Patents by Inventor Tetsuhiro Nakanishi

Tetsuhiro Nakanishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder, soldering method, and semiconductor device
    Patent number: 8673762
    Abstract: A solder includes Sn (tin), Bi (bismuth) and Zn (zinc), wherein the solder has a Zn content of 0.01% by weight to 0.1% by weight.
    Type: Grant
    Filed: December 7, 2011
    Date of Patent: March 18, 2014
    Assignee: Fujitsu Limited
    Inventors: Toshiya Akamatsu, Nobuhiro Imaizumi, Seiki Sakuyama, Keisuke Uenishi, Tetsuhiro Nakanishi
  • SOLDER, SOLDERING METHOD, AND SEMICONDUCTOR DEVICE
    Publication number: 20120193800
    Abstract: A solder includes Sn (tin), Bi (bismuth) and Zn (zinc), wherein the solder has a Zn content of 0.01% by weight to 0.1% by weight.
    Type: Application
    Filed: December 7, 2011
    Publication date: August 2, 2012
    Applicant: FUJITSU LIMITED
    Inventors: Toshiya Akamatsu, Nobuhiro Imaizumi, Seiki Sakuyama, Keisuke Uenishi, Tetsuhiro Nakanishi