Abstract: Disclosed is a protein kinase C enhancer characterized by containing a benzothiophene alkyl ether derivative represented by the general formula below or a salt thereof. (In the formula, R1 and R2 may be the same or different and represent one or more groups selected from a hydrogen atom, a halogen atom, an alkyl group, an aryl group, an aralkyl group, an alkoxy group, an aryloxy group, an alkenyl group, an amino group, a heterocyclic group, an optionally protected amino group, a hydroxyl group, a carboxyl group, an oxo group and the like; R3 represents an alkylamino group, an amino group, a hydroxyl group or the like; and m and n may be the same or different and represent an integer of 1-6.) This protein kinase C enhancer is useful for treatment or prevention of various diseases associated with protein kinase C.

Abstract: Disclosed is a protein kinase C enhancer characterized by containing a benzothiophene alkyl ether derivative represented by the general formula below or a salt thereof. (In the formula, R1 and R2 may be the same or different and represent one or more groups selected from a hydrogen atom, a halogen atom, an alkyl group, an aryl group, an aralkyl group, an alkoxy group, an aryloxy group, an alkenyl group, an amino group, a heterocyclic group, an optionally protected amino group, a hydroxyl group, a carboxyl group, an oxo group and the like; R3 represents an alkylamino group, an amino group, a hydroxyl group or the like; and m and n may be the same or different and represent an integer of 1-6.) This protein kinase C enhancer is useful for treatment or prevention of various diseases associated with protein kinase C.

Abstract: Disclosed is a protein kinase C enhancer characterized by containing a benzothiophene alkyl ether derivative represented by the general formula below or a salt thereof. (In the formula, R1 and R2 may be the same or different and represent one or more groups selected from a hydrogen atom, a halogen atom, an alkyl group, an aryl group, an aralkyl group, an alkoxy group, an aryloxy group, an alkenyl group, an amino group, a heterocyclic group, an optionally protected amino group, a hydroxyl group, a carboxyl group, an oxo group and the like; R3 represents an alkylamino group, an amino group, a hydroxyl group or the like; and m and n may be the same or different and represent an integer of 1-6.) This protein kinase C enhancer is useful for treatment or prevention of various diseases associated with protein kinase C.

Abstract: A fuel-cell separator is formed with a mixture composition of a thermoplastic resin and graphite particles and is provided with grooves for moving fluid, and has a gas permeability coefficient in a range of not less than 1×10−16 mol/m·Pa·s and not more than 1×10−14 mol/m·Pa·s, a volume specific electric resistance in the thickness direction in a range of not less than 1 m&OHgr;·cm and not more than 50 m&OHgr;·cm, and a density in a range of not less than 1.8 g/cm3 and not more than 2.1 g/cm3, which is uniform throughout the grooves and ribs between the grooves.

Abstract: The invention presents an adhesive not impairing components poor in heat resistance in heating and curing, excellent in storage stability, and free from sagging due to heating.

Abstract: Disclosed are a solder and a solder paste used for soldering an electronic part to a circuit board. This solder comprises 2.0 to 3.5 wt % of Ag, 5 to 18 wt % of Bi and Sn for the rest. Alternatively, it further contains at least one element selected from the group consisting of 0.1 to 1.5 wt % of In, 0.1 to 0.7 wt % of Cu and 0.1 to 10 wt % of Zn.

Abstract: The present invention relates to a soldering alloy composed mainly of Sn and free from lead, a toxic substance. Adding a small quantity of Ag to the soldering alloy can make the alloy structure fine, minimize structural changes of the alloy and increase its thermal fatigue resistance. Adding a small quantity of Bi to the soldering alloy lowers the melting point and improves the alloy's wettability. Further, adding a small quantity of Cu restrains the growth of intermetallic compounds in the bonding interface between a copper land and the solder. Furthermore, addition of a small quantity of In improves the elongation property and thermal fatigue resistance of the alloy.

Abstract: Disclosed are a solder and a solder paste used for soldering an electronic part to a circuit board. This solder comprises 2.0 to 3.5 wt % of Ag, 5 to 18 wt % of Bi and Sn for the rest. Alternatively, it further contains at least one element selected from the group consisting of 0.1 to 1.5 wt % of In, 0.1 to 0.7 wt % of Cu and 0.1 to 10 wt % of Zn.

Abstract: Disclosed are a solder and a solder paste used for soldering an electronic part to a circuit board. This solder comprises 2.0 to 3.5 wt % of Ag, 5 to 18 wt % of Bi and Sn for the rest. Alternatively, it further contains at least one element selected from the group consisting of 0.1 to 1.5 wt % of In, 0.1 to 0.7 wt % of Cu and 0.1 to 10 wt % of Zn.

Abstract: Disclosed are a solder and a solder paste used for soldering an electronic part to a circuit board. This solder comprises 2.0 to 3.5 wt % of Ag, 5 to 18 wt % of Bi and Sn for the rest. Alternatively, it further contains at least one element selected from the group consisting of 0.1 to 1.5 wt % of In, 0.1 to 0.7 wt % of Cu and 0.1 to 10 wt % of Zn.

Abstract: The present invention provides a method of manufacturing a small electronic component, by which its yield can be enhanced. The invention comprises the steps of: a component mounting step of mounting a necessary electronic component 2-4 on a substrate 1; a coating layer forming step of forming a coating layer 14 for covering and sealing the substrate 1 in its entirety including the electronic component 2-4 with a coating material having high heat resistance; and a package layer forming step of forming a package layer 17 for covering and sealing a circumference of the coating layer 14 with a thermoplastic resin material 12. In the package layer forming step, adverse effects by the heat from the thermoplastic resin 12 to the electronic components 2-4 and the substrate 1 are inhibited with the coating layer 14.

Abstract: The occurrence of partial chip detachment is reduced by improving wettability for increasing the bonding strength, and by enabling gradual melting of the solder. Solder material, electronic components, and electronic circuit boards with higher performance and higher reliability are offered. The surface of a solder core, lead-frame surface and electrode surface of electronic components, and copper (Cu) land surface of electronic circuit boards are coated with metal element, which is either indium (In) or bismuth (Bi).

Abstract: The present invention relates to a soldering alloy composed mainly of Sn and free from lead which is a toxic substance. An addition of a small quantity of Ag to the soldering alloy can fine the alloy structure, minimize structural changes of the alloy and increase thermal fatigue resistance thereof. An addition of a small quantity of Bi to the soldering alloy lowers the melting point and improves the wettability thereof. Further, an addition of a small quantity of Cu restrains the growth of intermetallic compounds in the bonding interface between a copper land and the solder. Furthermore, an addition of a small quantity of In improves the elongation property and thermal fatigue resistance of the alloy.

Abstract: An electronic circuit substrate is sealed with a sealing material made of thermoplastic resin having a thermal-expansion coefficient close to that of a ceramic substrate by a compound filler dispersedly mixed in the sealing material. The filler includes at least two of milled fiber, glass fiber, and flaked filler.

Abstract: An image reading device includes: a light emitting element for irradiating light on an image surface; a light receiving element for receiving image information in the form of reflected light from the image surface; and light waveguide passages provided between the light emitting element and the image surface and between the light receiving element and the image surface, respectively, and at least the light waveguide passage for the light emitting element is widened at an end surface thereof at the image surface to a width wider than at the end surface at the light emitting element.

Abstract: Disclosed is an image sensor including a circuit board, an array of light emitting elements for emitting light to an image plane, an array of light receiving elements for receiving image information transmitted by reflected light from the image plane, and plural pairs of light wave guides interposed between the light emitting elements and the image plane and between the image plane and the light receiving elements. Both the light emitting elements and the light receiving elements are mounted on the same surface of the circuit board.

Abstract: A method for molding an article integrated with a multi-layer flexible circuit by embedding the circuit in a molding material to be shaped into a certain configuration. A first flexible circuit layer is sandwiched between a fixed mold and a movable mold so as to perform an injection shaping of one side of the molding material. A plurality of flexible circuits from the second layer of flexible circuit and subsequent flexible circuits are sequentially sandwiched between the fixed mold and the movable mold and they are layered one on the other. The movable mold contains a heater. The pattern of each flexible circuit is traced with thermosetting conductive paste which is hardened by the heater of the movable mold when flexible circuits are laminated on each other. Each flexible circuit has a hot-melt type adhesive layer on the rear surface thereof.

Abstract: An optical waveguide device includes a plurality of optical waveguides extending adjacent each other in a sheet-like form. Each of the waveguides includes core portion, an inner cladding layer formed on a periphery of the core portion, and an outer cladding layer formed on a periphery of the inner cladding layer. The inner cladding layer is devoid of light scatterers, whereas the outer cladding layer has light scatterers disposed therein. As light travels within the core portion, such light is efficiently reflected at the surface of the inner cladding layer. The outer cladding layer having the light scatterers disposed therein functions to inhibit crosstalk between adjacent waveguides.

Abstract: An optical waveguide and an image sensor using the same, the optical waveguide comprising a plurality of bar-shaped cores that are aligned in a proper manner, the cores being made of transparent materials with a large refractive index, and a cladding that is disposed around the cores, the cladding being made of materials with a small refractive index that are capable of absorbing or scattering light, wherein part of each of said cores on which irradiated light is incident is uncovered, or part of said cladding on which irradiated light is incident is transparent.

Abstract: A bicycle frame comprising a lug and a pipe to be fitted onto a projection at the lug, annular grooves opposite to each other being disposed at the mutual contact surfaces of the lug projection and pipe, wherein an unidirectional form memory alloy changeable of its outer diameter by heating is disposed in one of the opposite annular grooves, and the projection of the lug and the pipe are bonded at the fitting surfaces by means of a thermosetting adhesive, whereby the bicycle frame is high in safety and superior in productivity and has an improved bonding strength and mechanical juncture.