Patents by Inventor Teruyoshi Kogure

Teruyoshi Kogure has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220059883
    Abstract: A storage battery device includes: a cell unit including a plurality of battery cells; an electric flow path material that forms a current path through which electric power is supplied from or to the battery cells; and a radiator thermally coupled to the current-path member.
    Type: Application
    Filed: November 4, 2021
    Publication date: February 24, 2022
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Kazuto KURODA, Masahiro SEKINO, Akio NISHIMAKI, Hideo YAMASAKI, Teruyoshi KOGURE, Yosuke SAEKI
  • Patent number: 10604174
    Abstract: A motor control unit that is connected to a motor release switch which includes FETs and is disposed between an inverter and a motor, including: a control section to detect an assist state of the inverter, to turn-ON or turn-OFF a control of the inverter based on a detection result and to detect whether abnormality is existed or not; a motor rotational speed detecting section to detect a motor rotational speed; an energy calculating section to calculate an energy based on the motor rotational speed; a judging section to turn-OFF all of the FETs of the motor release switch when the energy is within an area of safety operation; and a state detecting section to detect whether abnormality is existed or not based on information from an abnormality detecting section that detects abnormality of the sensors and the inverter, wherein the control section turns-ON the control of the inverter when the state detecting section does not detect abnormality and turns-OFF the control of the inverter when the state detecting se
    Type: Grant
    Filed: March 2, 2017
    Date of Patent: March 31, 2020
    Assignee: NSK LTD.
    Inventors: Teruyoshi Kogure, Shigeru Shimakawa, Shin Kumagai, Ryoichi Suzuki
  • Patent number: 10388596
    Abstract: An electronic part mounting heat-dissipating substrate which includes lead frames of wiring pattern shapes formed by conductor plate and an insulating member 130 which is provided between the lead frames 110, wherein a plate surface of a part arrangement surface of said conductor plate and a top surface of said insulating member at a side of said part arrangement surface form one continuous surface, the lead frames have different thicknesses, the thick lead frame 110H is used for a large current signal and the thin lead frame 110L is used for a small current signal, a plate surface of a back surface of the part arrangement surface and a top surface of the insulating member at a side of the back surface at the part arrangement surface-side are formed in an identical plane.
    Type: Grant
    Filed: November 20, 2015
    Date of Patent: August 20, 2019
    Assignee: NSK LTD.
    Inventors: Shigeru Shimakawa, Takashi Sunaga, Takaaki Sekine, Teruyoshi Kogure, Ryoichi Suzuki
  • Patent number: 10259491
    Abstract: An electric power steering apparatus that drive-controls a motor by an inverter, and a motor release-switch is connected between the inverter and the motor, comprising: a control section to detect an assist state on a driving control system and to ON/OFF-switch a control of the inverter based on a detection result; a motor rotational number detecting section to detect a rotational number of the motor; an energy calculating section to calculate an energy of a motor back-EMF and a regenerative current based on the rotational number; and a judging section to compare the energy with an area of safety operation of the motor release-switch and to OFF-switch the d motor release-switch when the energy becomes within the area of safety operation. As occasion demands, the area of safety operation is calculated with the temperature.
    Type: Grant
    Filed: May 8, 2015
    Date of Patent: April 16, 2019
    Assignee: NSK LTD.
    Inventors: Naoto Shinkawa, Shigeru Fukinuki, Shin Kumagai, Shigeru Shimakawa, Teruyoshi Kogure
  • Patent number: 10249558
    Abstract: An electronic heat-dissipating substrate including: lead frames of wiring pattern shapes on a conductor plate; and an insulating member between the lead frames. A plate surface of the lead frames and a top surface of the insulating member form one continuous surface. The part arrangement surface is on both surfaces of the electronic part mounting heat-dissipating substrate, a reductant circuit which includes at least similar dual-system circuit is formed on the electronic part mounting heat-dissipating substrate, a first-system circuit of the dual-system circuit is formed on a first surface of the electronic part mounting heat-dissipating substrate, a second-system circuit of the dual-system circuit is formed on a second surface of the electronic part mounting heat-dissipating substrate, and the common lead frames used in a portion of a circuit wiring are used to the first surface and the second surface of the electronic part mounting heat-dissipating substrate.
    Type: Grant
    Filed: November 20, 2015
    Date of Patent: April 2, 2019
    Assignee: NSK LTD.
    Inventors: Shigeru Shimakawa, Takashi Sunaga, Takaaki Sekine, Teruyoshi Kogure, Ryoichi Suzuki
  • Publication number: 20190092382
    Abstract: A motor control unit that is connected to a motor release switch which includes FETs and is disposed between an inverter and a motor, including: a control section to detect an assist state of the inverter, to turn-ON or turn-OFF a control of the inverter based on a detection result and to detect whether abnormality is existed or not; a motor rotational speed detecting section to detect a motor rotational speed; an energy calculating section to calculate an energy based on the motor rotational speed; a judging section to turn-OFF all of the FETs of the motor release switch when the energy is within an area of safety operation; and a state detecting section to detect whether abnormality is existed or not based on information from an abnormality detecting section that detects abnormality of the sensors and the inverter, wherein the control section turns-ON the control of the inverter when the state detecting section does not detect abnormality and turns-OFF the control of the inverter when the state detecting se
    Type: Application
    Filed: March 2, 2017
    Publication date: March 28, 2019
    Applicant: NSK LTD.
    Inventors: Teruyoshi KOGURE, Shigeru SHIMAKAWA, Shin KUMAGAI, Ryoichi SUZUKI
  • Patent number: 10192818
    Abstract: An electronic part mounting heat-dissipating substrate which includes: a conductor plate which is formed on lead frames of wiring pattern shapes; and an insulating member which is provided between the lead frames of the wiring pattern shapes on the conductor plate; wherein a plate surface of a part arrangement surface of the conductor plate and a top surface of the insulating member at a side of the part arrangement surface form one continuous surface, wherein a plate surface of a back surface of the part arrangement surface of the conductor plate and a top surface of the insulating member at a side of the back surface at the part arrangement surface-side are formed in an identical plane, wherein the substrate is formed in a circular shape.
    Type: Grant
    Filed: November 20, 2015
    Date of Patent: January 29, 2019
    Assignee: NSK LTD.
    Inventors: Shigeru Simakawa, Takashi Sunaga, Takaaki Sekine, Teruyoshi Kogure, Ryoichi Suzuki
  • Publication number: 20180154931
    Abstract: [Problem] An object of the present invention is to provide a motor control apparatus that, with a high reliability, protects the motor release-switch comprising the semiconductor switching elements in small size and an electric power steering apparatus provided the same.
    Type: Application
    Filed: May 8, 2015
    Publication date: June 7, 2018
    Applicant: NSK Ltd.
    Inventors: Naoto SHINKAWA, Shigeru FUKINUKI, Shin KUMAGAI, Shigeru SHIMAKAWA, Teruyoshi KOGURE
  • Publication number: 20170309556
    Abstract: An electronic heat-dissipating substrate including: lead frames of wiring pattern shapes on a conductor plate; and an insulating member between the lead frames. A plate surface of the lead frames and a top surface of the insulating member form one continuous surface. The part arrangement surface is on both surfaces of the electronic part mounting heat-dissipating substrate, a reductant circuit which includes at least similar dual-system circuit is formed on the electronic part mounting heat-dissipating substrate, a first-system circuit of the dual-system circuit is formed on a first surface of the electronic part mounting heat-dissipating substrate, a second-system circuit of the dual-system circuit is formed on a second surface of the electronic part mounting heat-dissipating substrate, and the common lead frames used in a portion of a circuit wiring are used to the first surface and the second surface of the electronic part mounting heat-dissipating substrate.
    Type: Application
    Filed: November 20, 2015
    Publication date: October 26, 2017
    Applicant: NSK Ltd.
    Inventors: Shigeru SHIMAKAWA, Takashi SUNAGA, Takaaki SEKINE, Teruyoshi KOGURE, Ryoichi SUZUKI
  • Publication number: 20170309555
    Abstract: [Problem] An object of the present invention is to provide an electronic part mounting heat-dissipating substrate which enables a circuit for which a power semiconductor in which a large current flows is used to reduce the wiring resistances of a large power operation and improve the heat dissipation.
    Type: Application
    Filed: November 20, 2015
    Publication date: October 26, 2017
    Applicant: NSK LTD.
    Inventors: Shigeru SHIMAKAWA, Takashi SUNAGA, Takaaki SEKINE, Teruyoshi KOGURE, Ryoichi SUZUKI
  • Publication number: 20170294374
    Abstract: An electronic part mounting heat-dissipating substrate which includes: a conductor plate which is formed on lead frames of wiring pattern shapes; and an insulating member which is provided between the lead frames of the wiring pattern shapes on the conductor plate; wherein a plate surface of a part arrangement surface of the conductor plate and a top surface of the insulating member at a side of the part arrangement surface form one continuous surface, wherein a plate surface of a back surface of the part arrangement surface of the conductor plate and a top surface of the insulating member at a side of the back surface at the part arrangement surface-side are formed in an identical plane, wherein the substrate is formed in a circular shape
    Type: Application
    Filed: November 20, 2015
    Publication date: October 12, 2017
    Applicant: NSK Ltd.
    Inventors: Shigeru SIMAKAWA, Takashi SUNAGA, Takaaki SEKINE, Teruyoshi KOGURE, Ryoichi SUZUKI
  • Publication number: 20080298181
    Abstract: According to one embodiment, a control method, includes moving a pickup head to an adjustment position adjusting the quantity of adjustment of focus balance measuring the amplitude of an RF signal in the adjustment position adjusting the focus balance adjustment quantity and measuring the RG signal amplitude a plurality of times estimating the focus balance adjustment quantity at which the RF signal amplitude is maximized from the measured focus balance adjustment quantities and RF signal amplitude moving the pickup head to a different adjustment position estimating the focus balance adjustment quantity at which the RF signal amplitude is maximized in the different adjustment position by adjusting the focus balance adjustment quantity and measuring the RF signal amplitude a plurality of times and adjusting the focus balance adjustment quantity to the focus balance adjustment quantity estimated in the different adjustment position.
    Type: Application
    Filed: May 28, 2008
    Publication date: December 4, 2008
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Masashi Ueno, Teruyoshi Kogure