Abstract: In various electrohydrodynamic (EHD) fluid mover designs disclosed herein, electric field strength may be locally reduced in peripheral regions of an emitter-to-collector electrode gap. As a result, detrimental accumulations of silica, dust and other airborne contaminants can be reduced on surfaces in such peripheral regions, which may otherwise be susceptible to accumulations and/or difficult to clean or condition. In some cases, localized reduction in electric field near sidewall surfaces can provide desirable localized reductions in susceptibility to contaminant related spark or shunting current paths. In some cases, such as when a field blunting structure is employed and (as a result) a generally more uniform electric field pattern is provided locally, an engineered or purposeful local reduction both electric field strength and ion generation in peripheral regions of an emitter-to-collector electrode gap may be quite desirable.

Abstract: In various electrohydrodynamic (EHD) fluid mover designs disclosed herein, corona current densities may be locally reduced, and in some cases, corona discharges may be locally suppressed in selected portions of an emitter-to-collector electrode gap. In some cases, localized current density reduction or corona suppression near sidewall surfaces can provide desirable localized reductions in ion impingement on the adjacent sidewalls and can provide associated reductions in susceptibility to contaminant related spark or shunting current paths. In some cases, localized current density reduction or corona suppression similarly mitigates susceptibility to contaminant related spark or shunting current paths at sides of a movable electrode conditioning carriage.

Abstract: Provision of an expansion region (e.g., a flow path with increasing cross-section downstream of the EHD air mover) can provide operational benefits in EHD air mover-based thermal management systems. In contrast, such a design would generally be disfavored for conventional mechanical air mover-based systems. In some cases, an expansion chamber or volume may be provided between the EHD air mover and heat transfer surfaces. In some cases, expansion of the flow cross-section may be provided (at least in part) within the heat transfer surface volume itself. In some cases, leading surfaces of heat transfer surface (e.g., heat sink fins) may be shaped, disposed or otherwise presented to EHD motivated flow to reduce “laminarity” of the impinging air flow so as to reduce thermal transfer boundary layer effects and/or to divert flow outward in the flow channel so as to more evenly distribute ozone molecules over catalytic sites.

Abstract: First and second bond elements, e.g., wire bonds, electrically connect a chip contact with one or more substrate contacts of a substrate, and can be arranged so that the second bond element is joined to the first bond element at each end and so that the second bond element does not touch the chip contact or one or more substrate contacts. A third bond element can be joined to ends of the first and second bond elements. In one embodiment, a bond element can have a looped connection, having first and second ends joined at a first contact and a middle portion joined to a second contact.

Abstract: A method of making a microelectronic package includes forming a dielectric encapsulation layer on an in-process unit having a substrate having a first surface and a second surface remote therefrom. A microelectronic element is mounted to the first surface of the substrate, and a plurality of conductive elements exposed at the first surface, at least some of which are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the bases and define an edge surface extending away between the base and the end surface. The encapsulation layer is formed to at least partially cover the first surface and portions of the wire bonds with unencapsulated portions of the wire bonds being defined by at least one of the end surface or a portion of the edge surface that is uncovered thereby.

Abstract: A microelectronic assembly can include a substrate having first and second surfaces each extending in first and second transverse directions, a peripheral edge extending in the second direction, first and second openings extending between the first and second surfaces, and a peripheral region of the second surface extending between the peripheral edge and one of the openings. The assembly can also include a first microelectronic element having a front surface facing the first surface, a rear surface opposite therefrom, and an edge extending between the front and rear surfaces. The assembly can also include a second microelectronic element having a front surface facing the rear surface of the first microelectronic element and projecting beyond the edge of the first microelectronic element. The assembly can also include a plurality of terminals exposed at the second surface, at least one of the terminals being disposed at least partially within the peripheral region.

Abstract: A packaged microelectronic element includes a microelectronic element having a front surface and a plurality of first solid metal posts extending away from the front surface. A substrate has a major surface and a plurality of conductive elements exposed at the major surface and joined to the first solid metal posts. In particular examples, the conductive elements can be bond pads or can be second posts having top surfaces and edge surfaces extending at substantial angles away therefrom. Each first solid metal post includes a base region adjacent the microelectronic element and a tip region remote from the microelectronic element, the base region and tip region having respective concave circumferential surfaces. Each first solid metal post has a horizontal dimension which is a first function of vertical location in the base region and which is a second function of vertical location in the tip region.

Abstract: A microelectronic package can include a substrate having first and second opposed surfaces, and first and second microelectronic elements having front surfaces facing the first surface. The substrate can have a plurality of substrate contacts at the first surface and a plurality of terminals at the second surface. Each microelectronic element can have a plurality of element contacts at the front surface thereof. The element contacts can be joined with corresponding ones of the substrate contacts. The front surface of the second microelectronic element can partially overlie a rear surface of the first microelectronic element and can be attached thereto. The element contacts of the first microelectronic element can be arranged in an area array and are flip-chip bonded with a first set of the substrate contacts. The element contacts of the second microelectronic element can be joined with a second set of the substrate contacts by conductive masses.

Abstract: A microelectronic assembly can include a substrate having oppositely-facing first and second surfaces and a first aperture extending between the first and second surfaces, a first microelectronic element having a surface facing the first surface, a second microelectronic element having a front surface facing the first microelectronic element, signal leads connected to contacts of the second microelectronic element and extending through the first aperture to at least some of a plurality of electrically conductive elements on the substrate, and at least one power regulation component having active circuit elements therein disposed between the first surface of the substrate and the front surface of the second microelectronic element. The first microelectronic element can have another surface remote from the surface of the first microelectronic element, and an edge extending between the surfaces thereof.

Abstract: A package for a microelectronic element, such as a semiconductor chip, has a dielectric mass overlying the package substrate and microelectronic element and has top terminals exposed at the top surface of the dielectric mass. Traces extending along edge surfaces of the dielectric mass desirably connect the top terminals to bottom terminals on the package substrate. The dielectric mass can be formed, for example, by molding or by application of a conformal layer.