Abstract: An apparatus for sticking a film to a lead frame has a punch moving up and down for punching a film, a die for placing the film to be punched, and a heating plate for heating a lead frame. A punched film with a predetermined shape is applied on the lead frame and thermally compressed and adhesively attached on a lead portion of the lead frame. The die is additionally provided with a buffer layer on the top plane of the die for relaxing compressing stress but increasing tensile stress put to the film at the punching step so that a punched film is prevented from producing cracks on the cutting end thereof.

Abstract: A method of applying adhesives to leads of lead frame, a nozzle of a dispenser is moved horizontally above one lead and positioned against the lead at a predetermined distance. While keeping adhesives flowing from the nozzle of the dispenser, the dispenser is moved horizontally relative to the leads in a direction from one lead to the next lead so that the distance is kept constant. Then the adhesives are applied to a predetermined portion of each lead. When the application of adhesives to the last lead is complete, the nozzle is raised and moved horizontally. Therefore, the number of upward and downward movements of the nozzle is greatly reduced and the application time can be shortened. Preferably, the distance between the tip of the nozzle and the surface of the lead is to be one-fourth to three times as long as the inside diameter of the nozzle.