Patents by Inventor Tetsuji Ishikawa

Tetsuji Ishikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20010053430
    Abstract: Rolls easy to be produced are provided. The invention provides a roll which is composed of a main tape cylindrically wound up. The main tape is provided with a first and second holes, respectively, in its winding terminating position and winding initiating position. First and second adhesive tapes are stuck over the holes, respectively. In the bottoms of the first and second holes, adhesive layers of the first and second adhesive tapes are exposed. Therefore, the main tape is stuck on a core at its winding initiating position and on the roll itself at its winding terminating position. Information may be printed on a surface of the first adhesive tape.
    Type: Application
    Filed: June 19, 2001
    Publication date: December 20, 2001
    Applicant: SONY CHEMICALS CORP.
    Inventors: Tetsuji Ishikawa, Rovert Van Den Berg
  • Patent number: 6156462
    Abstract: For instance, when a washing-free yet low-residue type of flux is coated on a solder resist film, soldering can be carried out while no solder balls remain on a circuit substrate.A photosensitive resin composition comprises a photopolymerizable and photosensitive resin having at least one of a carboxyl group and an onium group, a photopolymerizable reactive diluent, a photopolymerization initiator, a thermosetting component, and an inorganic powder having an average particle size of 2 .mu.m to 20 .mu.m. A cured film thereof is used as a solder resist film for circuit substrate fabrication.A washing-free yet low-residue type of flux is so uniformly coated on the solder resist film that soldering can be carried out in the absence of any solder ball.
    Type: Grant
    Filed: August 14, 1998
    Date of Patent: December 5, 2000
    Assignee: Tamura Kaken Co., Ltd.
    Inventors: Makoto Yanagawa, Rinzo Tachibana, Hiroshi Yamamoto, Tetsuji Ishikawa, Tetsuo Kurokawa, Kohichi Ishida
  • Patent number: 6033508
    Abstract: A method of manufacturing a ribbon roll by joining a splice tape to a ribbon, is capable of accomplishing automatization to deal with splice tapes different in length and kind. This method comprises a ribbon supply process, an edit process for joining first and second splice tapes to the ribbon and a take-up process for rolling up the ribbon joined to the first and second splice tapes. In the edit process, the first and second splice tapes are joined by an adhesive tape sticking section and its feeding quantity is adjusted by an accumulator. On the other hand, the ribbon is drawn out by a given length from a supply unit and cut. A rotating bed 42 supporting the cut ribbon is rotated so that the end of the cut ribbon comes into an opposed relation to the end of the first or second splice tape. In this state, the ribbon and the splice tape are joined to each other.
    Type: Grant
    Filed: March 13, 1998
    Date of Patent: March 7, 2000
    Assignee: Sony Chemicals Corp.
    Inventors: Yoshimasa Taniguchi, Akihiro Kaneko, Tetsuji Ishikawa, Seiji Gunji
  • Patent number: 5853957
    Abstract: For instance, when a washing-free yet low-residue type of flux is coated on a solder resist film, soldering can be carried out while no solder balls remain on a circuit substrate.A photosensitive resin composition comprises a photopolymerizable and photosensitive resin having at least one of a carboxyl group and an onium group, a photopolymerizable reactive diluent, a photopolymerization initiator, a thermosetting component, and an inorganic powder having an average particle size of 2 .mu.m to 20 .mu.m. A cured film thereof is used as a solder resist film for circuit substrate fabrication.A washing-free yet low-residue type of flux is so uniformly coated on the solder resist film that soldering can be carried out in the absence of any solder ball.
    Type: Grant
    Filed: May 8, 1996
    Date of Patent: December 29, 1998
    Assignee: Tamura Kaken Co., Ltd
    Inventors: Makoto Yanagawa, Rinzo Tachibana, Hiroshi Yamamoto, Tetsuji Ishikawa, Tetsuo Kurokawa, Kohichi Ishida