Patents by Inventor Tetsuhiro Ohno
Tetsuhiro Ohno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11842887Abstract: A film formation apparatus of the present invention is a film formation apparatus which performs deposition on a substrate to be processed, and includes a supply device that is disposed in an evacuable vacuum chamber and supplies a deposition material, and a holding device that holds the substrate to be processed during deposition. The holding device includes a deposition preventing plate that covers a region to which the deposition material is adhered in the holding device, a holder that holds the substrate to be processed, and a position setter that sets a position of the substrate to be processed when the deposition preventing plate and the holder sandwich and hold the substrate to be processed. The position setter includes a roller that comes into contact with a peripheral edge end surface portion of the substrate to be processed.Type: GrantFiled: June 28, 2018Date of Patent: December 12, 2023Assignee: ULVAC, INC.Inventors: Toshinori Kaneko, Tetsuhiro Ohno
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Patent number: 11505861Abstract: A substrate guide of the present invention is provided on a carrier frame of a carrier which holds a substrate substantially vertically so that a surface of the substrate is in a substantially vertical direction and supports the substrate by being in contact with at least a peripheral edge end surface portion of the substrate. The substrate guide includes a base attached to the carrier frame, a substrate support which comes into contact with the peripheral edge end surface portion of the substrate held by the carrier and is attached to the base to be movable in a normal direction of the peripheral edge end surface portion in a direction parallel to the surface of the substrate, and a force-applying member which applies a force to the substrate support toward the substrate with respect to the base.Type: GrantFiled: June 7, 2018Date of Patent: November 22, 2022Assignee: ULVAC, INC.Inventors: Toshinori Kaneko, Tetsuhiro Ohno
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Patent number: 11473188Abstract: A sputtering apparatus of the present invention is an apparatus performing deposition on a substrate to be processed using a sputtering method and includes a vacuum chamber, a target provided on a surface of a cathode provided in the vacuum chamber, a substrate holder provided in the vacuum chamber to face the target, and a swing unit that causes the substrate holder to be swingable with respect to the target. A swing region of the substrate to be processed in the substrate holder is set to be smaller than an erosion region of the target.Type: GrantFiled: June 28, 2018Date of Patent: October 18, 2022Assignee: ULVAC, INC.Inventors: Toshinori Kaneko, Tetsuhiro Ohno
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Publication number: 20210296097Abstract: A film formation apparatus of the present invention is a film formation apparatus which performs deposition on a substrate to be processed, and includes a supply device that is disposed in an evacuable vacuum chamber and supplies a deposition material, and a holding device that holds the substrate to be processed during deposition. The holding device includes a deposition preventing plate that covers a region to which the deposition material is adhered in the holding device, a holder that holds the substrate to be processed, and a position setter that sets a position of the substrate to be processed when the deposition preventing plate and the holder sandwich and hold the substrate to be processed. The position setter includes a roller that comes into contact with a peripheral edge end surface portion of the substrate to be processed.Type: ApplicationFiled: June 28, 2018Publication date: September 23, 2021Inventors: Toshinori KANEKO, Tetsuhiro OHNO
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Publication number: 20210285094Abstract: A sputtering apparatus of the present invention is an apparatus performing deposition on a substrate to be processed using a sputtering method and includes a vacuum chamber, a target provided on a surface of a cathode provided in the vacuum chamber, a substrate holder provided in the vacuum chamber to face the target, and a swing unit that causes the substrate holder to be swingable with respect to the target. A swing region of the substrate to be processed in the substrate holder is set to be smaller than an erosion region of the target.Type: ApplicationFiled: June 28, 2018Publication date: September 16, 2021Inventors: Toshinori KANEKO, Tetsuhiro OHNO
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Publication number: 20210277514Abstract: A substrate guide of the present invention is provided on a carrier frame of a carrier which holds a substrate substantially vertically so that a surface of the substrate is in a substantially vertical direction and supports the substrate by being in contact with at least a peripheral edge end surface portion of the substrate. The substrate guide includes a base attached to the carrier frame, a substrate support which comes into contact with the peripheral edge end surface portion of the substrate held by the carrier and is attached to the base to be movable in a normal direction of the peripheral edge end surface portion in a direction parallel to the surface of the substrate, and a force-applying member which applies a force to the substrate support toward the substrate with respect to the base.Type: ApplicationFiled: June 7, 2018Publication date: September 9, 2021Inventors: Toshinori KANEKO, Tetsuhiro OHNO
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Patent number: 10982323Abstract: A first voltage is applied to a first positive electrode and a first negative electrode of an attraction plate in a lying posture to attract a dielectric object to be attracted on the attraction plate. The attraction plate is turned to a stand posture while attracting the dielectric object by a gradient force, and a conductive thin film is grown while applying a second voltage to a second positive electrode and a second negative electrode to generate an electrostatic force. Since the object is continuously attracted, the attraction plate will not detach. After having started attraction by electrostatic force, introduction of heat medium gas between the object and the attraction plate allows for temperature control of the object.Type: GrantFiled: April 20, 2020Date of Patent: April 20, 2021Assignee: ULV AC, INC.Inventors: Ken Maehira, Koh Fuwa, Tomoko Kittaka, Tetsuhiro Ohno, Hirotoshi Sakaue
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Publication number: 20200248301Abstract: A first voltage is applied to a first positive electrode and a first negative electrode of an attraction plate in a lying posture to attract a dielectric object to be attracted on the attraction plate. The attraction plate is turned to a stand posture while attracting the dielectric object by a gradient force, and a conductive thin film is grown while applying a second voltage to a second positive electrode and a second negative electrode to generate an electrostatic force. Since the object is continuously attracted, the attraction plate will not detach. After having started attraction by electrostatic force, introduction of heat medium gas between the object and the attraction plate allows for temperature control of the object.Type: ApplicationFiled: April 20, 2020Publication date: August 6, 2020Applicant: ULVAC, INC.Inventors: Ken MAEHIRA, Koh FUWA, Tomoko KITTAKA, Tetsuhiro OHNO, Hirotoshi SAKAUE
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Patent number: 8693854Abstract: A uniform voltage is applied to loads even to other than a multiple of three loads made of heating lamps connected in parallel to each other, without causing any burden on a primary side. The number of loads is divided into a multiple of three and a multiple of two. A three-phase AC voltage is applied to three primary windings, which are connected as a Y-connection or a ?-connection. Secondary windings, which are each magnetically coupled to a primary winding of a plurality of three-phase transformers and have the same number of turns, are connected with the multiple of three loads.Type: GrantFiled: August 26, 2011Date of Patent: April 8, 2014Assignee: Ulvac, Inc.Inventors: Tsuyoshi Yoshimoto, Katsumi Yamane, Tetsuhiro Ohno, Takahiro Mizoguchi
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Patent number: 8521013Abstract: A technology to control temperature of a large substrate to be heated. A temperature sensing device is disposed lateral to a region where a radiation heater faces a substrate to be heated inside a heating chamber. A heating device has the heating chamber, the radiation heater, a power-supply device, a substrate-holding device, a control device, and the temperature sensing device. A control program is built into the control device, according to which the power-supply device controls the power applied to the radiation heater to generate heat such that the temperature of the temperature measurement substrate detected by a thermocouple of the temperature sensing device becomes a set temperature. Furthermore, a circulation passage is disposed in close contact with the temperature-sensing device, and with a coolant flowing through the circulation passage, the temperature of the temperature measurement substrate can be cooled from the set temperature to an initial temperature.Type: GrantFiled: July 28, 2011Date of Patent: August 27, 2013Assignee: Ulvac, Inc.Inventors: Tsuyoshi Yoshimoto, Katsumi Yamane, Tetsuhiro Ohno, Takahiro Mizoguchi
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Publication number: 20120045190Abstract: A uniform voltage is applied to loads even to other than a multiple of three loads made of heating lamps connected in parallel to each other, without causing any burden on a primary side. The number of loads is divided into a multiple of three and a multiple of two. A three-phase AC voltage is applied to three primary windings, which are connected as a Y-connection or a ?-connection. Secondary windings, which are each magnetically coupled to a primary winding of a plurality of three-phase transformers and have the same number of turns, are connected with the multiple of three loads. The number of turns of the M-seat primary winding of a Scott transformer is divided into two at a midpoint, to which an end of the T-seat primary winding having a number of turns equal to (?3)/2 times that of the M-seat primary winding, is connected and to which the three-phase AC voltage is applied.Type: ApplicationFiled: August 26, 2011Publication date: February 23, 2012Applicant: ULVAC, INC.Inventors: Tsuyoshi YOSHIMOTO, Katsumi YAMANE, Tetsuhiro OHNO, Takahiro MIZOGUCHI
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Publication number: 20120008925Abstract: A technology to control temperature of a large substrate to be heated. A temperature sensing device is disposed lateral to a region where a radiation heater faces a substrate to be heated inside a heating chamber. A heating device has the heating chamber, the radiation heater, a power-supply device, a substrate-holding device, a control device, and the temperature sensing device. A control program is built into the control device, according to which the power-supply device controls the power applied to the radiation heater to generate heat such that the temperature of the temperature measurement substrate detected by a thermocouple of the temperature sensing device becomes a set temperature. Furthermore, a circulation passage is disposed in close contact with the temperature-sensing device, and with a coolant flowing through the circulation passage, the temperature of the temperature measurement substrate can be cooled from the set temperature to an initial temperature.Type: ApplicationFiled: July 28, 2011Publication date: January 12, 2012Applicant: ULVAC, INC.Inventors: Tsuyoshi Yoshimoto, Katsumi Yamane, Tetsuhiro Ohno, Takahiro Mizoguchi