Patents by Inventor Tetsuhiro KIRYU

Tetsuhiro KIRYU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabricating semiconductor package, semiconductor chip supporting carrier and chip mounting device
    Patent number: 9530680
    Abstract: In fabricating semiconductor packages, a first supporting unit is supported by a supporting substrate with one surface of an adhesive sheet directed upward, the first supporting unit being constituted by attaching the adhesive sheet having an adhesive layer as the one surface thereof and a non-adhesive layer as the other surface thereof to a frame member; semiconductor chips are mounted on the one surface of the adhesive sheet; on the adhesive sheet, a resin portion containing the semiconductor chips is formed by resin-sealing the semiconductor chips; the first supporting unit is removed from the second supporting unit; the resin portion is stripped from the adhesive sheet; external connection members are formed at the semiconductor chips contained in the resin portion; and portions between the respective semiconductor chips contained in the resin portion are cut to obtain individual semiconductor packages.
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: December 27, 2016
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takatoshi Ishikawa, Tetsuhiro Kiryu, Takashi Nakamura
  • METHOD OF FABRICATING SEMICONDUCTOR PACKAGE, SEMICONDUCTOR CHIP SUPPORTING CARRIER AND CHIP MOUNTING DEVICE
    Publication number: 20160005634
    Abstract: In fabricating semiconductor packages, a first supporting unit is supported by a supporting substrate with one surface of an adhesive sheet directed upward, the first supporting unit being constituted by attaching the adhesive sheet having an adhesive layer as the one surface thereof and a non-adhesive layer as the other surface thereof to a frame member; semiconductor chips are mounted on the one surface of the adhesive sheet; on the adhesive sheet, a resin portion containing the semiconductor chips is formed by resin-sealing the semiconductor chips; the first supporting unit is removed from the second supporting unit; the resin portion is stripped from the adhesive sheet; external connection members are formed at the semiconductor chips contained in the resin portion; and portions between the respective semiconductor chips contained in the resin portion are cut to obtain individual semiconductor packages.
    Type: Application
    Filed: March 14, 2014
    Publication date: January 7, 2016
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takatoshi ISHIKAWA, Tetsuhiro KIRYU, Takashi NAKAMURA