an electronic component that is mounted on a surface of the printed circuit board opposite to the surface of the printed circuit board on which the terminal portions are provided and is electrically connected to the terminal portions. The flexible base and the printed circuit board are bonded to each other with an adhesion layer interposed therebetween so that the connection portions come into contact with the terminal portions.

Abstract: A keyboard apparatus permits easier installation of slide retaining pins to a retaining portion and prevents intrusion of dust into the keyboard apparatus from the back surface of a supporting substrate thereof. A first retaining portion has a narrow area and a wide area, and slide retaining pins are latched in the wide area. A dust-proof sheet is provided on the bottom surface of a supporting substrate to cover through holes in the supporting substrate, the through holes resulting from the formation of the first retaining portion and second retaining portions.

Abstract: A keyboard apparatus permits easier installation of slide retaining pins to a retaining portion and prevents intrusion of dust into the keyboard apparatus from the back surface of a supporting substrate thereof. A first retaining portion has a narrow area and a wide area, and slide retaining pins are latched in the wide area. A dust-proof sheet is provided on the bottom surface of a supporting substrate to cover through holes in the supporting substrate, the through holes resulting from the formation of the first retaining portion and second retaining portions.

Abstract: Quick boiling or instant cooking noodles such as udon, soba and hiyamugi or pastas such as spaghetti or macaroni can be produced by a process which includes the steps of heating dry noodles or pastas with either wet or dry heat for a short time to modify only the surface layer portion of the noodles or pastas, removing the surface moisture if the heating is done by wet heat, subsequently contacting the noodle or pasta strings with water to have it absorbed, and reheating the noodles or pastas if the final product is of an instant cooking type. The noodles or pastas thus produced can be prepared by merely boiling them for a short time or by simply pouring in hot water and letting stand for a short time or by just cooking them in a microwave oven; the thus prepared noodles or pastas have the same texture as is obtained by fully boiling dry or raw noodles or pastas.

Abstract: Dry pastas or noodles are heated with either wet or dry heat to convert their surface layer portion to the .alpha.-starch form and, if the heating is done by wet heat, the moisture in the surface of the pasta or noodle strings is removed and, thereafter, the pasta or noodle strings are put into a sealable container, which is then injected with a specified amount of water and sealed, followed by reheating of the pasta or noodle strings. Pastas such as spaghetti and macaroni or noodles such as udon, soba, hiyamugi, kishimen and Chinese noodles can be cooked by just boiling them or a short time or heating them in a microwave oven and yet they develop the same texture as can be attained by fully boiling dry or raw pastas or noodles.

Abstract: Dry pastas or noodles are heated with wet heat for a short time so that only their surface layer portion is converted to the .alpha.-starch; the pastas or noodles are then cooled, dried to remove the surface moisture, immersed in water to have it absorbed and subsequently cooled for a short time. Alternatively, the pastas or noodles that have been dried on the surface are put into a sealable container such as a plastic bag together with a specified amount of water and, thereafter, the container is sealed and the absorption of water is completed during storage or transport of the pastas or noodles. Pastas such as spaghetti and macaroni or noodles such as udon, soba and Chinese noodles can be cooked by boiling for a very short time and yet they develop same texture as can be attained by fully boiling dry or raw pastas or noodles.