Patents by Inventor Tetsuo Kida

Tetsuo Kida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210060320
    Abstract: A method for administering a drug to a diseased portion is achieved in a short time and predominantly improves the administration amount (transdermal permeation amount) of the drug in treatment of eyelid disease or palpebral conjunctiva disease. The method for administering a drug for treatment of eyelid disease or palpebral conjunctiva disease includes a step of microneedle perforation by using a microneedle device into a tissue of the eyelid including a meibomian gland of a patient suffering from or suspected of having the disease, in which drug-containing coating is applied to at least a part of a surface of the microneedle, and the drug is a water-soluble drug.
    Type: Application
    Filed: December 27, 2018
    Publication date: March 4, 2021
    Inventors: Teppei OSAKO, Koji KAWAHARA, Takahiro OGAWA, Akiharu ISOWAKI,, Tetsuo KIDA
  • Publication number: 20190167568
    Abstract: [PROBLEMS TO BE SOLVED] To provide a method of advantageously improving a transdermal permeation amount of a steroid drug to diseased portions when treating ophthalmic diseases such as chalazion, blepharitis, allergic conjunctivitis, vernal keratoconjunctivitis, and meibomian gland dysfunction. [SOLUTION] To provide the transdermal drug delivery system for administering a drug via the eyelid skins that have been treated with a microneedle array, featured in that the drug is a water-soluble steroid, and the transdermal drug delivery system is a water-containing base adhesive skin patch.
    Type: Application
    Filed: June 29, 2017
    Publication date: June 6, 2019
    Applicants: SENJU USA, INC., NICHIBAN CO., LTD.
    Inventors: Takahiro OGAWA, Akiharu ISOWAKI, Tetsuo KIDA, Koji KAWAHARA, Emiko TESHIMA, Teppei OSAKO
  • Publication number: 20120288482
    Abstract: The present invention aims to provide a means for effectively and conveniently treating diseases wherein corneal endothelial cells poor in proliferative capacity in vivo are damaged. The present invention provides a therapeutic agent for corneal endothelial dysfunction containing (R)-(+)-N-(1H-pyrrolo [2,3-b]pyridin-4-yl)-4-(1-aminoethyl)benzamide <Y-39983> or a pharmacologically acceptable salt thereof (compound (Ia)) as active ingredient, an agent for promoting adhesion of corneal endothelial cells, containing compound (Ia), a culture medium for corneal endothelial cells, containing the agent for promoting adhesion, an implant for corneal endothelial keratoplasty, containing corneal endothelial cells, scaffold and compound (Ia), and a production method of a corneal endothelial preparation, including a step of cultivating corneal endothelial cells using the culture medium.
    Type: Application
    Filed: December 28, 2010
    Publication date: November 15, 2012
    Applicants: MITSUBISHI TANABE PHARMA CORPORATION, SENJU PHARMACEUTICAL CO., LTD.
    Inventors: Hiroaki Takahashi, Yuji Sakamoto, Tetsuo Kida, Takeshi Tarui
  • Publication number: 20110054031
    Abstract: The disclosure provides methods and ophthalmic NSAIDs as adjuvants to VEGF inhibitors useful for treating retinal disorders, including but not limited to wet AMD, diabetic retinopathy, diabetic macular edema, central retinal vein occlusion, and branch retinal vein occlusion.
    Type: Application
    Filed: February 19, 2009
    Publication date: March 3, 2011
    Applicant: ISTA Pharmaceuticals, Inc.
    Inventors: Tim McNamara, Simon P. Chandler, Tetsuo Kida
  • Patent number: 6874675
    Abstract: A method for manufacturing a printed circuit board includes: washing a land that corresponds to the exposed portion of a copper circuit of a printed circuit board with acidic electrolytic water having a pH of not more than 5 to remove an oxide; treating the land with basic electrolytic water having a pH of not less than 9 to prevent oxidation; and soldering electronic components to the land. The portion to be soldered is treated with the electrolytic water beforehand, thereby improving soldering at low cost without any adverse effect on the environment.
    Type: Grant
    Filed: July 9, 2003
    Date of Patent: April 5, 2005
    Assignees: MEC Company Ltd.
    Inventors: Tetsuo Kida, Samuel Kenneth Liem
  • Publication number: 20040079791
    Abstract: A method for manufacturing a printed circuit board includes: washing a land that corresponds to the exposed portion of a copper circuit of a printed circuit board with acidic electrolytic water having a pH of not more than 5 to remove an oxide; treating the land with basic electrolytic water having a pH of not less than 9 to prevent oxidation; and soldering electronic components to the land. The portion to be soldered is treated with the electrolytic water beforehand, thereby improving soldering at low cost without any adverse effect on the environment.
    Type: Application
    Filed: July 9, 2003
    Publication date: April 29, 2004
    Applicant: MEC COMPANY LTD.
    Inventors: Tetsuo Kida, Samuel Kenneth Liem